XPS 500 B2
Flame-retardant grade
EN 13164 XPS500 · GB GB/T 10801.2 XPS500
B2 = standard combustibility grade
Choose the lower-cost standard combustibility grade only for buried, subgrade or industrial insulation where no fire classification is demanded; conductivity is unchanged at 0.029 W/m·K.
Values for the B2 condition
Other XPS 500 grades and fills
XPS 500 is listed in 4 conditions; see the grade overview at XPS 500.
Compare all 4 grades and fillsHide
| Grade · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness |
|---|---|---|---|---|---|
CO2-blown, HFC/HCFC-free formulation | Use where ODP/GWP limits apply: CO₂ and co-blowing agents replace fluorinated blowing agents, at the cost of a slightly higher conductivity of 0.032 W/m·K. | — | 0.5 | 3 | 24 Shore D |
Graphite-enhanced (IR-blocker) XPS | Pick when the same thickness must deliver more thermal resistance; graphite or carbon-black IR blockers cut radiative heat transfer to 0.027 W/m·K. | — | 0.52 | 2.5 | 26 Shore D |
B1Default Flame-retardant grade | Default for external walls, roofs and floor slabs with fire requirements: the flame-retardant formulation meets GB 8624 B1 (B-s1,d0) at 0.029 W/m·K with 75 °C service temperature. | — | 0.55 | 3 | 25 Shore D |
B2This page Standard combustibility grade | Choose the lower-cost standard combustibility grade only for buried, subgrade or industrial insulation where no fire classification is demanded; conductivity is unchanged at 0.029 W/m·K. | — | 0.55 | 3 | 25 Shore D |
What is XPS 500 B2?
XPS 500 B2 is XPS 500 in the B2 grade — choose the lower-cost standard combustibility grade only for buried, subgrade or industrial insulation where no fire classification is demanded; conductivity is unchanged at 0.029 W/m·K. XPS 500 B2 has a tensile strength of 0.55 MPa (0.0798 ksi), weaker than 88% of polymer grades. Elongation at break is 3% and the elastic modulus is 0.03 GPa (0.0036 Msi). XPS 500 B2 has a density of 0.05 g/cm³ (0.0017 lb/in³), lighter than 89% of polymer grades. Its glass-transition temperature is 100°C (212 °F). B1 is the default condition FabDigit quotes; B2 is available on request or by drawing note.
Advantages
- Easy to machine — 88/100, better than 92% of polymer grades
- Lightweight — 0.05 g/cm³ (0.0017 lb/in³), better than 89% of polymer grades
Limitations
- Poor heat conductor — 0.03 W/m·K (0.0168 BTU/hr·ft·°F), worse than 98% of polymer grades
- Degrades in UV without stabilisers — 20/100, worse than 88% of polymer grades
- Limited ductility — 3%, worse than 83% of polymer grades
- Difficult to weld — 10/100, worse than 82% of polymer grades
- Limited formability — 15/100, worse than 79% of polymer grades
XPS 500 B2 properties
Typical room-temperature values for XPS 500 B2; 19 are specific to this condition. Other listed values are XPS 500 reference data and may not represent this condition. Bars are the position among polymer grades.
Physical4
XPS 500 B2 has a density of 0.05 g/cm³ (0.0017 lb/in³), lighter than 89% of polymer grades. Its glass-transition temperature is 100°C (212 °F).
Mechanical11
XPS 500 B2 has a tensile strength of 0.55 MPa (0.0798 ksi), weaker than 88% of polymer grades. Elongation at break is 3% and the elastic modulus is 0.03 GPa (0.0036 Msi).
Thermal9
XPS 500 B2 is rated for continuous service to 75°C (167 °F). It conducts heat at 0.03 W/m·K (0.0168 BTU/hr·ft·°F), worse than 98% of polymer grades. Thermal expansion is 70 µm/m·K (38.9 µin/in·°F).
Electrical3
XPS 500 B2 has an electrical resistivity of 1×10¹⁴ Ω·m.
