LCP Type I LDS
Grade
ASTM D6779 · ISO LCP
LDS = laser direct structuring grade
Contains a laser-activatable additive so plated circuit traces can be written directly on the molded part (antennas, MIDs).
Values for the LDS condition
Other LCP Type I grades and fills
LCP Type I is listed in 10 conditions; see the grade overview at LCP Type I.
Compare all 10 grades and fillsHide
| Grade · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness |
|---|---|---|---|---|---|
Mineral (talc/mica) filled | Choose for low warpage, more isotropic shrinkage and smooth surfaces where fibre read-through is unacceptable. | — | 100 | 1.8 | — |
Wear/bearing grade | Internally lubricated compound for unlubricated bushings, thrust washers and seals running hot. | — | 100 | 1.5 | 86 Shore D |
glass + mineral hybrid filled | Balanced compromise: near-GF stiffness with reduced anisotropy and better dimensional stability on large flat parts. | — | 120 | 1.6 | 90 Shore D |
ESD / conductive compound | Static-dissipative Type I for IC trays, test sockets and semiconductor tooling. | — | 120 | 1.4 | 89 Shore D |
LDSThis page Laser direct structuring grade | Contains a laser-activatable additive so plated circuit traces can be written directly on the molded part (antennas, MIDs). | — | 130 | 1.5 | 90 Shore D |
UFDefault Unfilled / natural | Neat Type I resin for thin-wall electrical parts, film/fibre and where maximum flow and dielectric purity matter. | — | 135 | 2.5 | — |
15 % glass fibre reinforced | Light reinforcement when extra stiffness and HDT are needed but thin-wall flow must stay high. | — | 145 | 2.2 | — |
30 % glass fibre reinforced | The workhorse Type I grade: high HDT (>300 °C) and stiffness for connectors, sockets and reflow-exposed housings. | — | 150 | 1.8 | — |
40 % glass fibre reinforced | Maximum stiffness/HDT structural grade for pumps, valve bodies and heat-exposed brackets. | — | 155 | 1.4 | — |
30 % carbon fibre reinforced | Highest specific stiffness plus static-dissipative behaviour and better heat transfer for wafer handling and precision parts. | — | 190 | 1.2 | — |
What is LCP Type I LDS?
LCP Type I LDS is LCP Type I in the LDS grade — contains a laser-activatable additive so plated circuit traces can be written directly on the molded part (antennas, MIDs). LCP Type I LDS has a tensile strength of 130 MPa (18.9 ksi), stronger than 94% of polymer grades. Elongation at break is 1.5% and the elastic modulus is 16 GPa (2.32 Msi). LCP Type I LDS has a density of 1.75 g/cm³ (0.0632 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 145°C (293 °F). UF is the default condition FabDigit quotes; LDS is available on request or by drawing note.
Advantages
- Stiff — 16 GPa (2.32 Msi), better than 99% of polymer grades
- Conducts heat well — 0.6 W/m·K (0.347 BTU/hr·ft·°F), better than 99% of polymer grades
- Low, predictable mold shrinkage — 0.2%, better than 94% of polymer grades
- High service temperature — 240°C (464 °F), better than 92% of polymer grades
- Low moisture uptake — 0.02%, better than 92% of polymer grades
Limitations
- Limited ductility — 1.5%, worse than 98% of polymer grades
- Heavy — 1.75 g/cm³ (0.0632 lb/in³), worse than 95% of polymer grades
- Limited formability — 8/100, worse than 91% of polymer grades
- High embodied carbon — 9 kg CO₂/kg, worse than 88% of polymer grades
- Difficult to machine — 35/100, worse than 84% of polymer grades
LCP Type I LDS properties
Typical room-temperature values for LCP Type I LDS; 23 are specific to this condition. Other listed values are LCP Type I reference data and may not represent this condition. Bars are the position among polymer grades.
Physical5
LCP Type I LDS has a density of 1.75 g/cm³ (0.0632 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 145°C (293 °F).
Mechanical13
LCP Type I LDS has a tensile strength of 130 MPa (18.9 ksi), stronger than 94% of polymer grades. Elongation at break is 1.5% and the elastic modulus is 16 GPa (2.32 Msi).
Thermal10
LCP Type I LDS is rated for continuous service to 240°C (464 °F). It conducts heat at 0.6 W/m·K (0.347 BTU/hr·ft·°F), better than 99% of polymer grades. Thermal expansion is 8 µm/m·K (4.44 µin/in·°F).
