Sumikasuper MF (Mineral (talc/mica) filled)
Reinforced grade
ISO LCP
Pick when isotropic shrinkage, smooth surface and low mold/tool abrasion matter more than peak strength.
Values for the MF condition
Other Sumikasuper grades and fills
Sumikasuper is listed in 13 conditions; see the grade overview at Sumikasuper.
Compare all 13 grades and fillsHide
| Grade · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness |
|---|---|---|---|---|---|
MFThis page Mineral (talc/mica) filled | Pick when isotropic shrinkage, smooth surface and low mold/tool abrasion matter more than peak strength. | — | 110 | 1.8 | 87 Shore D |
Internally lubricated wear grade | Choose for unlubricated bushings, thrust washers and sliding parts running hot in chemically aggressive media. | — | 110 | 1.8 | 86 Shore D |
White / high-reflectance LED reflector grade | Choose for LED reflector cups and lamp housings needing high initial whiteness plus resistance to reflow and thermal yellowing. | — | 120 | 1.6 | 88 Shore D |
Glass + mineral hybrid, low-warpage / low-anisotropy | Choose for flat, large or thin plate-like parts where flow/transverse shrinkage difference and warpage must be minimized. | — | 130 | 1.8 | — |
Conductive / static-dissipative | Pick for IC trays, burn-in sockets and semiconductor handling parts requiring controlled surface resistivity at high temperature. | — | 130 | 1.5 | 88 Shore D |
Laser-direct-structuring / plateable grade | Use for molded interconnect devices where circuit traces are laser-activated and copper/nickel/gold plated onto the part. | — | 140 | 1.6 | 88 Shore D |
Low-dielectric high-frequency (5G / mmWave) grade | Pick for antenna carriers, mmWave connectors and high-speed board components where Dk/Df at GHz frequencies is the design driver. | — | 145 | 2 | 87 Shore D |
Unfilled / natural resin | Pick when maximum flow, lowest dielectric loss and self-reinforced anisotropic strength are wanted (film, fiber, thin liners); rarely used for structural molded parts. | — | 150 | 3 | — |
15% glass-fiber reinforced | Choose for very thin-wall connectors where flow must stay high but some stiffness and reduced anisotropy are needed. | — | 150 | 2.6 | — |
High-heat / high-Tm series | Select when parts must survive repeated lead-free reflow, 260–300 °C soldering or continuous service above 240 °C. | — | 155 | 1.8 | — |
GF30Default 30% glass-fiber reinforced | The default workhorse for SMT connectors, FPC sockets, coil bobbins and relay parts needing lead-free reflow survival plus stiffness. | — | 160 | 2.2 | — |
40% glass-fiber reinforced | Use where maximum stiffness, creep resistance and HDT are required and flow length is short. | — | 175 | 1.8 | — |
30% carbon-fiber reinforced | Use for lightweight, very stiff, dimensionally ultra-stable and semi-conductive precision parts (optics mounts, wafer handling). | — | 200 | 1.4 | — |
What is Sumikasuper MF?
Sumikasuper MF is Sumikasuper in the MF grade — pick when isotropic shrinkage, smooth surface and low mold/tool abrasion matter more than peak strength. Sumikasuper MF has a tensile strength of 110 MPa (16 ksi), stronger than 91% of polymer grades. Elongation at break is 1.8% and the elastic modulus is 11 GPa (1.6 Msi). Sumikasuper MF has a density of 1.75 g/cm³ (0.0632 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 120°C (248 °F). GF30 is the default condition FabDigit quotes; MF is available on request or by drawing note.
Advantages
- Conducts heat well — 0.6 W/m·K (0.347 BTU/hr·ft·°F), better than 99% of polymer grades
- Stiff — 11 GPa (1.6 Msi), better than 97% of polymer grades
- Low moisture uptake — 0.02%, better than 92% of polymer grades
- Low, predictable mold shrinkage — 0.3%, better than 90% of polymer grades
- High service temperature — 210°C (410 °F), better than 88% of polymer grades
Limitations
- Limited ductility — 1.8%, worse than 97% of polymer grades
- Heavy — 1.75 g/cm³ (0.0632 lb/in³), worse than 95% of polymer grades
- High embodied carbon — 8.5 kg CO₂/kg, worse than 85% of polymer grades
- Limited formability — 15/100, worse than 79% of polymer grades
Sumikasuper MF properties
Typical room-temperature values for Sumikasuper MF; 22 are specific to this condition. Other listed values are Sumikasuper reference data and may not represent this condition. Bars are the position among polymer grades.
Physical5
Sumikasuper MF has a density of 1.75 g/cm³ (0.0632 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 120°C (248 °F).
