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LCP-MF ESD (ESD / conductive)

Grade

ASTM D6779

Pick for IC trays, burn-in sockets and handling parts needing static dissipation at high temperature.

High cost $$$$

Values for the ESD condition

Other LCP-MF grades and fills

LCP-MF is listed in 8 conditions; see the grade overview at LCP-MF.

Compare all 8 grades and fillsHide
Grade · open for datasheetBest forYield MPaTensile MPaElong. %Hardness
40% mineral filled, high stiffness / high dimensional stability
Pick for the flattest parts and lowest CTE where brittleness and higher density are acceptable.—1051.5—
Laser direct structuring / platable mineral-filled grade
Pick for MID/antenna parts where circuit traces are laser-activated and copper-plated on the molded body.—1051.886 HRM
High-heat (Type I / high-Tm) mineral-filled base resin
Pick for lead-free reflow, high-temperature bake-out or continuous use above 240 °C.—1101.887 HRM
High-flow thin-wall grade
Pick for 0.2–0.4 mm wall FPC/board-to-board connectors with long flow lengths.—1102.284 HRM
ESDThis page
ESD / conductive
Pick for IC trays, burn-in sockets and handling parts needing static dissipation at high temperature.—1101.686 HRM
MF30Default
30% mineral filled
Default balanced grade: low, isotropic shrinkage for flat connectors, sockets and covers.—115285 HRM
20% mineral filled
Pick when maximum flow into ultra-thin walls (<0.3 mm) matters more than stiffness.—1252.6—
GF/MF hybrid
Pick when GF-level strength is needed but pure GF warpage/anisotropy is unacceptable.—145288 HRM

What is LCP-MF ESD?

LCP-MF ESD is LCP-MF in the ESD grade — pick for IC trays, burn-in sockets and handling parts needing static dissipation at high temperature. LCP-MF ESD has a tensile strength of 110 MPa (16 ksi), stronger than 91% of polymer grades. Elongation at break is 1.6% and the elastic modulus is 12 GPa (1.74 Msi). LCP-MF ESD has a density of 1.82 g/cm³ (0.0658 lb/in³), heavier than 96% of polymer grades. Its glass-transition temperature is 120°C (248 °F). MF30 is the default condition FabDigit quotes; ESD is available on request or by drawing note.

Advantages

  • Conducts heat well — 0.6 W/m·K (0.347 BTU/hr·ft·°F), better than 99% of polymer grades
  • Stiff — 12 GPa (1.74 Msi), better than 98% of polymer grades
  • Low, predictable mold shrinkage — 0.3%, better than 90% of polymer grades
  • High service temperature — 220°C (428 °F), better than 89% of polymer grades
  • Low moisture uptake — 0.03%, better than 88% of polymer grades

Limitations

  • Limited ductility — 1.6%, worse than 97% of polymer grades
  • Heavy — 1.82 g/cm³ (0.0658 lb/in³), worse than 96% of polymer grades
  • High embodied carbon — 8.5 kg CO₂/kg, worse than 85% of polymer grades
  • Limited formability — 12/100, worse than 83% of polymer grades
  • Difficult to machine — 42/100, worse than 80% of polymer grades

LCP-MF ESD properties

Typical room-temperature values for LCP-MF ESD; 23 are specific to this condition. Other listed values are LCP-MF reference data and may not represent this condition. Bars are the position among polymer grades.

Physical5

LCP-MF ESD has a density of 1.82 g/cm³ (0.0658 lb/in³), heavier than 96% of polymer grades. Its glass-transition temperature is 120°C (248 °F).

Density1.82 g/cm³0.07 lb/in³
Melting Temperature (Tm)320°C608 °F
Glass Transition (Tg)120°C248 °F
Water Absorption (24 h)0.03%
Water Absorption (Saturation)0.1%

Mechanical11

LCP-MF ESD has a tensile strength of 110 MPa (16 ksi), stronger than 91% of polymer grades. Elongation at break is 1.6% and the elastic modulus is 12 GPa (1.74 Msi).

Elastic (Young's) Modulus12 GPa1.7 Msi
Poisson's Ratio0.38
Tensile Strength (Ultimate)110 MPa16 ksi
Elongation at Break1.6%
Compressive Strength128 MPa18.6 ksi
Flexural Strength150 MPa21.8 ksi
Flexural Modulus12 GPa1.7 Msi
Shear Strength68 MPa9.9 ksi
Fracture Toughness (K_IC)2.5 MPa·√m2.3 ksi·√in
Izod Impact, Notched45 J/m0.84 ft·lbf/in
Hardness, Rockwell M86 HRM

Thermal10

LCP-MF ESD is rated for continuous service to 220°C (428 °F). It conducts heat at 0.6 W/m·K (0.347 BTU/hr·ft·°F), better than 99% of polymer grades. Thermal expansion is 22 µm/m·K (12.2 µin/in·°F).

Thermal Conductivity0.6 W/m·K0.35 BTU/hr·ft·°F
Specific Heat Capacity1,050 J/kg·K0.25 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)22 µm/m·K12.2 µin/in·°F
Max Service Temperature (continuous)220°C428 °F
Min Service Temperature-50°C-58 °F
Heat Deflection Temp. @ 0.45 MPa265°C509 °F
Heat Deflection Temp. @ 1.8 MPa235°C455 °F
Flammability (UL 94)V-0 at 0.4 mm
Limiting Oxygen Index42%
Max Service Temperature (short-term)280°C536 °F

Electrical7

LCP-MF ESD is an electrical insulator with a dielectric strength of 32 kV/mm (812.8 V/mil) and a resistivity of 1,000 Ω·m.

