Copper Alloy CuNi2SiCr-TH04
Precip hard
EN CuNi2SiCr · UNS C64726
TH04 = tD04 and precipitation hardened
Highest-strength wrought condition for small rod, wire and strip where formability is not required.
Values for the TH04 condition
Other CuNi2SiCr tempers and conditions
CuNi2SiCr is listed in 8 conditions; see the grade overview at CuNi2SiCr.
Compare all 8 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Solution heat treated | Soft wrought bar/strip for forming, bending or deep drawing before the customer's own ageing cycle. | 160 | 350 | 40 | 90 HB | 20 % IACS |
As built (as printed) | Pick when the part will be machined and aged afterwards, or where ductility matters more than strength/conductivity. | 300 | 400 | 20 | 115 HB | 18 % IACS |
Hot isostatically pressed then aged | For fatigue- or pressure-critical cooling channels where residual LPBF porosity must be closed. | 480 | 590 | 18 | 11 HRC | 40 % IACS |
AB+ADefault LPBF as-built plus direct precipitation ageing | Standard supplied condition for conformal-cooling mould inserts: near-peak strength and conductivity without distortion from a solution treatment. | 500 | 600 | 12 | 190 HB | 36 % IACS |
LPBF, solution treated (≈900–950 °C, quenched) and aged | Choose when maximum conductivity and homogeneous properties are needed and the geometry tolerates quench distortion. | 530 | 630 | 14 | 200 HB | 42 % IACS |
Solution heat treated and precipitation hardened | Standard hardened wrought bar/plate condition (EN 12163 R590/HB180 class) for electrodes, dies and backing plates. | 530 | 630 | 15 | 195 HB | 43 % IACS |
Mill hardened, full hard | Mill-hardened strip supplied ready to stamp and form for connectors and lead frames — no customer heat treatment. | 620 | 680 | 9 | 208 HB | 40 % IACS |
TH04This page TD04 and precipitation hardened | Highest-strength wrought condition for small rod, wire and strip where formability is not required. | 660 | 720 | 8 | 215 HB | 40 % IACS |
What is CuNi2SiCr-TH04?
CuNi2SiCr-TH04 is CuNi2SiCr in the TH04 condition — highest-strength wrought condition for small rod, wire and strip where formability is not required. CuNi2SiCr-TH04 has a yield strength of 660 MPa (95.7 ksi) and a tensile strength of 720 MPa (104 ksi) — stronger than 96% of copper alloy grades. Elongation at break is 8% and the elastic modulus is 132 GPa (19.1 Msi). CuNi2SiCr-TH04 has a density of 8.8 g/cm³ (0.318 lb/in³), heavier than 58% of copper alloy grades. It melts at 1,050°C (1,922 °F). AB+A is the default condition FabDigit quotes; TH04 is available on request or by drawing note.
Advantages
- High strength — 660 MPa (95.7 ksi), better than 96% of copper alloy grades
- Stiff — 132 GPa (19.1 Msi), better than 93% of copper alloy grades
- High service temperature — 300°C (572 °F), better than 85% of copper alloy grades
Limitations
- Limited ductility — 8%, worse than 83% of copper alloy grades
CuNi2SiCr-TH04 properties
Typical room-temperature values for CuNi2SiCr-TH04; 12 are specific to this condition. Other listed values are CuNi2SiCr reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
CuNi2SiCr-TH04 has a density of 8.8 g/cm³ (0.318 lb/in³), heavier than 58% of copper alloy grades. It melts at 1,050°C (1,922 °F).
Mechanical15
CuNi2SiCr-TH04 has a yield strength of 660 MPa (95.7 ksi) and a tensile strength of 720 MPa (104 ksi) — stronger than 96% of copper alloy grades. Elongation at break is 8% and the elastic modulus is 132 GPa (19.1 Msi).
Thermal6
CuNi2SiCr-TH04 is rated for continuous service to 300°C (572 °F). It conducts heat at 175 W/m·K (101.1 BTU/hr·ft·°F), better than 74% of copper alloy grades. Thermal expansion is 17.6 µm/m·K (9.78 µin/in·°F).
Electrical3
CuNi2SiCr-TH04 conducts electricity at 40 % IACS, better than 74% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (60/100), worse than 68% of copper alloy grades.
Sustainability4
Producing a kilogram of CuNi2SiCr-TH04 takes about 58 MJ of energy and emits 3.6 kg of CO₂ — more than 61% of copper alloy grades. Typical recycled content is 25%.
Manufacturability8
CuNi2SiCr-TH04's machinability is fair (50/100, better than 69% of copper alloy grades); weldability fair (50/100); formability poor (20/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with CuNi2SiCr-TH04
Is CuNi2SiCr easy to machine?
