POM-C ESD ESD-SD
Additive grade
also Ultraform N2320 EC
ESD-SD = static-dissipative carbon-modified
Choose when charge must drain slowly and controlled (no hard grounding path), e.g. wafer/PCB handling nests.
Values for the ESD-SD condition
Other POM-C ESD grades and fills
POM-C ESD is listed in 5 conditions; see the grade overview at POM-C ESD.
Compare all 5 grades and fillsHide
| Grade · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness |
|---|---|---|---|---|---|
ESD + PTFE lubricated bearing grade | Choose for ESD-safe sliding/bearing parts where low friction and wear life outweigh strength. | 44 | 45 | 8 | 77 Shore D |
ESD extruded/compression stock shape (rod, plate) | Machining stock form of the conductive grade; slightly lower residual-stress and annealed for tight-tolerance CNC parts. | 49 | 50 | 10 | 79 Shore D |
ESD-CBDefault Conductive carbon-black filled | Default ESD acetal: black, truly conductive/dissipative, for tracks, guides and jigs that must bleed charge quickly. | — | 52 | 12 | — |
ESD-SDThis page Static-dissipative carbon-modified | Choose when charge must drain slowly and controlled (no hard grounding path), e.g. wafer/PCB handling nests. | 54 | 55 | 15 | 79 Shore D |
Carbon-fibre reinforced conductive | Use where stiffness, creep resistance and low CTE matter as much as conductivity, e.g. long ESD-safe guide rails. | — | 95 | 3 | — |
What is POM-C ESD ESD-SD?
POM-C ESD ESD-SD is POM-C ESD in the ESD-SD grade — choose when charge must drain slowly and controlled (no hard grounding path), e.g. wafer/PCB handling nests. POM-C ESD ESD-SD has a yield strength of 54 MPa (7.83 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 60% of polymer grades. Elongation at break is 15% and the elastic modulus is 3 GPa (0.435 Msi). POM-C ESD ESD-SD has a density of 1.42 g/cm³ (0.0513 lb/in³), heavier than 83% of polymer grades. Its glass-transition temperature is -60°C (-76 °F). ESD-CB is the default condition FabDigit quotes; ESD-SD is available on request or by drawing note.
Advantages
- Conducts heat well — 0.4 W/m·K (0.231 BTU/hr·ft·°F), better than 93% of polymer grades
- Easy to machine — 85/100, better than 88% of polymer grades
- Good UV / weathering resistance — 70/100, better than 83% of polymer grades
Limitations
- Heavy — 1.42 g/cm³ (0.0513 lb/in³), worse than 83% of polymer grades
- High mold shrinkage — 1.9%, worse than 75% of polymer grades
POM-C ESD ESD-SD properties
Typical room-temperature values for POM-C ESD ESD-SD; 29 are specific to this condition. Other listed values are POM-C ESD reference data and may not represent this condition. Bars are the position among polymer grades.
Physical5
POM-C ESD ESD-SD has a density of 1.42 g/cm³ (0.0513 lb/in³), heavier than 83% of polymer grades. Its glass-transition temperature is -60°C (-76 °F).
Mechanical16
POM-C ESD ESD-SD has a yield strength of 54 MPa (7.83 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 60% of polymer grades. Elongation at break is 15% and the elastic modulus is 3 GPa (0.435 Msi).
Thermal11
POM-C ESD ESD-SD is rated for continuous service to 100°C (212 °F). It conducts heat at 0.4 W/m·K (0.231 BTU/hr·ft·°F), better than 93% of polymer grades. Thermal expansion is 100 µm/m·K (55.6 µin/in·°F).
Electrical3
POM-C ESD ESD-SD has an electrical resistivity of 100,000 Ω·m.
Chemical & Environmental3
Corrosion resistance is very good (72/100), worse than 70% of polymer grades. UV resistance is very good.
Sustainability4
Producing a kilogram of POM-C ESD ESD-SD takes about 100 MJ of energy and emits 4 kg of CO₂ — less than 61% of polymer grades. Typical recycled content is 0%.
Manufacturability8
POM-C ESD ESD-SD's machinability is excellent (85/100, better than 88% of polymer grades); weldability fair (40/100); formability fair (45/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with POM-C ESD ESD-SD
Is POM-C ESD easy to machine?