Electrical Resistivity1,000 Ω·m3.94×10¹⁰ µΩ·in
Dielectric Strength32 kV/mm813 V/mil
Dielectric Constant (1 MHz)4.2
Dissipation Factor (1 MHz)0.006
Volume Resistivity100,000 Ω·cm
Surface Resistivity1,000,000 Ω
Comparative Tracking Index (CTI)200 V

Chemical & Environmental3

Corrosion resistance is excellent (90/100), better than 82% of polymer grades. UV resistance is fair.

Corrosion ResistanceExcellent90/100
UV / Weathering ResistanceFair45/100
Chemical Resistance SummaryExcellent against acids, hydrocarbons, solvents, hot water/steam and automotive fluids; attacked only by hot concentrated caustic and some strong oxidizers; hydrolysis-resistant but long-term steam above 150 °C can degrade surface.

Sustainability4

Producing a kilogram of LCP-MF ESD takes about 175 MJ of energy and emits 8.5 kg of CO₂ — more than 86% of polymer grades. Typical recycled content is 0%.

Embodied Energy (primary production)175 MJ/kg75,237 BTU/lb
Embodied Carbon (primary production)8.5 kg CO₂/kg
Embodied Water260 L/kg31.2 gal/lb
Typical Recycled Content0%

Manufacturability8

LCP-MF ESD's machinability is fair (42/100, worse than 80% of polymer grades); weldability poor (22/100); formability not recommended (12/100).

MachinabilityFair42/100
WeldabilityPoor22/100
Formability (cold)Not recommended12/100
PolishabilityFair50/100
Mold Shrinkage0.3%
Melt Flow Rate25 g/10 min
Processing Melt Temperature (typ.)340°C644 °F
Mold Temperature (typ.)110°C230 °F

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with LCP-MF ESD

Is LCP-MF easy to machine?

Machinable but the mineral filler is abrasive and the skin-core structure splinters — use sharp carbide/diamond tooling, high speed, light feed, and avoid deep threads.

Can LCP-MF be welded?

Weld lines and joints are inherently weak due to molecular orientation; prefer snap fits, heat staking or adhesive over ultrasonic/laser welding for structural joints.

Can LCP-MF be formed, bent or molded?

Injection mold at 320–360 °C melt / 80–150 °C tool with fast fill, dried pellets (150 °C, 3–4 h), well-vented hardened tool steel and gates positioned to place weld lines in low-stress areas.

What surface finishes work on LCP-MF?

Molds to a good as-molded finish; paint and adhesive bonding need plasma or primer pretreatment, and dedicated LDS grades are used when selective copper plating is required.

LCP-MF chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
mineral filler (talc / mica / wollastoniplaty or acicular filler for shrinkage balance20 – 4030
pigment, lubricant, nucleant, stabilizercarbon black or TiO2 plus processing aids0 – 20.8
aromatic copolyester LCP resin (HBA/HNA wholly aromatic thermotropic polyester matrix≥ 55 (balance)—

LCP-MF ESD — frequently asked

What is LCP-MF ESD used for?

LCP-MF ESD is typically used for low-warpage connector housings, precision optical mounts and thin-wall enclosures. In short: low-warpage LCP grade; balanced flow/cross-flow shrinkage; cheaper than glass-filled LCP.

What is the tensile strength of LCP-MF ESD?

LCP-MF ESD has a typical tensile strength of 110 MPa (16 ksi) — stronger than 91% of polymer grades. Strength varies by condition: see the 8 listed tempers.

Is LCP-MF ESD easy to machine?

Not especially — machinability is rated fair (42/100, worse than 80% of polymer grades). Machinable but the mineral filler is abrasive and the skin-core structure splinters — use sharp carbide/diamond tooling, high speed, light feed, and avoid deep threads.

Can LCP-MF ESD be welded?

Not readily — weldability is rated poor (22/100). Weld lines and joints are inherently weak due to molecular orientation; prefer snap fits, heat staking or adhesive over ultrasonic/laser welding for structural joints.

What surface finishes work on LCP-MF ESD?

Molds to a good as-molded finish; paint and adhesive bonding need plasma or primer pretreatment, and dedicated LDS grades are used when selective copper plating is required.

Can LCP-MF ESD be formed, bent or molded?

Injection mold at 320–360 °C melt / 80–150 °C tool with fast fill, dried pellets (150 °C, 3–4 h), well-vented hardened tool steel and gates positioned to place weld lines in low-stress areas.

What is the maximum service temperature of LCP-MF ESD?

LCP-MF ESD is rated for continuous use to about 220°C (428 °F), and briefly to 280°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Sources

  1. ASTM D5138 — Classification System for Liquid-Crystal Polymer (LCP) Molding and Extrusion Materials — ASTM International (2019)
  2. Vectra LCP mineral-filled grades (MT series) product data — Celanese (2023)
  3. LAPEROS LCP molding and property guide — Polyplastics (2023)
  4. Sumikasuper LCP grade list — Sumitomo Chemical (2023)
  5. CAMPUS plastics database — LCP mineral-filled datasets (ISO 527/178/75/180) — CAMPUS / CWFG (2024)
  6. Engineered Materials Handbook Vol.2: Engineering Plastics — ASM International (1988)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.