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PAR BLEND-PC

Matrix

also Ardel, Durel

Cheaper, easier-flowing compromise: better melt processability and clarity than neat PAR, with heat resistance between PC and PAR.

High cost $$$$

Values for the BLEND-PC condition

Other PAR grades and fills

PAR is listed in 5 conditions; see the grade overview at PAR.

Compare all 5 grades and fillsHide
Grade · open for datasheetBest forYield MPaTensile MPaElong. %Hardness
PAR blended with PET/PBT
Blend used to lower cost and melt viscosity and raise chemical/solvent resistance where full PAR transparency is not needed.60653084 Shore D
BLEND-PCThis page
polyarylate–polycarbonate blend
Cheaper, easier-flowing compromise: better melt processability and clarity than neat PAR, with heat resistance between PC and PAR.62668082 Shore D
FR V-0
Use for electrical housings and connectors requiring UL 94 V-0 at thin wall together with high HDT.65683585 Shore D
20 % glass-fiber reinforced
Use where higher stiffness and lower creep at 120–150 °C are needed and transparency is not required.—1004—
30 % glass-fiber reinforced
Highest stiffness/dimensional stability PAR grade for structural and connector parts at elevated temperature.—1202.5—

What is PAR BLEND-PC?

PAR BLEND-PC is PAR in the BLEND-PC condition — cheaper, easier-flowing compromise: better melt processability and clarity than neat PAR, with heat resistance between PC and PAR. PAR BLEND-PC has a yield strength of 62 MPa (8.99 ksi) and a tensile strength of 66 MPa (9.57 ksi) — stronger than 72% of polymer grades. Elongation at break is 80% and the elastic modulus is 2.2 GPa (0.319 Msi). PAR BLEND-PC has a density of 1.2 g/cm³ (0.0434 lb/in³), heavier than 57% of polymer grades. Its glass-transition temperature is 160°C (320 °F).

Advantages

  • Good UV / weathering resistance — 90/100, better than 91% of polymer grades
  • Polishes to a fine finish — 75/100, better than 86% of polymer grades

Limitations

  • High embodied carbon — 7.5 kg CO₂/kg, worse than 79% of polymer grades

PAR BLEND-PC properties

Typical room-temperature values for PAR BLEND-PC; 30 are specific to this condition. Other listed values are PAR reference data and may not represent this condition. Bars are the position among polymer grades.

Physical6

PAR BLEND-PC has a density of 1.2 g/cm³ (0.0434 lb/in³), heavier than 57% of polymer grades. Its glass-transition temperature is 160°C (320 °F).

Density1.2 g/cm³0.04 lb/in³
Glass Transition (Tg)160°C320 °F
Water Absorption (24 h)0.26%
Water Absorption (Saturation)0.8%
Refractive Index1.61
Light Transmission87%

Mechanical16

PAR BLEND-PC has a yield strength of 62 MPa (8.99 ksi) and a tensile strength of 66 MPa (9.57 ksi) — stronger than 72% of polymer grades. Elongation at break is 80% and the elastic modulus is 2.2 GPa (0.319 Msi).

Elastic (Young's) Modulus2.2 GPa0.32 Msi
Shear Modulus0.75 GPa0.11 Msi
Bulk Modulus4 GPa0.51 Msi
Poisson's Ratio0.4
Tensile Strength (Ultimate)66 MPa9.6 ksi
Yield Strength (0.2% offset)62 MPa9 ksi
Elongation at Break80%
Compressive Strength78 MPa11.3 ksi
Compressive Modulus2.2 GPa0.32 Msi
Flexural Strength85 MPa12.3 ksi
Flexural Modulus2.2 GPa0.32 Msi
Shear Strength52 MPa7.5 ksi
Izod Impact, Notched600 J/m11.2 ft·lbf/in
Hardness, Shore D82 Shore D
Hardness, Rockwell M78 HRM
Hardness, Rockwell R120 HRR

Thermal11

PAR BLEND-PC is rated for continuous service to 120°C (248 °F). It conducts heat at 0.2 W/m·K (0.116 BTU/hr·ft·°F), worse than 56% of polymer grades. Thermal expansion is 62 µm/m·K (34.4 µin/in·°F).

Thermal Conductivity0.2 W/m·K0.12 BTU/hr·ft·°F
Specific Heat Capacity1,200 J/kg·K0.29 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)62 µm/m·K34.4 µin/in·°F
Max Service Temperature (continuous)120°C248 °F
Min Service Temperature-50°C-58 °F
Heat Deflection Temp. @ 0.45 MPa150°C302 °F
Heat Deflection Temp. @ 1.8 MPa140°C284 °F
Vicat Softening Point (B50)152°C306 °F
Flammability (UL 94)V-2 to V-0 at 1.6 mm for standard grades (inherently low-flammability aromatic polyester); dedicated FR grades reach V-0 at 0.8 mm
Limiting Oxygen Index28%
Max Service Temperature (short-term)180°C356 °F

Electrical7

PAR BLEND-PC is an electrical insulator with a dielectric strength of 20 kV/mm (508 V/mil) and a resistivity of 1×10¹⁴ Ω·m.