Machines like unfilled acetal with sharp polished-flute carbide tools and high speeds; carbon black is mildly abrasive, keep chips clear and avoid heat build-up to prevent gumming.
Can POM-C ESD be welded?
Hot-plate, ultrasonic and vibration welding are feasible with joint-design care; solvent bonding is impractical and adhesives need plasma/flame or chemical pre-treatment.
Can POM-C ESD be formed, bent or molded?
Dry lightly (80 °C, 2–3 h) if wet, melt 185–210 °C, mold 80–100 °C; disperse carbon black with adequate back-pressure and expect ~1.4–2.2 % shrinkage with anisotropy in thick sections; never exceed 230 °C or hold long (formaldehyde evolution).
What surface finishes work on POM-C ESD?
Cannot be plated or painted without pretreatment; supplied black with matte surface, so functional finishing is limited to machining, light bead-blast, or laser marking (contrast is poor on black).
POM-C ESD chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| conductive carbon blacksets 10³–10⁶ Ω surface resistivity in the default grade | 4 – 15 | 8 |
| heat/formaldehyde stabilizers, acid scavproprietary additive package | 0.5 – 2 | 1 |
| polyoxymethylene copolymer (formaldehydePOM-C base resin | ≥ 82 (balance) | — |
POM-C ESD ESD-SD — frequently asked
What is POM-C ESD ESD-SD used for?
POM-C ESD ESD-SD is typically used for semiconductor handling components, printer and copier mechanisms and conveyor rollers in electronics assembly. In short: static-dissipative acetal; low-friction ESD moving parts; black-only surface.
What is the yield strength of POM-C ESD ESD-SD?
POM-C ESD ESD-SD has a typical yield strength of 54 MPa (7.83 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 60% of polymer grades. Strength varies by condition: see the 5 listed tempers.
Is POM-C ESD ESD-SD easy to machine?
Yes — machinability is rated excellent (85/100, better than 88% of polymer grades). Machines like unfilled acetal with sharp polished-flute carbide tools and high speeds; carbon black is mildly abrasive, keep chips clear and avoid heat build-up to prevent gumming.
Can POM-C ESD ESD-SD be welded?
With care — weldability is rated fair (40/100). Hot-plate, ultrasonic and vibration welding are feasible with joint-design care; solvent bonding is impractical and adhesives need plasma/flame or chemical pre-treatment.
What surface finishes work on POM-C ESD ESD-SD?
Cannot be plated or painted without pretreatment; supplied black with matte surface, so functional finishing is limited to machining, light bead-blast, or laser marking (contrast is poor on black).
Can POM-C ESD ESD-SD be formed, bent or molded?
Dry lightly (80 °C, 2–3 h) if wet, melt 185–210 °C, mold 80–100 °C; disperse carbon black with adequate back-pressure and expect ~1.4–2.2 % shrinkage with anisotropy in thick sections; never exceed 230 °C or hold long (formaldehyde evolution).
What is the maximum service temperature of POM-C ESD ESD-SD?
POM-C ESD ESD-SD is rated for continuous use to about 100°C (212 °F), and briefly to 140°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between POM-C ESD ESD-CB and POM-C ESD ESD-SD?
ESD-CB is the default condition — default ESD acetal: black, truly conductive/dissipative, for tracks, guides and jigs that must bleed charge quickly. ESD-SD: choose when charge must drain slowly and controlled (no hard grounding path), e.g. wafer/PCB handling nests. Yield strength is 54 MPa in ESD-CB versus 54 MPa in ESD-SD.
Sources
- Ultraform N2320 EC (electrically conductive POM copolymer) product information — BASF (2022)
- TECAFORM AH ELS / AH SD stock shape data sheets — Ensinger (2023)
- CAMPUS plastics database — POM-C conductive and antistatic grades — CWFG/CAMPUS (2024)
- ISO 527, ISO 178, ISO 75, ISO 306, IEC 62631 test methods — ISO/IEC (2019)
- IEC 61340-5-1 Protection of electronic devices from electrostatic phenomena — IEC (2016)
- Engineered Materials Handbook Vol. 2: Engineering Plastics — ASM International (1988)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.