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Copper Alloy C75400-H00

Supply condition

UNS C75400

H00 = 1/8 hard

Slightly stiffened strip for parts needing flatness and moderate bending without full annealed softness.

High cost $$$$

Values for the H00 condition

Other C75400 tempers and conditions

C75400 is listed in 10 conditions; see the grade overview at C75400.

Compare all 10 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed to 0.070 mm grain size
Softest commercial anneal — pick for deep drawing, spinning and severe bending of decorative parts.1203604270 HB—
Annealed to 0.035 mm grain size
General-purpose anneal balancing formability with a fine surface after forming; common etching and stamping stock.1453804078 HB—
Annealed to 0.025 mm grain size
Fine-grain anneal for moderate forming with smooth (orange-peel-free) polished and etched surfaces.1653953785 HB—
Annealed to 0.015 mm grain size
Finest anneal — choose for shallow forming plus best etched detail and mirror polish on thin strip.1904153295 HB—
H00This page
1/8 hard
Slightly stiffened strip for parts needing flatness and moderate bending without full annealed softness.26043025105 HB—
Quarter hard
Standard temper for etched nameplates and formed hardware needing some spring-back control.32046020118 HB—
H02Default
Half hard
Most stocked temper — good strength with enough ductility for 90° bends in quality hardware and trim.42551512140 HB—
Full hard
Full-hard strip for flat springs, contacts and stiff formed sections with only gentle bends.5105855165 HB—
Extra hard
Extra-hard temper for high-stiffness spring contacts and shear-cut flat parts; bending must follow the rolling-grain rule.5706403185 HB—
Spring hard
Spring temper strip for flat springs and diaphragms where maximum elastic limit is needed; stress-relieve after forming.605675212 HRC6.3 % IACS

What is C75400-H00?

C75400-H00 is C75400 supplied in the H00 condition — slightly stiffened strip for parts needing flatness and moderate bending without full annealed softness. C75400-H00 has a yield strength of 260 MPa (37.7 ksi) and a tensile strength of 430 MPa (62.4 ksi) — stronger than 55% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 125 GPa (18.1 Msi). C75400-H00 has a density of 8.72 g/cm³ (0.315 lb/in³), lighter than 54% of copper alloy grades. It melts at 1,021°C (1,870 °F). H02 is the default condition FabDigit quotes; H00 is available on request or by drawing note.

Advantages

  • Polishes to a fine finish — 88/100, better than 97% of copper alloy grades
  • Forms and bends easily — 72/100, better than 82% of copper alloy grades

Limitations

  • Low electrical conductivity — 6.5 % IACS, worse than 91% of copper alloy grades
  • High embodied carbon — 5.2 kg CO₂/kg, worse than 88% of copper alloy grades
  • Poor heat conductor — 37 W/m·K (21.4 BTU/hr·ft·°F), worse than 85% of copper alloy grades

C75400-H00 properties

Typical room-temperature values for C75400-H00; 10 are specific to this condition. Other listed values are C75400 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C75400-H00 has a density of 8.72 g/cm³ (0.315 lb/in³), lighter than 54% of copper alloy grades. It melts at 1,021°C (1,870 °F).

Density8.72 g/cm³0.32 lb/in³
Melting Point (Solidus)1,021°C1,870 °F
Liquidus Temperature1,054°C1,929 °F

Mechanical12

C75400-H00 has a yield strength of 260 MPa (37.7 ksi) and a tensile strength of 430 MPa (62.4 ksi) — stronger than 55% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 125 GPa (18.1 Msi).

Elastic (Young's) Modulus125 GPa18.1 Msi
Shear Modulus47 GPa6.8 Msi
Bulk Modulus122 GPa17.7 Msi
Poisson's Ratio0.33
Tensile Strength (Ultimate)430 MPa62.4 ksi
Yield Strength (0.2% offset)260 MPa37.7 ksi
Elongation at Break25%
Shear Strength305 MPa44.2 ksi
Fatigue Strength (Endurance Limit)172 MPa24.9 ksi
Hardness, Brinell105 HB
Hardness, Rockwell B58 HRB
Hardness, Vickers150 HV

Thermal5

C75400-H00 is rated for continuous service to 230°C (446 °F). It conducts heat at 37 W/m·K (21.4 BTU/hr·ft·°F), worse than 85% of copper alloy grades. Thermal expansion is 16.2 µm/m·K (9 µin/in·°F).

Thermal Conductivity37 W/m·K21.4 BTU/hr·ft·°F
Specific Heat Capacity377 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)16.2 µm/m·K9 µin/in·°F
Max Service Temperature (continuous)230°C446 °F
Min Service Temperature-200°C-328 °F

Electrical3

C75400-H00 conducts electricity at 6.5 % IACS, worse than 91% of copper alloy grades.

