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Copper Alloy C75700-H06

Supply condition

UNS C75700 · EN CW403J

H06 = extra hard

Pick for higher-load spring strip formed only with generous bend radii along the grain.

High cost $$$$

Values for the H06 condition

Other C75700 tempers and conditions

C75700 is listed in 8 conditions; see the grade overview at C75700.

Compare all 8 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed
Pick for deep drawing, spinning and severe forming where maximum ductility is needed.1523654275 HB9 % IACS
Quarter hard
Pick when moderate bending/forming must be combined with higher strength than annealed strip.33043420110 HB—
H02Default
Half hard
General-purpose stocked strip temper: balanced strength and bendability for hardware, frames and stampings.42049610135 HB—
Full hard
Pick for flat springs, contacts and stiff hardware where high strength matters more than bend radius.5055654165 HB—
H06This page
Extra hard
Pick for higher-load spring strip formed only with generous bend radii along the grain.5606203180 HB8.5 % IACS
Hard drawn
Cold-drawn wire condition for spectacle-frame wire, springs and formed wire parts.5906553190 HB8.5 % IACS
Spring hard
Pick for flat springs, clips and contact fingers requiring high elastic limit.6206752195 HB8.5 % IACS
Extra spring hard
Maximum-strength rolled strip for demanding spring contacts; essentially no formability across grain.6607102208 HB8.5 % IACS

What is C75700-H06?

C75700-H06 is C75700 supplied in the H06 condition — pick for higher-load spring strip formed only with generous bend radii along the grain. C75700-H06 has a yield strength of 560 MPa (81.2 ksi) and a tensile strength of 620 MPa (89.9 ksi) — stronger than 93% of copper alloy grades. Elongation at break is 3% and the elastic modulus is 125 GPa (18.1 Msi). C75700-H06 has a density of 8.72 g/cm³ (0.315 lb/in³), lighter than 54% of copper alloy grades. It melts at 1,004°C (1,839 °F). H02 is the default condition FabDigit quotes; H06 is available on request or by drawing note.

Advantages

  • Polishes to a fine finish — 90/100, better than 99% of copper alloy grades
  • High strength — 560 MPa (81.2 ksi), better than 93% of copper alloy grades

Limitations

  • Limited ductility — 3%, worse than 97% of copper alloy grades
  • Limited service temperature — 175°C (347 °F), worse than 92% of copper alloy grades
  • High embodied carbon — 4.6 kg CO₂/kg, worse than 82% of copper alloy grades
  • Low electrical conductivity — 8.5 % IACS, worse than 79% of copper alloy grades
  • Poor heat conductor — 45 W/m·K (26 BTU/hr·ft·°F), worse than 76% of copper alloy grades

C75700-H06 properties

Typical room-temperature values for C75700-H06; 20 are specific to this condition. Other listed values are C75700 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C75700-H06 has a density of 8.72 g/cm³ (0.315 lb/in³), lighter than 54% of copper alloy grades. It melts at 1,004°C (1,839 °F).

Density8.72 g/cm³0.32 lb/in³
Melting Point (Solidus)1,004°C1,839 °F
Liquidus Temperature1,038°C1,900 °F

Mechanical12

C75700-H06 has a yield strength of 560 MPa (81.2 ksi) and a tensile strength of 620 MPa (89.9 ksi) — stronger than 93% of copper alloy grades. Elongation at break is 3% and the elastic modulus is 125 GPa (18.1 Msi).

Elastic (Young's) Modulus125 GPa18.1 Msi
Shear Modulus46 GPa6.7 Msi
Bulk Modulus130 GPa18.9 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)620 MPa89.9 ksi
Yield Strength (0.2% offset)560 MPa81.2 ksi
Elongation at Break3%
Shear Strength370 MPa53.7 ksi
Fatigue Strength (Endurance Limit)195 MPa28.3 ksi
Hardness, Brinell180 HB
Hardness, Rockwell B87 HRB
Hardness, Vickers190 HV

Thermal6

C75700-H06 is rated for continuous service to 175°C (347 °F). It conducts heat at 45 W/m·K (26 BTU/hr·ft·°F), worse than 76% of copper alloy grades. Thermal expansion is 16.2 µm/m·K (9 µin/in·°F).

Thermal Conductivity45 W/m·K26 BTU/hr·ft·°F
Specific Heat Capacity377 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)16.2 µm/m·K9 µin/in·°F
Latent Heat of Fusion180 J/g77.4 BTU/lb
Max Service Temperature (continuous)175°C347 °F
Min Service Temperature-200°C-328 °F

Electrical3

C75700-H06 conducts electricity at 8.5 % IACS, worse than 79% of copper alloy grades.

