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MFA HP

Other

also Neoflon MFA, Hyflon MFA

HP = high-purity semiconductor grade

Pick for UPW and wet-etch chemical delivery where metal-ion and fluoride extractables must be minimized; same mechanicals, tighter cleanliness control.

High cost $$$$

Values for the HP condition

Other MFA grades and fills

MFA is listed in 3 conditions; see the grade overview at MFA.

Compare all 3 grades and fillsHide
Grade · open for datasheetBest forYield MPaTensile MPaElong. %Hardness
Aqueous dispersion
Pick for spray/dip fluoropolymer coatings, glass-cloth impregnation and thin barrier layers on metal, cured above the melting point.122230055 Shore D
High-flow injection molding grade
Pick for thin-wall or complex injection-molded fittings, valve bodies and semiconductor fluid-handling parts needing easy cavity fill.132533059 Shore D
HPThis page
High-purity semiconductor grade
Pick for UPW and wet-etch chemical delivery where metal-ion and fluoride extractables must be minimized; same mechanicals, tighter cleanliness control.132840058 Shore D

What is MFA HP?

MFA HP is MFA in the HP condition — pick for UPW and wet-etch chemical delivery where metal-ion and fluoride extractables must be minimized; same mechanicals, tighter cleanliness control. MFA HP has a yield strength of 13 MPa (1.89 ksi) and a tensile strength of 28 MPa (4.06 ksi) — weaker than 86% of polymer grades. Elongation at break is 400% and the elastic modulus is 0.55 GPa (0.0798 Msi). MFA HP has a density of 2.14 g/cm³ (0.0773 lb/in³), heavier than 98% of polymer grades.

Advantages

  • Good corrosion resistance — 99/100, better than 100% of polymer grades
  • Good UV / weathering resistance — 98/100, better than 99% of polymer grades
  • High service temperature — 240°C (464 °F), better than 92% of polymer grades
  • Low moisture uptake — 0.02%, better than 92% of polymer grades
  • Ductile — tolerates forming and impact — 400%, better than 86% of polymer grades

Limitations

  • High mold shrinkage — 4%, worse than 99% of polymer grades
  • Heavy — 2.14 g/cm³ (0.0773 lb/in³), worse than 98% of polymer grades
  • High embodied carbon — 13 kg CO₂/kg, worse than 93% of polymer grades
  • Low strength — 13 MPa (1.89 ksi), worse than 86% of polymer grades

MFA HP properties

Typical room-temperature values for MFA HP; 23 are specific to this condition. Other listed values are MFA reference data and may not represent this condition. Bars are the position among polymer grades.

Physical6

MFA HP has a density of 2.14 g/cm³ (0.0773 lb/in³), heavier than 98% of polymer grades.

Density2.14 g/cm³0.08 lb/in³
Melting Temperature (Tm)285°C545 °F
Water Absorption (24 h)0.02%
Water Absorption (Saturation)0.03%
Refractive Index1.355
Light Transmission90%

Mechanical9

MFA HP has a yield strength of 13 MPa (1.89 ksi) and a tensile strength of 28 MPa (4.06 ksi) — weaker than 86% of polymer grades. Elongation at break is 400% and the elastic modulus is 0.55 GPa (0.0798 Msi).

Elastic (Young's) Modulus0.55 GPa0.08 Msi
Poisson's Ratio0.44
Tensile Strength (Ultimate)28 MPa4.1 ksi
Yield Strength (0.2% offset)13 MPa1.9 ksi
Elongation at Break400%
Compressive Strength14 MPa2 ksi
Flexural Modulus0.6 GPa0.09 Msi
Hardness, Shore D58 Shore D
Hardness, Rockwell R60 HRR

Thermal10

MFA HP is rated for continuous service to 240°C (464 °F). It conducts heat at 0.21 W/m·K (0.121 BTU/hr·ft·°F), better than 55% of polymer grades. Thermal expansion is 130 µm/m·K (72.2 µin/in·°F).

Thermal Conductivity0.21 W/m·K0.12 BTU/hr·ft·°F
Specific Heat Capacity1,050 J/kg·K0.25 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)130 µm/m·K72.2 µin/in·°F
Max Service Temperature (continuous)240°C464 °F
Min Service Temperature-190°C-310 °F
Heat Deflection Temp. @ 0.45 MPa68°C154 °F
Heat Deflection Temp. @ 1.8 MPa46°C115 °F
Flammability (UL 94)V-0 (typically rated at 0.5 mm and above; non-dripping, self-extinguishing)
Limiting Oxygen Index95%
Max Service Temperature (short-term)260°C500 °F

Electrical7

MFA HP is an electrical insulator with a dielectric strength of 24 kV/mm (609.6 V/mil) and a resistivity of 1×10¹⁶ Ω·m.

Electrical Resistivity1×10¹⁶ Ω·m3.94×10²³ µΩ·in
Dielectric Strength24 kV/mm610 V/mil
Dielectric Constant (1 MHz)2.1
Dissipation Factor (1 MHz)3×10⁻⁴
Volume Resistivity1×10¹⁸ Ω·cm
Surface Resistivity1×10¹⁷ Ω
Comparative Tracking Index (CTI)600 V

Chemical & Environmental3

Corrosion resistance is excellent (99/100), better than 100% of polymer grades. UV resistance is excellent.

