LCP-GF30 LDS
Grade
ASTM D6779
LDS = laser direct structuring / platable 30 % GF grade
For molded interconnect devices and antenna carriers where circuit traces are laser-activated and copper-plated on the molded part.
Values for the LDS condition
Other LCP-GF30 grades and fills
LCP-GF30 is listed in 6 conditions; see the grade overview at LCP-GF30.
Compare all 6 grades and fillsHide
| Grade · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness |
|---|---|---|---|---|---|
Low-warpage glass + mineral filled | Use for flat, large or tight-tolerance parts where anisotropic shrinkage and warpage of pure GF grades is unacceptable. | — | 140 | 2.2 | 92 HRM |
High-heat Type I 30% GF LCP | Pick when lead-free SMT reflow at 260–280 °C or continuous 240 °C service is required (Xydar / Sumikasuper class). | — | 145 | 2 | — |
Conductive / static-dissipative 30 % filled grade | Use for IC test sockets, burn-in hardware and wafer/chip handling parts requiring 10⁴–10⁹ Ω surface resistivity. | — | 145 | 1.8 | 92 HRM |
LDSThis page Laser direct structuring / platable 30 % GF grade | For molded interconnect devices and antenna carriers where circuit traces are laser-activated and copper-plated on the molded part. | — | 150 | 2 | 92 HRM |
low dielectric loss 30 % filled grade for mmWave / 5G | Select for antenna housings, 5G connectors and mmWave modules where Df at 10–77 GHz must stay below ~0.004. | — | 160 | 2.5 | 89 HRM |
High-flow thin-wall 30 % GF grade | Choose for 0.15–0.3 mm wall fine-pitch connectors and long flow-length parts where fill pressure limits the standard grade. | — | 165 | 2.5 | 90 HRM |
What is LCP-GF30 LDS?
LCP-GF30 LDS is LCP-GF30 in the LDS grade — for molded interconnect devices and antenna carriers where circuit traces are laser-activated and copper-plated on the molded part. LCP-GF30 LDS has a tensile strength of 150 MPa (21.8 ksi), stronger than 95% of polymer grades. Elongation at break is 2% and the elastic modulus is 14 GPa (2.03 Msi). LCP-GF30 LDS has a density of 1.72 g/cm³ (0.0621 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 120°C (248 °F).
Advantages
- Stiff — 14 GPa (2.03 Msi), better than 98% of polymer grades
- Conducts heat well — 0.5 W/m·K (0.289 BTU/hr·ft·°F), better than 98% of polymer grades
- Low, predictable mold shrinkage — 0.2%, better than 94% of polymer grades
- Low moisture uptake — 0.02%, better than 92% of polymer grades
- High service temperature — 220°C (428 °F), better than 89% of polymer grades
Limitations
- Limited ductility — 2%, worse than 95% of polymer grades
- Heavy — 1.72 g/cm³ (0.0621 lb/in³), worse than 95% of polymer grades
- Limited formability — 8/100, worse than 91% of polymer grades
- High embodied carbon — 9 kg CO₂/kg, worse than 88% of polymer grades
- Difficult to machine — 45/100, worse than 78% of polymer grades
LCP-GF30 LDS properties
Typical room-temperature values for LCP-GF30 LDS; 22 are specific to this condition. Other listed values are LCP-GF30 reference data and may not represent this condition. Bars are the position among polymer grades.
Physical5
LCP-GF30 LDS has a density of 1.72 g/cm³ (0.0621 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 120°C (248 °F).
Mechanical11
LCP-GF30 LDS has a tensile strength of 150 MPa (21.8 ksi), stronger than 95% of polymer grades. Elongation at break is 2% and the elastic modulus is 14 GPa (2.03 Msi).
Thermal10
LCP-GF30 LDS is rated for continuous service to 220°C (428 °F). It conducts heat at 0.5 W/m·K (0.289 BTU/hr·ft·°F), better than 98% of polymer grades. Thermal expansion is 12 µm/m·K (6.67 µin/in·°F).
Electrical7
LCP-GF30 LDS is an electrical insulator with a dielectric strength of 35 kV/mm (889 V/mil) and a resistivity of 1×10¹² Ω·m.
Chemical & Environmental3
Corrosion resistance is excellent (90/100), better than 82% of polymer grades. UV resistance is fair.