Electrical7
LCP Type I LDS is an electrical insulator with a dielectric strength of 35 kV/mm (889 V/mil) and a resistivity of 1×10¹² Ω·m.
Chemical & Environmental3
Corrosion resistance is excellent (90/100), better than 82% of polymer grades. UV resistance is fair.
Sustainability4
Producing a kilogram of LCP Type I LDS takes about 250 MJ of energy and emits 9 kg of CO₂ — more than 92% of polymer grades. Typical recycled content is 0%.
Manufacturability7
LCP Type I LDS's machinability is fair (35/100, worse than 84% of polymer grades); weldability poor (18/100); formability not recommended (8/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with LCP Type I LDS
Is LCP Type I easy to machine?
Machines easily with sharp carbide/PCD tooling but edges fibrillate and skin peels — use high speed, light feeds, and expect glass/carbon-filled grades to wear tooling fast.
Can LCP Type I be welded?
Not solvent- or hot-plate weldable in practice; use laser or ultrasonic welding with energy directors, or design mechanical/insert-molded joints, and always keep knit lines out of load paths.
Can LCP Type I be formed, bent or molded?
Injection mold at 355–410 °C melt with 60–180 °C tools, corrosion-resistant screws/barrel, fast fill and thin runners; dry 3–4 h at 150 °C and design gates to control the strong flow-direction anisotropy.
What surface finishes work on LCP Type I?
Low surface energy makes painting/adhesive bonding poor without plasma or corona pre-treatment; parts are normally used as-molded, with laser marking or LDS plating where markings/traces are needed.
LCP Type I chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| 4-hydroxybenzoic acid (HBA) unitsmol% of repeat units; rigid-rod backbone | 50 – 80 | 67 |
| 4,4'-biphenol unitsmol% | 10 – 25 | 16.5 |
| terephthalic acid unitsmol% | 10 – 25 | 16.5 |
| glass fiber0 in unfilled default; 15–40 wt% in reinforced variants | ≈ 0 | 0 |
| mineral filler / pigment0–35 wt% depending on variant | ≈ 0 | 0 |
LCP Type I LDS — frequently asked
What is LCP Type I LDS used for?
LCP Type I LDS is typically used for SMT reflow connectors, aerospace brackets, high-temp electrical insulators and semiconductor process components. In short: highest-temperature LCP; reflow-capable thin-wall resin; extreme dimensional stability.
What is the tensile strength of LCP Type I LDS?
LCP Type I LDS has a typical tensile strength of 130 MPa (18.9 ksi) — stronger than 94% of polymer grades. Strength varies by condition: see the 10 listed tempers.
Is LCP Type I LDS easy to machine?
Not especially — machinability is rated fair (35/100, worse than 84% of polymer grades). Machines easily with sharp carbide/PCD tooling but edges fibrillate and skin peels — use high speed, light feeds, and expect glass/carbon-filled grades to wear tooling fast.
Can LCP Type I LDS be welded?
Not readily — weldability is rated poor (18/100). Not solvent- or hot-plate weldable in practice; use laser or ultrasonic welding with energy directors, or design mechanical/insert-molded joints, and always keep knit lines out of load paths.
What surface finishes work on LCP Type I LDS?
Low surface energy makes painting/adhesive bonding poor without plasma or corona pre-treatment; parts are normally used as-molded, with laser marking or LDS plating where markings/traces are needed.
Can LCP Type I LDS be formed, bent or molded?
Injection mold at 355–410 °C melt with 60–180 °C tools, corrosion-resistant screws/barrel, fast fill and thin runners; dry 3–4 h at 150 °C and design gates to control the strong flow-direction anisotropy.
What is the maximum service temperature of LCP Type I LDS?
LCP Type I LDS is rated for continuous use to about 240°C (464 °F), and briefly to 300°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- ASTM D6779 Standard Classification System for Liquid Crystal Polymer Molding and Extrusion Materials — ASTM International (2022)
- Xydar LCP product and processing data — Solvay Specialty Polymers (2023)
- Sumikasuper LCP grade list — Sumitomo Chemical (2023)
- CAMPUS plastics ISO datasheets — LCP — CAMPUS / CWFG (2024)
- Handbook of Thermoplastics — liquid crystal polymers chapter — CRC Press (2016)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.