Electrical Conductivity8.5 % IACS
Electrical Resistivity2.03×10⁻⁷ Ω·m7.99 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (62/100), worse than 57% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.25 V
Corrosion ResistanceGood62/100
Chemical Resistance SummaryGood in fresh water, mild atmospheres and many organics; resists tarnish better than brass. Attacked by ammonia/amines (SCC risk in cold-worked tempers), oxidising acids, sulphides and chlorine-bearing solutions.

Sustainability4

Producing a kilogram of C75700-H06 takes about 65 MJ of energy and emits 4.6 kg of CO₂ — more than 81% of copper alloy grades. Typical recycled content is 40%.

Embodied Energy (primary production)65 MJ/kg27,945 BTU/lb
Embodied Carbon (primary production)4.6 kg CO₂/kg
Embodied Water250 L/kg30 gal/lb
Typical Recycled Content40%

Manufacturability7

C75700-H06's machinability is fair (35/100, better than 51% of copper alloy grades); weldability fair (35/100); formability poor (25/100).

MachinabilityFair35/100
Machinability Rating (AISI 1212 = 100 %)25%
WeldabilityFair35/100
Formability (cold)Poor25/100
Brazeability / SolderabilityVery good80/100
PolishabilityExcellent90/100
Anodizing Responsen/a — copper alloy; finished by polishing, lacquering, or Ni/Cr/Ag/Au electroplating instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C75700-H06

Is C75700 easy to machine?

Machinability ~20 % of free-cutting brass — gummy, work-hardening chips; use sharp positive-rake carbide, moderate speed and generous coolant.

Can C75700 be welded?

Resistance and brazing/soldering are preferred; fusion welding risks zinc fume and porosity, so use low-heat processes with adequate ventilation.

Can C75700 be formed, bent or molded?

Excellent cold formability in O61/H01 for deep drawing and stamping; interanneal between heavy reductions and stress-relieve at ~250–300 °C to avoid ammonia-induced SCC.

What surface finishes work on C75700?

Takes a bright silver-white polish and readily accepts Ni, Cr, Ag or Au plating; lacquer or clearcoat for long-term tarnish protection — not anodizable.

C75700 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Cuincludes Ag if reported63.5 – 66.565
NiNi + Co11 – 1312
Pb≤ 0.05—
Fe≤ 0.25—
Mn≤ 0.5—
Znbalance—

C75700-H06 — frequently asked

What is C75700-H06 used for?

C75700-H06 is typically used for optical frame components, hardware, nameplates and electrical parts. In short: mid-nickel strip grade; good cold workability; silvery-white stamping alloy.

What is the yield strength of C75700-H06?

C75700-H06 has a typical yield strength of 560 MPa (81.2 ksi) and a tensile strength of 620 MPa (89.9 ksi) — stronger than 93% of copper alloy grades. Strength varies by condition: see the 8 listed tempers.

Is C75700-H06 easy to machine?

Not especially — machinability is rated fair (35/100, better than 51% of copper alloy grades). Machinability ~20 % of free-cutting brass — gummy, work-hardening chips; use sharp positive-rake carbide, moderate speed and generous coolant.

Can C75700-H06 be welded?

With care — weldability is rated fair (35/100). Resistance and brazing/soldering are preferred; fusion welding risks zinc fume and porosity, so use low-heat processes with adequate ventilation.

What surface finishes work on C75700-H06?

Takes a bright silver-white polish and readily accepts Ni, Cr, Ag or Au plating; lacquer or clearcoat for long-term tarnish protection — not anodizable.

Can C75700-H06 be formed, bent or molded?

Excellent cold formability in O61/H01 for deep drawing and stamping; interanneal between heavy reductions and stress-relieve at ~250–300 °C to avoid ammonia-induced SCC.

What is the maximum service temperature of C75700-H06?

C75700-H06 is rated for continuous use to about 175°C (347 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C75700-H02 and C75700-O61?

H02 is the default condition — general-purpose stocked strip temper: balanced strength and bendability for hardware, frames and stampings. O61: pick for deep drawing, spinning and severe forming where maximum ductility is needed. Yield strength is 420 MPa in H02 versus 152 MPa in O61.

Sources

  1. ASTM B122/B122M Copper-Nickel-Zinc (Nickel Silver) Plate, Sheet, Strip and Rolled Bar — ASTM International (2022)
  2. ASTM B151/B151M Copper-Nickel-Zinc and Copper-Nickel Rod and Bar — ASTM International (2020)
  3. CDA Alloy Datasheet C75700 (Nickel Silver 65-12) — Copper Development Association (2023)
  4. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  5. EN 1652 / CW403J CuNi12Zn24 — CEN (1997)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.