Mechanical10
Sumikasuper MF has a tensile strength of 110 MPa (16 ksi), stronger than 91% of polymer grades. Elongation at break is 1.8% and the elastic modulus is 11 GPa (1.6 Msi).
Thermal10
Sumikasuper MF is rated for continuous service to 210°C (410 °F). It conducts heat at 0.6 W/m·K (0.347 BTU/hr·ft·°F), better than 99% of polymer grades. Thermal expansion is 8 µm/m·K (4.44 µin/in·°F).
Electrical7
Sumikasuper MF is an electrical insulator with a dielectric strength of 40 kV/mm (1,016 V/mil) and a resistivity of 1×10¹³ Ω·m.
Chemical & Environmental3
Corrosion resistance is excellent (90/100), better than 82% of polymer grades. UV resistance is fair.
Sustainability4
Producing a kilogram of Sumikasuper MF takes about 160 MJ of energy and emits 8.5 kg of CO₂ — more than 85% of polymer grades. Typical recycled content is 0%.
Manufacturability8
Sumikasuper MF's machinability is good (55/100, worse than 64% of polymer grades); weldability poor (30/100); formability poor (15/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with Sumikasuper MF
Is Sumikasuper easy to machine?
Machinable with sharp PCD/carbide tooling and light feeds, but the fibrillar skin delaminates and glass is abrasive — design for net-shape molding wherever possible.
Can Sumikasuper be welded?
Ultrasonic and vibration welds are weak because of skin-core orientation; laser transmission welding, snap fits, heat staking or adhesive with plasma pretreatment are preferred.
Can Sumikasuper be formed, bent or molded?
Dry 3–4 h at 130–150 °C, mold at 340–370 °C melt / 80–150 °C tool with fast injection and generous venting; fills 0.2 mm walls but weld lines and flash need gate-location and 0.005–0.01 mm tool fit control.
What surface finishes work on Sumikasuper?
Low surface energy means paint and adhesives require plasma or corona pretreatment; LDS grades accept electroless Cu/Ni/Au, and pigmented white grades keep reflectance after reflow.
Sumikasuper chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| p-hydroxybenzoic acid (HBA) unitType I wholly aromatic polyester backbone | 50 – 80 | 65 |
| 4,4'-biphenol unit | 8 – 25 | 17 |
| terephthalic acid unit | 8 – 25 | 18 |
| glass fiberchopped E-glass in the default GF30 variant | 0 – 50 | 30 |
| mineral filler / pigment / lubricantvariant dependent (talc, mica, TiO2, PTFE, carbon) | 0 – 25 | 0 |
Sumikasuper MF — frequently asked
What is Sumikasuper MF used for?
Sumikasuper MF is typically used for mobile phone connectors, camera shutter parts, micro switches and optical pickup components. In short: high dimensional accuracy LCP; thin-wall precision electronics grade; broad filled-grade range.
What is the tensile strength of Sumikasuper MF?
Sumikasuper MF has a typical tensile strength of 110 MPa (16 ksi) — stronger than 91% of polymer grades. Strength varies by condition: see the 13 listed tempers.
Is Sumikasuper MF easy to machine?
Reasonably — machinability is rated good (55/100, worse than 64% of polymer grades). Machinable with sharp PCD/carbide tooling and light feeds, but the fibrillar skin delaminates and glass is abrasive — design for net-shape molding wherever possible.
Can Sumikasuper MF be welded?
Not readily — weldability is rated poor (30/100). Ultrasonic and vibration welds are weak because of skin-core orientation; laser transmission welding, snap fits, heat staking or adhesive with plasma pretreatment are preferred.
What surface finishes work on Sumikasuper MF?
Low surface energy means paint and adhesives require plasma or corona pretreatment; LDS grades accept electroless Cu/Ni/Au, and pigmented white grades keep reflectance after reflow.
Can Sumikasuper MF be formed, bent or molded?
Dry 3–4 h at 130–150 °C, mold at 340–370 °C melt / 80–150 °C tool with fast injection and generous venting; fills 0.2 mm walls but weld lines and flash need gate-location and 0.005–0.01 mm tool fit control.
What is the maximum service temperature of Sumikasuper MF?
Sumikasuper MF is rated for continuous use to about 210°C (410 °F), and briefly to 300°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- Sumikasuper LCP grade list and processing guide — Sumitomo Chemical (2023)
- CAMPUS plastics datasheets — liquid crystal polymer (LCP), glass-reinforced — CAMPUS / CWFG (2024)
- Engineered Materials Handbook Vol. 2: Engineering Plastics — liquid crystal polymers — ASM International (1988)
- ISO 527 / ISO 178 / ISO 75 test methods referenced for tensile, flexural and HDT data — ISO (2019)
- UL 94 Tests for Flammability of Plastic Materials — UL Solutions (2021)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.