Copper Alloy C75400-H01
Supply condition
UNS C75400
H01 = quarter hard
Standard temper for etched nameplates and formed hardware needing some spring-back control.
Values for the H01 condition
Other C75400 tempers and conditions
C75400 is listed in 10 conditions; see the grade overview at C75400.
Compare all 10 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Annealed to 0.070 mm grain size | Softest commercial anneal — pick for deep drawing, spinning and severe bending of decorative parts. | 120 | 360 | 42 | 70 HB | — |
Annealed to 0.035 mm grain size | General-purpose anneal balancing formability with a fine surface after forming; common etching and stamping stock. | 145 | 380 | 40 | 78 HB | — |
Annealed to 0.025 mm grain size | Fine-grain anneal for moderate forming with smooth (orange-peel-free) polished and etched surfaces. | 165 | 395 | 37 | 85 HB | — |
Annealed to 0.015 mm grain size | Finest anneal — choose for shallow forming plus best etched detail and mirror polish on thin strip. | 190 | 415 | 32 | 95 HB | — |
1/8 hard | Slightly stiffened strip for parts needing flatness and moderate bending without full annealed softness. | 260 | 430 | 25 | 105 HB | — |
H01This page Quarter hard | Standard temper for etched nameplates and formed hardware needing some spring-back control. | 320 | 460 | 20 | 118 HB | — |
H02Default Half hard | Most stocked temper — good strength with enough ductility for 90° bends in quality hardware and trim. | 425 | 515 | 12 | 140 HB | — |
Full hard | Full-hard strip for flat springs, contacts and stiff formed sections with only gentle bends. | 510 | 585 | 5 | 165 HB | — |
Extra hard | Extra-hard temper for high-stiffness spring contacts and shear-cut flat parts; bending must follow the rolling-grain rule. | 570 | 640 | 3 | 185 HB | — |
Spring hard | Spring temper strip for flat springs and diaphragms where maximum elastic limit is needed; stress-relieve after forming. | 605 | 675 | 2 | 12 HRC | 6.3 % IACS |
What is C75400-H01?
C75400-H01 is C75400 supplied in the H01 condition — standard temper for etched nameplates and formed hardware needing some spring-back control. C75400-H01 has a yield strength of 320 MPa (46.4 ksi) and a tensile strength of 460 MPa (66.7 ksi) — stronger than 68% of copper alloy grades. Elongation at break is 20% and the elastic modulus is 125 GPa (18.1 Msi). C75400-H01 has a density of 8.72 g/cm³ (0.315 lb/in³), lighter than 54% of copper alloy grades. It melts at 1,021°C (1,870 °F). H02 is the default condition FabDigit quotes; H01 is available on request or by drawing note.
Advantages
- Polishes to a fine finish — 88/100, better than 97% of copper alloy grades
- Forms and bends easily — 65/100, better than 78% of copper alloy grades
Limitations
- Low electrical conductivity — 6.5 % IACS, worse than 91% of copper alloy grades
- High embodied carbon — 5.2 kg CO₂/kg, worse than 88% of copper alloy grades
- Poor heat conductor — 37 W/m·K (21.4 BTU/hr·ft·°F), worse than 85% of copper alloy grades
C75400-H01 properties
Typical room-temperature values for C75400-H01; 10 are specific to this condition. Other listed values are C75400 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C75400-H01 has a density of 8.72 g/cm³ (0.315 lb/in³), lighter than 54% of copper alloy grades. It melts at 1,021°C (1,870 °F).
Mechanical12
C75400-H01 has a yield strength of 320 MPa (46.4 ksi) and a tensile strength of 460 MPa (66.7 ksi) — stronger than 68% of copper alloy grades. Elongation at break is 20% and the elastic modulus is 125 GPa (18.1 Msi).
Thermal5
C75400-H01 is rated for continuous service to 220°C (428 °F). It conducts heat at 37 W/m·K (21.4 BTU/hr·ft·°F), worse than 85% of copper alloy grades. Thermal expansion is 16.2 µm/m·K (9 µin/in·°F).