Sustainability4
Producing a kilogram of LCP-GF30 LDS takes about 180 MJ of energy and emits 9 kg of CO₂ — more than 87% of polymer grades. Typical recycled content is 0%.
Manufacturability7
LCP-GF30 LDS's machinability is fair (45/100, worse than 78% of polymer grades); weldability poor (25/100); formability not recommended (8/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with LCP-GF30 LDS
Is LCP-GF30 easy to machine?
Machines cleanly with sharp PCD or carbide tools at high speed and light feed, but glass fiber is abrasive and the skin layer fibrillates — avoid dull tools and use climb milling with air cooling.
Can LCP-GF30 be welded?
Weak weld/knit lines and poor ultrasonic welding due to the oriented skin; use laser transmission welding, adhesive bonding with surface treatment, or design mechanical/insert-molded joints instead.
Can LCP-GF30 be formed, bent or molded?
Dry 4 h at 140–150 °C, mold at 300–340 °C (Type I 350–400 °C) with 60–150 °C tools, high injection speed and small gates; extremely low viscosity fills 0.2 mm walls but flashes easily, so vent and clamp precisely and orient gates to control fiber-direction shrinkage.
What surface finishes work on LCP-GF30?
Accepts vacuum metallizing, electroless Cu/Ni plating (LDS or etched grades) and laser marking; painting/printing needs plasma or flame pretreatment because of the low-energy, chemically inert surface.
LCP-GF30 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| glass fiberchopped E-glass, silane sized, 10–13 µm diameter | 28 – 32 | 30 |
| pigments / processing additivescarbon black or TiO2, lubricant, nucleant; no halogen FR needed | 0 – 2 | 0.5 |
| aromatic copolyester LCP resin (HBA / HNthermotropic liquid-crystal polyester matrix; Type II (HBA/HNA) or Type I (HBA/biphenol/terephthalic) | ≥ 68 (balance) | — |
LCP-GF30 LDS — frequently asked
What is LCP-GF30 LDS used for?
LCP-GF30 LDS is typically used for structural electrical connectors, reflow-compatible surface-mount parts, precision brackets and chemical-resistant fittings. In short: stiffest general-purpose LCP; reduced anisotropy versus unfilled; brand-independent 30 % glass grade.
What is the tensile strength of LCP-GF30 LDS?
LCP-GF30 LDS has a typical tensile strength of 150 MPa (21.8 ksi) — stronger than 95% of polymer grades. Strength varies by condition: see the 6 listed tempers.
Is LCP-GF30 LDS easy to machine?
Reasonably — machinability is rated fair (45/100, worse than 78% of polymer grades). Machines cleanly with sharp PCD or carbide tools at high speed and light feed, but glass fiber is abrasive and the skin layer fibrillates — avoid dull tools and use climb milling with air cooling.
Can LCP-GF30 LDS be welded?
Not readily — weldability is rated poor (25/100). Weak weld/knit lines and poor ultrasonic welding due to the oriented skin; use laser transmission welding, adhesive bonding with surface treatment, or design mechanical/insert-molded joints instead.
What surface finishes work on LCP-GF30 LDS?
Accepts vacuum metallizing, electroless Cu/Ni plating (LDS or etched grades) and laser marking; painting/printing needs plasma or flame pretreatment because of the low-energy, chemically inert surface.
Can LCP-GF30 LDS be formed, bent or molded?
Dry 4 h at 140–150 °C, mold at 300–340 °C (Type I 350–400 °C) with 60–150 °C tools, high injection speed and small gates; extremely low viscosity fills 0.2 mm walls but flashes easily, so vent and clamp precisely and orient gates to control fiber-direction shrinkage.
What is the maximum service temperature of LCP-GF30 LDS?
LCP-GF30 LDS is rated for continuous use to about 220°C (428 °F), and briefly to 280°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- Vectra LCP Product and Processing Guide (A130 series) — Celanese (2023)
- Zenite LCP grade data (6130 series) — Celanese/DuPont (2022)
- Sumikasuper LCP E-series technical data — Sumitomo Chemical (2023)
- Xydar LCP G-series datasheet — Solvay (2022)
- CAMPUS ISO 10350 single-point data, LCP GF30 compounds — CAMPUS Plastics (2024)
- Engineered Materials Handbook Vol. 2: Engineering Plastics — ASM International (1988)
- UL 94 Flammability of Plastic Materials — Underwriters Laboratories (2020)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.