Corrosion ResistanceExcellent99/100
UV / Weathering ResistanceExcellent98/100
Chemical Resistance SummaryEssentially inert to acids, bases, oxidizers, solvents, hot chlorine and aqua regia up to service temperature; attacked only by molten alkali metals, elemental fluorine at high temperature and some fluorinated amines. Very low permeation compared with FEP, but gases and small solvent molecules still slowly diffuse through thin walls.

Sustainability4

Producing a kilogram of MFA HP takes about 250 MJ of energy and emits 13 kg of CO₂ — more than 92% of polymer grades. Typical recycled content is 0%.

Embodied Energy (primary production)250 MJ/kg107,481 BTU/lb
Embodied Carbon (primary production)13 kg CO₂/kg
Embodied Water400 L/kg47.9 gal/lb
Typical Recycled Content0%

Manufacturability8

MFA HP's machinability is good (55/100, worse than 64% of polymer grades); weldability very good (70/100); formability very good (80/100).

MachinabilityGood55/100
WeldabilityVery good70/100
Formability (cold)Very good80/100
PolishabilityFair40/100
Mold Shrinkage4%
Melt Flow Rate3 g/10 min
Processing Melt Temperature (typ.)350°C662 °F
Mold Temperature (typ.)170°C338 °F

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with MFA HP

Is MFA easy to machine?

Machines like PFA: very sharp positive-rake tools, high speed, light feed and good chip clearance; it is soft and creeps, so use light clamping, coolant-flood to avoid heat build-up and expect spring-back on tight tolerances.

Can MFA be welded?

Fusion/hot-gas welding of sheet and liners works with matching MFA rod above ~300 °C in an inert or clean-air stream; adhesive bonding requires chemical etch or plasma/corona treatment of the non-wetting surface.

Can MFA be formed, bent or molded?

Melt-process at 320–380 °C with corrosion-resistant (Hastelloy/nickel-alloy) barrels and dies, purge fully to avoid HF-generating degradation, and design for 3–5.5% shrinkage plus generous draft; rotolining and powder coating need slow ramp and full melt soak.

What surface finishes work on MFA?

No painting, plating or anodizing; surfaces are inherently non-stick and release-prone. Cosmetic finish is set by tool polish or by flame/plasma treatment when printing or bonding is needed.

MFA chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
tetrafluoroethylene (TFE)mol basis, main backbone unit94 – 9997
perfluoro(methyl vinyl ether) (PMVE)comonomer giving melt processability; distinguishes MFA from PFA (PPVE)1 – 63

MFA HP — frequently asked

What is MFA HP used for?

MFA HP is typically used for semiconductor wafer-handling components, chemical process linings, high-purity tubing and fittings and wire/cable jacketing. In short: easier-processing PFA alternative; fully fluorinated to 240 °C; high-purity semiconductor grade.

What is the yield strength of MFA HP?

MFA HP has a typical yield strength of 13 MPa (1.89 ksi) and a tensile strength of 28 MPa (4.06 ksi) — weaker than 86% of polymer grades. Strength varies by condition: see the 3 listed tempers.

Is MFA HP easy to machine?

Reasonably — machinability is rated good (55/100, worse than 64% of polymer grades). Machines like PFA: very sharp positive-rake tools, high speed, light feed and good chip clearance; it is soft and creeps, so use light clamping, coolant-flood to avoid heat build-up and expect spring-back on tight tolerances.

Can MFA HP be welded?

Yes — weldability is rated very good (70/100). Fusion/hot-gas welding of sheet and liners works with matching MFA rod above ~300 °C in an inert or clean-air stream; adhesive bonding requires chemical etch or plasma/corona treatment of the non-wetting surface.

What surface finishes work on MFA HP?

No painting, plating or anodizing; surfaces are inherently non-stick and release-prone. Cosmetic finish is set by tool polish or by flame/plasma treatment when printing or bonding is needed.

Can MFA HP be formed, bent or molded?

Melt-process at 320–380 °C with corrosion-resistant (Hastelloy/nickel-alloy) barrels and dies, purge fully to avoid HF-generating degradation, and design for 3–5.5% shrinkage plus generous draft; rotolining and powder coating need slow ramp and full melt soak.

What is the maximum service temperature of MFA HP?

MFA HP is rated for continuous use to about 240°C (464 °F), and briefly to 260°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Sources

  1. Hyflon MFA / PFA melt-processable perfluoropolymer product data — Solvay Specialty Polymers (2021)
  2. Fluoroplastics, Vol. 1–2: Non-Melt and Melt Processible Fluoropolymers — Elsevier / Plastics Design Library (Ebnesajjad) (2015)
  3. ASTM D3307 — Standard Specification for PFA-Fluorocarbon Resin Molding and Extrusion Materials — ASTM International (2020)
  4. ASTM D638 / D790 / D257 / D150 test methods — ASTM International (2022)
  5. CAMPUS / Prospector fluoropolymer datasheet aggregation — CWFG / UL Solutions (2024)
  6. PFA/MFA/FEP (2026)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.