Electrical3
C75400-H01 conducts electricity at 6.5 % IACS, worse than 91% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (66/100), better than 64% of copper alloy grades.
Sustainability4
Producing a kilogram of C75400-H01 takes about 78 MJ of energy and emits 5.2 kg of CO₂ — more than 90% of copper alloy grades. Typical recycled content is 40%.
Manufacturability7
C75400-H01's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability fair (45/100); formability good (65/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C75400-H01
Is C75400 easy to machine?
Gummy and abrasive — rating ~20 % of free-cutting brass; use sharp positive-rake carbide, high speed with light feeds and generous soluble-oil coolant.
Can C75400 be welded?
Solders and brazes readily and resistance-welds well; fusion welding is fair at best due to zinc fuming — prefer GTAW with matched Cu-Ni filler and good extraction.
Can C75400 be formed, bent or molded?
Excellent cold formability in OS tempers (deep draw, spin, coin); interanneal 600–750 °C between severe draws and stress-relieve cold-worked parts near 260 °C to avoid ammonia SCC.
What surface finishes work on C75400?
Polishes to a bright silver-white finish; ideal for photochemical etching, bright/electroless nickel, silver or chrome plating, and clear lacquer for tarnish control (not anodizable).
C75400 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Cu | 63.5 – 66.5 | 65 |
| Niincludes Co | 14 – 16 | 15 |
| Mn | ≤ 0.5 | — |
| Fe | ≤ 0.25 | — |
| Pb | ≤ 0.1 | — |
| Znremainder, nominally ~20 % | balance | — |
C75400-H01 — frequently asked
What is C75400-H01 used for?
C75400-H01 is typically used for etching plates, hardware fittings, musical instrument parts and decorative trim. In short: balanced whiteness and formability; preferred etching stock; mid-nickel strip grade.
What is the yield strength of C75400-H01?
C75400-H01 has a typical yield strength of 320 MPa (46.4 ksi) and a tensile strength of 460 MPa (66.7 ksi) — stronger than 68% of copper alloy grades. Strength varies by condition: see the 10 listed tempers.
Is C75400-H01 easy to machine?
Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Gummy and abrasive — rating ~20 % of free-cutting brass; use sharp positive-rake carbide, high speed with light feeds and generous soluble-oil coolant.
Can C75400-H01 be welded?
With care — weldability is rated fair (45/100). Solders and brazes readily and resistance-welds well; fusion welding is fair at best due to zinc fuming — prefer GTAW with matched Cu-Ni filler and good extraction.
What surface finishes work on C75400-H01?
Polishes to a bright silver-white finish; ideal for photochemical etching, bright/electroless nickel, silver or chrome plating, and clear lacquer for tarnish control (not anodizable).
Can C75400-H01 be formed, bent or molded?
Excellent cold formability in OS tempers (deep draw, spin, coin); interanneal 600–750 °C between severe draws and stress-relieve cold-worked parts near 260 °C to avoid ammonia SCC.
What is the maximum service temperature of C75400-H01?
C75400-H01 is rated for continuous use to about 220°C (428 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C75400-H02 and C75400-OS070?
H02 is the default condition — most stocked temper — good strength with enough ductility for 90° bends in quality hardware and trim. OS070: softest commercial anneal — pick for deep drawing, spinning and severe bending of decorative parts. Yield strength is 425 MPa in H02 versus 120 MPa in OS070.
Sources
- ASTM B122/B122M — Copper-Nickel-Tin, Copper-Nickel-Zinc Plate, Sheet, Strip and Rolled Bar — ASTM International (2022)
- ASTM B151/B151M — Copper-Nickel-Zinc and Copper-Nickel Rod and Bar — ASTM International (2021)
- CDA Standard Designation & Properties Database, alloy C75400 — Copper Development Association (2023)
- ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys (nickel silvers) — ASM International (1990)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.