Electrical Conductivity6.5 % IACS
Electrical Resistivity2.65×10⁻⁷ Ω·m10.4 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (66/100), better than 64% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.27 V
Corrosion ResistanceGood66/100
Chemical Resistance SummaryGood in atmosphere, fresh and mildly brackish water, dilute alkalis and organics; attacked by oxidizing acids, ferric/cupric salts, sulfides and moist ammonia (SCC and dezincification risk in cold-worked tempers).

Sustainability4

Producing a kilogram of C75400-H00 takes about 78 MJ of energy and emits 5.2 kg of CO₂ — more than 90% of copper alloy grades. Typical recycled content is 40%.

Embodied Energy (primary production)78 MJ/kg33,534 BTU/lb
Embodied Carbon (primary production)5.2 kg CO₂/kg
Embodied Water260 L/kg31.2 gal/lb
Typical Recycled Content40%

Manufacturability7

C75400-H00's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability fair (45/100); formability very good (72/100).

MachinabilityPoor30/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityFair45/100
Formability (cold)Very good72/100
Brazeability / SolderabilityVery good80/100
PolishabilityExcellent88/100
Anodizing Responsen/a — copper alloy; use bright/electroless nickel, silver or chrome plating, or clear lacquer over polished surface

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C75400-H00

Is C75400 easy to machine?

Gummy and abrasive — rating ~20 % of free-cutting brass; use sharp positive-rake carbide, high speed with light feeds and generous soluble-oil coolant.

Can C75400 be welded?

Solders and brazes readily and resistance-welds well; fusion welding is fair at best due to zinc fuming — prefer GTAW with matched Cu-Ni filler and good extraction.

Can C75400 be formed, bent or molded?

Excellent cold formability in OS tempers (deep draw, spin, coin); interanneal 600–750 °C between severe draws and stress-relieve cold-worked parts near 260 °C to avoid ammonia SCC.

What surface finishes work on C75400?

Polishes to a bright silver-white finish; ideal for photochemical etching, bright/electroless nickel, silver or chrome plating, and clear lacquer for tarnish control (not anodizable).

C75400 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Cu63.5 – 66.565
Niincludes Co14 – 1615
Mn≤ 0.5—
Fe≤ 0.25—
Pb≤ 0.1—
Znremainder, nominally ~20 %balance—

C75400-H00 — frequently asked

What is C75400-H00 used for?

C75400-H00 is typically used for etching plates, hardware fittings, musical instrument parts and decorative trim. In short: balanced whiteness and formability; preferred etching stock; mid-nickel strip grade.

What is the yield strength of C75400-H00?

C75400-H00 has a typical yield strength of 260 MPa (37.7 ksi) and a tensile strength of 430 MPa (62.4 ksi) — stronger than 55% of copper alloy grades. Strength varies by condition: see the 10 listed tempers.

Is C75400-H00 easy to machine?

Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Gummy and abrasive — rating ~20 % of free-cutting brass; use sharp positive-rake carbide, high speed with light feeds and generous soluble-oil coolant.

Can C75400-H00 be welded?

With care — weldability is rated fair (45/100). Solders and brazes readily and resistance-welds well; fusion welding is fair at best due to zinc fuming — prefer GTAW with matched Cu-Ni filler and good extraction.

What surface finishes work on C75400-H00?

Polishes to a bright silver-white finish; ideal for photochemical etching, bright/electroless nickel, silver or chrome plating, and clear lacquer for tarnish control (not anodizable).

Can C75400-H00 be formed, bent or molded?

Excellent cold formability in OS tempers (deep draw, spin, coin); interanneal 600–750 °C between severe draws and stress-relieve cold-worked parts near 260 °C to avoid ammonia SCC.

What is the maximum service temperature of C75400-H00?

C75400-H00 is rated for continuous use to about 230°C (446 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C75400-H02 and C75400-OS070?

H02 is the default condition — most stocked temper — good strength with enough ductility for 90° bends in quality hardware and trim. OS070: softest commercial anneal — pick for deep drawing, spinning and severe bending of decorative parts. Yield strength is 425 MPa in H02 versus 120 MPa in OS070.

Sources

  1. ASTM B122/B122M — Copper-Nickel-Tin, Copper-Nickel-Zinc Plate, Sheet, Strip and Rolled Bar — ASTM International (2022)
  2. ASTM B151/B151M — Copper-Nickel-Zinc and Copper-Nickel Rod and Bar — ASTM International (2021)
  3. CDA Standard Designation & Properties Database, alloy C75400 — Copper Development Association (2023)
  4. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys (nickel silvers) — ASM International (1990)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.