Machine in the aged condition with sharp, polished-flute carbide at high speed and generous flood coolant; the alloy is gummy and work-hardens, so avoid dwelling and use positive rake.
Can CuNi2SiCr be welded?
Laser and electron-beam welding work well on thin sections; TIG/MIG possible with matching or Cu-Ni filler, but the HAZ over-ages and needs re-ageing (≈480 °C/3 h) to restore hardness.
Can CuNi2SiCr be formed, bent or molded?
LPBF requires green or high-power IR lasers, pre-heated plate and low-oxygen atmosphere due to copper's reflectivity; wrought material should be formed in the TB00 solution-treated temper and aged afterwards.
What surface finishes work on CuNi2SiCr?
Polishes to a mirror finish for mould cavities; not anodisable — protect with electroless nickel, hard chrome or PVD coatings against wear and against contact with ammonia-bearing media.
CuNi2SiCr chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Niforms Ni2Si strengthening precipitates | 1.6 – 2.5 | 2 |
| Si | 0.4 – 0.8 | 0.6 |
| Crgrain refinement and additional Cr-rich precipitation | 0.1 – 0.6 | 0.3 |
| Feimpurity limit | ≤ 0.2 | — |
| Znimpurity limit | ≤ 0.3 | — |
| Mnimpurity limit | ≤ 0.1 | — |
| Pbimpurity limit | ≤ 0.02 | — |
| Others (total)sum of unlisted elements | ≤ 0.3 | — |
| Cubalance, ≈96.5 % nominal; ranges per DIN/EN CW112C (CuNi2SiCr), close to CDA C647xx family | balance | — |
CuNi2SiCr-TH04 — frequently asked
What is CuNi2SiCr-TH04 used for?
CuNi2SiCr-TH04 is typically used for conformal-cooled injection mold inserts, electrode holders and wear-resistant conductive parts. In short: age-hardenable conductive tooling copper; strongest of the conformal-cooling coppers; mirror-polishable mould material.
What is the yield strength of CuNi2SiCr-TH04?
CuNi2SiCr-TH04 has a typical yield strength of 660 MPa (95.7 ksi) and a tensile strength of 720 MPa (104 ksi) — stronger than 96% of copper alloy grades. Strength varies by condition: see the 8 listed tempers.
Is CuNi2SiCr-TH04 easy to machine?
Reasonably — machinability is rated fair (50/100, better than 69% of copper alloy grades). Machine in the aged condition with sharp, polished-flute carbide at high speed and generous flood coolant; the alloy is gummy and work-hardens, so avoid dwelling and use positive rake.
Can CuNi2SiCr-TH04 be welded?
With care — weldability is rated fair (50/100). Laser and electron-beam welding work well on thin sections; TIG/MIG possible with matching or Cu-Ni filler, but the HAZ over-ages and needs re-ageing (≈480 °C/3 h) to restore hardness.
What surface finishes work on CuNi2SiCr-TH04?
Polishes to a mirror finish for mould cavities; not anodisable — protect with electroless nickel, hard chrome or PVD coatings against wear and against contact with ammonia-bearing media.
Can CuNi2SiCr-TH04 be formed, bent or molded?
LPBF requires green or high-power IR lasers, pre-heated plate and low-oxygen atmosphere due to copper's reflectivity; wrought material should be formed in the TB00 solution-treated temper and aged afterwards.
What is the maximum service temperature of CuNi2SiCr-TH04?
CuNi2SiCr-TH04 is rated for continuous use to about 300°C (572 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between CuNi2SiCr AB+A and CuNi2SiCr-TB00?
AB+A is the default condition — standard supplied condition for conformal-cooling mould inserts: near-peak strength and conductivity without distortion from a solution treatment. TB00: soft wrought bar/strip for forming, bending or deep drawing before the customer's own ageing cycle. Yield strength is 500 MPa in AB+A versus 160 MPa in TB00.
Sources
- EN 12163 / EN 12420 — Copper and copper alloys, rod and forgings (CuNi2SiCr, CW112C) — CEN (2016)
- ASTM B105 / CDA alloy registration, C647xx Cu-Ni-Si series — ASTM / Copper Development Association (2019)
- ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys (Cu-Ni-Si precipitation-hardening alloys) — ASM International (1990)
- LPBF copper alloy powder datasheets (CuNi2SiCr) from AM system and powder suppliers — various (SLM/TRUMPF/atomiser datasheets) (2023)
- copper.org alloy property database, Cu-Ni-Si alloys — CDA (2022)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.