LCP Type II LDS
Grade
ASTM D6779 · ISO LCP
LDS = laser-direct-structuring (LDS) grade
Contains a laser-activatable metal-oxide additive so antenna traces can be plated directly on the molded 3D part.
Values for the LDS condition
Other LCP Type II grades and fills
LCP Type II is listed in 10 conditions; see the grade overview at LCP Type II.
Compare all 10 grades and fillsHide
| Grade · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness |
|---|---|---|---|---|---|
Lubricated bearing grade | For unlubricated bushings, thrust washers and pump vanes running hot and dry against metal. | — | 110 | 1.8 | 88 Shore D |
Glass/mineral filled | Pick when flatness, blister-free reflow and clean laser marking on small SMT parts outrank peak strength. | — | 115 | 1.8 | — |
LDSThis page Laser-direct-structuring (LDS) grade | Contains a laser-activatable metal-oxide additive so antenna traces can be plated directly on the molded 3D part. | — | 125 | 1.6 | 90 Shore D |
Static-dissipative / conductive grade | Carbon-black or carbon-fiber loaded LCP for IC test sockets, burn-in hardware and semiconductor tooling needing controlled surface resistance. | — | 130 | 1.8 | 90 Shore D |
30 % glass-fiber reinforced | The workhorse SMT-connector grade: best balance of stiffness, HDT above lead-free reflow, and dimensional stability. | — | 140 | 2.1 | — |
Heat-stabilized / high-heat blow-off resistant grade | Formulated for repeated lead-free reflow (260 °C peak) and long-term 240 °C oven exposure without blistering. | — | 140 | 2.2 | 90 Shore D |
40 % glass-fiber reinforced | Maximum stiffness/HDT and lowest CTE for coil bobbins, pump and sensor bodies where flow length is short. | — | 150 | 1.7 | — |
15 % glass-fiber reinforced | Light reinforcement to cut anisotropy and warpage while keeping good flow for 0.3–0.5 mm connector walls. | — | 160 | 2.6 | — |
High-frequency / low-loss grade | Low-Dk/Df formulations (often unfilled or spherical-filler modified) for antenna carriers, mmWave connectors and LCP film substrates. | — | 175 | 2.5 | 87 Shore D |
30 % carbon-fiber reinforced | Highest specific stiffness plus static-dissipative/conductive behaviour and improved heat transfer for wafer-handling and precision parts. | — | 190 | 1.3 | — |
What is LCP Type II LDS?
LCP Type II LDS is LCP Type II in the LDS grade — contains a laser-activatable metal-oxide additive so antenna traces can be plated directly on the molded 3D part. LCP Type II LDS has a tensile strength of 125 MPa (18.1 ksi), stronger than 93% of polymer grades. Elongation at break is 1.6% and the elastic modulus is 15 GPa (2.18 Msi). LCP Type II LDS has a density of 1.72 g/cm³ (0.0621 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 110°C (230 °F).
Advantages
- Stiff — 15 GPa (2.18 Msi), better than 99% of polymer grades
- Low, predictable mold shrinkage — 0.1%, better than 99% of polymer grades
- Conducts heat well — 0.5 W/m·K (0.289 BTU/hr·ft·°F), better than 98% of polymer grades
- Low moisture uptake — 0.02%, better than 92% of polymer grades
- High service temperature — 230°C (446 °F), better than 91% of polymer grades
Limitations
- Limited ductility — 1.6%, worse than 97% of polymer grades
- Heavy — 1.72 g/cm³ (0.0621 lb/in³), worse than 95% of polymer grades
- High embodied carbon — 12 kg CO₂/kg, worse than 91% of polymer grades
- Limited formability — 10/100, worse than 87% of polymer grades
- Difficult to machine — 40/100, worse than 82% of polymer grades
LCP Type II LDS properties
Typical room-temperature values for LCP Type II LDS; 24 are specific to this condition. Other listed values are LCP Type II reference data and may not represent this condition. Bars are the position among polymer grades.
Physical5
LCP Type II LDS has a density of 1.72 g/cm³ (0.0621 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 110°C (230 °F).
Mechanical12
LCP Type II LDS has a tensile strength of 125 MPa (18.1 ksi), stronger than 93% of polymer grades. Elongation at break is 1.6% and the elastic modulus is 15 GPa (2.18 Msi).
Thermal10
LCP Type II LDS is rated for continuous service to 230°C (446 °F). It conducts heat at 0.5 W/m·K (0.289 BTU/hr·ft·°F), better than 98% of polymer grades. Thermal expansion is 8 µm/m·K (4.44 µin/in·°F).