Chemical & Environmental3
Corrosion resistance is excellent (85/100), better than 65% of polymer grades. UV resistance is poor.
Sustainability4
Producing a kilogram of XPS 500 B2 takes about 100 MJ of energy and emits 7.5 kg of CO₂ — less than 61% of polymer grades. Typical recycled content is 10%.
Manufacturability4
XPS 500 B2's machinability is excellent (88/100, better than 92% of polymer grades); weldability not recommended (10/100); formability poor (15/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with XPS 500 B2
Is XPS 500 easy to machine?
Hot-wire cutting, band saw, circular saw and CNC routing all work with very low cutting force. Manage chip removal and the static cling of foam dust with extraction.
Can XPS 500 be welded?
No conventional welding process applies. Board joints can be fused with hot air or a hot plate, or bonded with polyurethane foam adhesive or water-based adhesives.
Can XPS 500 be formed, bent or molded?
Formed by extrusion foaming; finished board cannot be re-bent with heat. Profiled parts are obtained by cutting or grooving.
What surface finishes work on XPS 500?
Remove the extrusion skin or scarify the face before applying crack-resistant mortar with reinforcing mesh. Use only water-based or solvent-free paints and adhesives — no bitumen or petrol-type solvent systems — and cover outdoor stock against UV.
XPS 500 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| blowing agent residue (CO2 / HFC-152a / residual blowing gas in cells, replaced by air with ageing | 0.5 – 4 | 2 |
| flame retardant (polymeric brominated, HB1 grades only; HBCD phased out under Stockholm Convention | 0.3 – 2.5 | 1.2 |
| nucleating agent (talc)controls cell size | 0.2 – 1 | 0.5 |
| graphite / carbon blackgraphite-modified variants only | 0 – 2 | 0 |
| pigment / processing aid | 0 – 1 | 0.3 |
| polystyrene (PS)general-purpose GPPS extrusion foam base, may contain recycled PS | ≥ 92 (balance) | — |
XPS 500 B2 — frequently asked
What is XPS 500 B2 used for?
XPS 500 B2 is typically used for heavy load floor insulation, road embankment insulation, highway and airport subgrade frost protection, parking deck and ramp insulation, industrial cold-store floor insulation and under-slab insulation for warehouse slabs. In short: high-strength traffic-grade XPS; 500 kPa load class; 75 °C service limit.
What is the tensile strength of XPS 500 B2?
XPS 500 B2 has a typical tensile strength of 0.55 MPa (0.0798 ksi) — weaker than 88% of polymer grades. Strength varies by condition: see the 4 listed tempers.
Is XPS 500 B2 easy to machine?
Yes — machinability is rated excellent (88/100, better than 92% of polymer grades). Hot-wire cutting, band saw, circular saw and CNC routing all work with very low cutting force. Manage chip removal and the static cling of foam dust with extraction.
Can XPS 500 B2 be welded?
Not readily — weldability is rated not recommended (10/100). No conventional welding process applies. Board joints can be fused with hot air or a hot plate, or bonded with polyurethane foam adhesive or water-based adhesives.
What surface finishes work on XPS 500 B2?
Remove the extrusion skin or scarify the face before applying crack-resistant mortar with reinforcing mesh. Use only water-based or solvent-free paints and adhesives — no bitumen or petrol-type solvent systems — and cover outdoor stock against UV.
Can XPS 500 B2 be formed, bent or molded?
Formed by extrusion foaming; finished board cannot be re-bent with heat. Profiled parts are obtained by cutting or grooving.
What is the maximum service temperature of XPS 500 B2?
XPS 500 B2 is rated for continuous use to about 75°C (167 °F), and briefly to 90°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- ASTM C578 Rigid Cellular Polystyrene Thermal Insulation — ASTM (2022)
- FOAMULAR / high-compressive XPS board technical data — Owens Corning (2023)
- ASHRAE Handbook — Fundamentals, insulation properties — ASHRAE (2021)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.