Sumikasuper GF-MIN
Reinforced grade
ISO LCP
GF-MIN = glass + mineral hybrid, low-warpage / low-anisotropy
Choose for flat, large or thin plate-like parts where flow/transverse shrinkage difference and warpage must be minimized.
Values for the GF-MIN condition
Other Sumikasuper grades and fills
Sumikasuper is listed in 13 conditions; see the grade overview at Sumikasuper.
Compare all 13 grades and fillsHide
| Grade · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness |
|---|---|---|---|---|---|
Mineral (talc/mica) filled | Pick when isotropic shrinkage, smooth surface and low mold/tool abrasion matter more than peak strength. | — | 110 | 1.8 | 87 Shore D |
Internally lubricated wear grade | Choose for unlubricated bushings, thrust washers and sliding parts running hot in chemically aggressive media. | — | 110 | 1.8 | 86 Shore D |
White / high-reflectance LED reflector grade | Choose for LED reflector cups and lamp housings needing high initial whiteness plus resistance to reflow and thermal yellowing. | — | 120 | 1.6 | 88 Shore D |
GF-MINThis page Glass + mineral hybrid, low-warpage / low-anisotropy | Choose for flat, large or thin plate-like parts where flow/transverse shrinkage difference and warpage must be minimized. | — | 130 | 1.8 | — |
Conductive / static-dissipative | Pick for IC trays, burn-in sockets and semiconductor handling parts requiring controlled surface resistivity at high temperature. | — | 130 | 1.5 | 88 Shore D |
Laser-direct-structuring / plateable grade | Use for molded interconnect devices where circuit traces are laser-activated and copper/nickel/gold plated onto the part. | — | 140 | 1.6 | 88 Shore D |
Low-dielectric high-frequency (5G / mmWave) grade | Pick for antenna carriers, mmWave connectors and high-speed board components where Dk/Df at GHz frequencies is the design driver. | — | 145 | 2 | 87 Shore D |
Unfilled / natural resin | Pick when maximum flow, lowest dielectric loss and self-reinforced anisotropic strength are wanted (film, fiber, thin liners); rarely used for structural molded parts. | — | 150 | 3 | — |
15% glass-fiber reinforced | Choose for very thin-wall connectors where flow must stay high but some stiffness and reduced anisotropy are needed. | — | 150 | 2.6 | — |
High-heat / high-Tm series | Select when parts must survive repeated lead-free reflow, 260–300 °C soldering or continuous service above 240 °C. | — | 155 | 1.8 | — |
GF30Default 30% glass-fiber reinforced | The default workhorse for SMT connectors, FPC sockets, coil bobbins and relay parts needing lead-free reflow survival plus stiffness. | — | 160 | 2.2 | — |
40% glass-fiber reinforced | Use where maximum stiffness, creep resistance and HDT are required and flow length is short. | — | 175 | 1.8 | — |
30% carbon-fiber reinforced | Use for lightweight, very stiff, dimensionally ultra-stable and semi-conductive precision parts (optics mounts, wafer handling). | — | 200 | 1.4 | — |
What is Sumikasuper GF-MIN?
Sumikasuper GF-MIN is Sumikasuper in the GF-MIN grade — choose for flat, large or thin plate-like parts where flow/transverse shrinkage difference and warpage must be minimized. Sumikasuper GF-MIN has a tensile strength of 130 MPa (18.9 ksi), stronger than 94% of polymer grades. Elongation at break is 1.8% and the elastic modulus is 14 GPa (2.03 Msi). Sumikasuper GF-MIN has a density of 1.78 g/cm³ (0.0643 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 120°C (248 °F). GF30 is the default condition FabDigit quotes; GF-MIN is available on request or by drawing note.
Advantages
- Stiff — 14 GPa (2.03 Msi), better than 98% of polymer grades
- Conducts heat well — 0.5 W/m·K (0.289 BTU/hr·ft·°F), better than 98% of polymer grades
- Low moisture uptake — 0.02%, better than 92% of polymer grades
- Low, predictable mold shrinkage — 0.3%, better than 90% of polymer grades
- High service temperature — 220°C (428 °F), better than 89% of polymer grades
Limitations
- Limited ductility — 1.8%, worse than 97% of polymer grades
- Heavy — 1.78 g/cm³ (0.0643 lb/in³), worse than 95% of polymer grades
- High embodied carbon — 8.5 kg CO₂/kg, worse than 85% of polymer grades
- Difficult to machine — 45/100, worse than 78% of polymer grades
Sumikasuper GF-MIN properties
Typical room-temperature values for Sumikasuper GF-MIN; 10 are specific to this condition. Other listed values are Sumikasuper reference data and may not represent this condition. Bars are the position among polymer grades.
Physical5
Sumikasuper GF-MIN has a density of 1.78 g/cm³ (0.0643 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 120°C (248 °F).