Electrical Resistivity1×10¹⁴ Ω·m3.94×10²¹ µΩ·in
Dielectric Strength20 kV/mm508 V/mil
Dielectric Constant (1 MHz)3
Dissipation Factor (1 MHz)0.012
Volume Resistivity1×10¹⁶ Ω·cm
Surface Resistivity1×10¹⁵ Ω
Comparative Tracking Index (CTI)200 V

Chemical & Environmental3

Corrosion resistance is very good (80/100), worse than 52% of polymer grades. UV resistance is excellent.

Corrosion ResistanceVery good80/100
UV / Weathering ResistanceExcellent90/100
Chemical Resistance SummaryGood resistance to dilute acids, aqueous salts, oils, greases, aliphatic hydrocarbons and hot water; excellent UV/weather stability. Attacked or stress-cracked by chlorinated solvents, ketones, esters, THF and strong alkalis; avoid steam autoclaving under load.

Sustainability4

Producing a kilogram of PAR BLEND-PC takes about 145 MJ of energy and emits 7.5 kg of CO₂ — more than 83% of polymer grades. Typical recycled content is 0%.

Embodied Energy (primary production)145 MJ/kg62,339 BTU/lb
Embodied Carbon (primary production)7.5 kg CO₂/kg
Embodied Water350 L/kg41.9 gal/lb
Typical Recycled Content0%

Manufacturability7

PAR BLEND-PC's machinability is good (60/100, better than 51% of polymer grades); weldability good (55/100); formability fair (45/100).

MachinabilityGood60/100
WeldabilityGood55/100
Formability (cold)Fair45/100
PolishabilityVery good75/100
Mold Shrinkage0.6%
Processing Melt Temperature (typ.)310°C590 °F
Mold Temperature (typ.)130°C266 °F

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with PAR BLEND-PC

Is PAR easy to machine?

Machines like polycarbonate — sharp positive-rake tools, high speed, low feed and air cooling; anneal near 160 °C before tight-tolerance cuts to relieve moulding stress and avoid solvent-induced cracking.

Can PAR be welded?

Joins well by ultrasonic, hot-plate and laser welding; solvent bonding with methylene chloride works but risks stress cracking, so adhesives (epoxy, urethane) are usually preferred.

Can PAR be formed, bent or molded?

High melt viscosity: dry 4–6 h at 130 °C, mould at 320–360 °C melt / 110–150 °C tool with generous gates and runners; extruded sheet thermoforms at 200–230 °C.

What surface finishes work on PAR?

Takes vacuum metallizing, hard-coat and antireflective coatings well thanks to its high heat resistance; polishes to optical clarity but is scratch-soft, so a silicone/acrylic hard coat is normal for lenses.

PAR chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
bisphenol A residuediphenol component of the aromatic polyester backbone45 – 5550
terephthalic acid residuetypically ~50:50 tere/iso for amorphous, transparent behaviour15 – 3525
isophthalic acid residuesuppresses crystallinity, gives clarity15 – 3525
UV/heat stabilizers, mould releaseadditive package, grade dependent0.1 – 20.5

PAR BLEND-PC — frequently asked

What is PAR BLEND-PC used for?

PAR BLEND-PC is typically used for automotive lighting lenses, electrical connectors, solar panel components, sunglass lenses and outdoor sensor housings. In short: most weatherable clear engineering plastic; higher heat than polycarbonate; high-viscosity, hot-tool moulding.

What is the yield strength of PAR BLEND-PC?

PAR BLEND-PC has a typical yield strength of 62 MPa (8.99 ksi) and a tensile strength of 66 MPa (9.57 ksi) — stronger than 72% of polymer grades. Strength varies by condition: see the 5 listed tempers.

Is PAR BLEND-PC easy to machine?

Reasonably — machinability is rated good (60/100, better than 51% of polymer grades). Machines like polycarbonate — sharp positive-rake tools, high speed, low feed and air cooling; anneal near 160 °C before tight-tolerance cuts to relieve moulding stress and avoid solvent-induced cracking.

Can PAR BLEND-PC be welded?

Yes — weldability is rated good (55/100). Joins well by ultrasonic, hot-plate and laser welding; solvent bonding with methylene chloride works but risks stress cracking, so adhesives (epoxy, urethane) are usually preferred.

What surface finishes work on PAR BLEND-PC?

Takes vacuum metallizing, hard-coat and antireflective coatings well thanks to its high heat resistance; polishes to optical clarity but is scratch-soft, so a silicone/acrylic hard coat is normal for lenses.

Can PAR BLEND-PC be formed, bent or molded?

High melt viscosity: dry 4–6 h at 130 °C, mould at 320–360 °C melt / 110–150 °C tool with generous gates and runners; extruded sheet thermoforms at 200–230 °C.

What is the maximum service temperature of PAR BLEND-PC?

PAR BLEND-PC is rated for continuous use to about 120°C (248 °F), and briefly to 180°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Sources

  1. U-Polymer polyarylate resin technical data — Unitika (2020)
  2. Ardel polyarylate resin product data — Amoco / Solvay Advanced Polymers (2002)
  3. Durel polyarylate resin data sheet — Celanese (Hoechst Celanese) (1998)
  4. Engineered Materials Handbook Vol. 2 — Engineering Plastics — ASM International (1988)
  5. CAMPUS plastics datasheets — polyarylate (PAR) — CWFG / CAMPUS (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.