Electrical7
LCP Type II LDS is an electrical insulator with a dielectric strength of 35 kV/mm (889 V/mil) and a resistivity of 1×10¹² Ω·m.
Chemical & Environmental3
Corrosion resistance is excellent (90/100), better than 82% of polymer grades. UV resistance is fair.
Sustainability4
Producing a kilogram of LCP Type II LDS takes about 250 MJ of energy and emits 12 kg of CO₂ — more than 92% of polymer grades. Typical recycled content is 0%.
Manufacturability7
LCP Type II LDS's machinability is fair (40/100, worse than 82% of polymer grades); weldability poor (30/100); formability not recommended (10/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with LCP Type II LDS
Is LCP Type II easy to machine?
Machines cleanly with sharp polished carbide/diamond tooling and light feeds, but the skin-core fibrillar structure delaminates and frays — avoid deep single-point cuts and drilling near thin walls.
Can LCP Type II be welded?
Poor for ultrasonic/vibration welding because the oriented skin splits; join by snap fit, press fit, insert molding, over-molding or laser welding on filled/absorbing grades; adhesives need plasma or corona pretreatment.
Can LCP Type II be formed, bent or molded?
Dry 4 h at 150 °C, melt 290–330 °C, mold 60–120 °C, use small gates, very high injection speed and short shots per cavity balance; expect near-zero flow shrinkage but 3–5× higher transverse shrinkage and weak weld lines — design gates to avoid knit lines in loaded areas.
What surface finishes work on LCP Type II?
Not paintable without primer; laser marks well on mineral/pigmented grades, plates directly only on LDS grades, and colors are limited by the high melt temperature (use high-heat pigments).
LCP Type II chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| 4-hydroxybenzoic acid (HBA)mol % of aromatic ester units (Vectra A-type chemistry) | 60 – 80 | 73 |
| 6-hydroxy-2-naphthoic acid (HNA)mol %; kinked comonomer that lowers Tm vs Type I | 20 – 40 | 27 |
| terephthalic acid / 4,4'-biphenol / aminused in Zenite/Sumika-type Type II copolyesters and copolyesteramides | 0 – 30 | — |
| glass fiberwt % in reinforced grades (GF15/GF30/GF40) | 0 – 50 | 0 |
| mineral / talc / carbon fillerwt % in low-warpage, wear or ESD grades | 0 – 40 | 0 |
LCP Type II LDS — frequently asked
What is LCP Type II LDS used for?
LCP Type II LDS is typically used for connectors and sockets, camera/optical housings, thin-wall precision parts and chemical-resistant seals. In short: most-used commercial LCP; lower melt than Type I; strongest LCP tensile class.
What is the tensile strength of LCP Type II LDS?
LCP Type II LDS has a typical tensile strength of 125 MPa (18.1 ksi) — stronger than 93% of polymer grades. Strength varies by condition: see the 10 listed tempers.
Is LCP Type II LDS easy to machine?
Not especially — machinability is rated fair (40/100, worse than 82% of polymer grades). Machines cleanly with sharp polished carbide/diamond tooling and light feeds, but the skin-core fibrillar structure delaminates and frays — avoid deep single-point cuts and drilling near thin walls.
Can LCP Type II LDS be welded?
Not readily — weldability is rated poor (30/100). Poor for ultrasonic/vibration welding because the oriented skin splits; join by snap fit, press fit, insert molding, over-molding or laser welding on filled/absorbing grades; adhesives need plasma or corona pretreatment.
What surface finishes work on LCP Type II LDS?
Not paintable without primer; laser marks well on mineral/pigmented grades, plates directly only on LDS grades, and colors are limited by the high melt temperature (use high-heat pigments).
Can LCP Type II LDS be formed, bent or molded?
Dry 4 h at 150 °C, melt 290–330 °C, mold 60–120 °C, use small gates, very high injection speed and short shots per cavity balance; expect near-zero flow shrinkage but 3–5× higher transverse shrinkage and weak weld lines — design gates to avoid knit lines in loaded areas.
What is the maximum service temperature of LCP Type II LDS?
LCP Type II LDS is rated for continuous use to about 230°C (446 °F), and briefly to 260°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- ASTM D6779 Standard Classification System for Liquid Crystal Polymers (LCP) Molding and Extrusion Materials — ASTM International (2022)
- Vectra LCP product and processing guide (A950, A130, A430, A230 grades) — Celanese (2023)
- Zenite LCP resin datasheets — Celanese (formerly DuPont) (2022)
- Sumikasuper LCP technical data — Sumitomo Chemical (2023)
- CAMPUS / UL Prospector LCP material data sheets — CWFG / UL Solutions (2024)
- Engineered Materials Handbook Vol. 2: Engineering Plastics — ASM International (1988)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.