Mechanical10
Sumikasuper GF-MIN has a tensile strength of 130 MPa (18.9 ksi), stronger than 94% of polymer grades. Elongation at break is 1.8% and the elastic modulus is 14 GPa (2.03 Msi).
Thermal10
Sumikasuper GF-MIN is rated for continuous service to 220°C (428 °F). It conducts heat at 0.5 W/m·K (0.289 BTU/hr·ft·°F), better than 98% of polymer grades. Thermal expansion is 15 µm/m·K (8.33 µin/in·°F).
Electrical7
Sumikasuper GF-MIN is an electrical insulator with a dielectric strength of 40 kV/mm (1,016 V/mil) and a resistivity of 1×10¹³ Ω·m.
Chemical & Environmental3
Corrosion resistance is excellent (90/100), better than 82% of polymer grades. UV resistance is fair.
Sustainability4
Producing a kilogram of Sumikasuper GF-MIN takes about 160 MJ of energy and emits 8.5 kg of CO₂ — more than 85% of polymer grades. Typical recycled content is 0%.
Manufacturability8
Sumikasuper GF-MIN's machinability is fair (45/100, worse than 78% of polymer grades); weldability poor (30/100); formability poor (20/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with Sumikasuper GF-MIN
Is Sumikasuper easy to machine?
Machinable with sharp PCD/carbide tooling and light feeds, but the fibrillar skin delaminates and glass is abrasive — design for net-shape molding wherever possible.
Can Sumikasuper be welded?
Ultrasonic and vibration welds are weak because of skin-core orientation; laser transmission welding, snap fits, heat staking or adhesive with plasma pretreatment are preferred.
Can Sumikasuper be formed, bent or molded?
Dry 3–4 h at 130–150 °C, mold at 340–370 °C melt / 80–150 °C tool with fast injection and generous venting; fills 0.2 mm walls but weld lines and flash need gate-location and 0.005–0.01 mm tool fit control.
What surface finishes work on Sumikasuper?
Low surface energy means paint and adhesives require plasma or corona pretreatment; LDS grades accept electroless Cu/Ni/Au, and pigmented white grades keep reflectance after reflow.
Sumikasuper chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| p-hydroxybenzoic acid (HBA) unitType I wholly aromatic polyester backbone | 50 – 80 | 65 |
| 4,4'-biphenol unit | 8 – 25 | 17 |
| terephthalic acid unit | 8 – 25 | 18 |
| glass fiberchopped E-glass in the default GF30 variant | 0 – 50 | 30 |
| mineral filler / pigment / lubricantvariant dependent (talc, mica, TiO2, PTFE, carbon) | 0 – 25 | 0 |
Sumikasuper GF-MIN — frequently asked
What is Sumikasuper GF-MIN used for?
Sumikasuper GF-MIN is typically used for mobile phone connectors, camera shutter parts, micro switches and optical pickup components. In short: high dimensional accuracy LCP; thin-wall precision electronics grade; broad filled-grade range.
What is the tensile strength of Sumikasuper GF-MIN?
Sumikasuper GF-MIN has a typical tensile strength of 130 MPa (18.9 ksi) — stronger than 94% of polymer grades. Strength varies by condition: see the 13 listed tempers.
Is Sumikasuper GF-MIN easy to machine?
Reasonably — machinability is rated fair (45/100, worse than 78% of polymer grades). Machinable with sharp PCD/carbide tooling and light feeds, but the fibrillar skin delaminates and glass is abrasive — design for net-shape molding wherever possible.
Can Sumikasuper GF-MIN be welded?
Not readily — weldability is rated poor (30/100). Ultrasonic and vibration welds are weak because of skin-core orientation; laser transmission welding, snap fits, heat staking or adhesive with plasma pretreatment are preferred.
What surface finishes work on Sumikasuper GF-MIN?
Low surface energy means paint and adhesives require plasma or corona pretreatment; LDS grades accept electroless Cu/Ni/Au, and pigmented white grades keep reflectance after reflow.
Can Sumikasuper GF-MIN be formed, bent or molded?
Dry 3–4 h at 130–150 °C, mold at 340–370 °C melt / 80–150 °C tool with fast injection and generous venting; fills 0.2 mm walls but weld lines and flash need gate-location and 0.005–0.01 mm tool fit control.
What is the maximum service temperature of Sumikasuper GF-MIN?
Sumikasuper GF-MIN is rated for continuous use to about 220°C (428 °F), and briefly to 300°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- Sumikasuper LCP grade list and processing guide — Sumitomo Chemical (2023)
- CAMPUS plastics datasheets — liquid crystal polymer (LCP), glass-reinforced — CAMPUS / CWFG (2024)
- Engineered Materials Handbook Vol. 2: Engineering Plastics — liquid crystal polymers — ASM International (1988)
- ISO 527 / ISO 178 / ISO 75 test methods referenced for tensile, flexural and HDT data — ISO (2019)
- UL 94 Tests for Flammability of Plastic Materials — UL Solutions (2021)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.