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Copper Alloy C73500-H01

Supply condition

UNS C73500

H01 = quarter hard

Pick when moderate stiffness is needed but the part still has to be formed or bent across the grain.

High cost $$$$

Values for the H01 condition

Other C73500 tempers and conditions

C73500 is listed in 8 conditions; see the grade overview at C73500.

Compare all 8 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed
Pick for deep drawing, spinning and severe bending of decorative parts before final work-hardening.1453854078 HB6.5 % IACS
As hot rolled
Mill hot-rolled plate/bar condition for machined blanks and parts that will be finished after forming.1603803585 HB6.5 % IACS
H01This page
Quarter hard
Pick when moderate stiffness is needed but the part still has to be formed or bent across the grain.31043020108 HB6.3 % IACS
H02Default
Half hard
The general-purpose stocked temper: good balance of strength, formability and finish for hardware, flatware and instrument parts.41548010130 HB6.2 % IACS
Full hard
Pick for flat springs, contacts and stiff stamped parts needing only gentle forming with the grain.5255854160 HB6 % IACS
Extra hard
Pick for high-load springs, snap parts and flat stock where maximum strength matters more than bending.5706553180 HB6 % IACS
Spring hard
Spring strip for relay blades, contacts and clips formed only in simple bends along the rolling direction.6206902195 HB6 % IACS
Extra spring hard
Maximum-strength strip for thin high-deflection springs; essentially no cross-grain formability.6607251.512 HRC6 % IACS

What is C73500-H01?

C73500-H01 is C73500 supplied in the H01 condition — pick when moderate stiffness is needed but the part still has to be formed or bent across the grain. C73500-H01 has a yield strength of 310 MPa (45 ksi) and a tensile strength of 430 MPa (62.4 ksi) — stronger than 64% of copper alloy grades. Elongation at break is 20% and the elastic modulus is 127 GPa (18.4 Msi). C73500-H01 has a density of 8.86 g/cm³ (0.32 lb/in³), heavier than 68% of copper alloy grades. It melts at 1,080°C (1,976 °F). H02 is the default condition FabDigit quotes; H01 is available on request or by drawing note.

Advantages

  • Polishes to a fine finish — 90/100, better than 99% of copper alloy grades
  • Forms and bends easily — 70/100, better than 80% of copper alloy grades

Limitations

  • Low electrical conductivity — 6.3 % IACS, worse than 92% of copper alloy grades
  • High embodied carbon — 5.6 kg CO₂/kg, worse than 91% of copper alloy grades
  • Poor heat conductor — 33 W/m·K (19.1 BTU/hr·ft·°F), worse than 89% of copper alloy grades

C73500-H01 properties

Typical room-temperature values for C73500-H01; 12 are specific to this condition. Other listed values are C73500 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C73500-H01 has a density of 8.86 g/cm³ (0.32 lb/in³), heavier than 68% of copper alloy grades. It melts at 1,080°C (1,976 °F).

Density8.86 g/cm³0.32 lb/in³
Melting Point (Solidus)1,080°C1,976 °F
Liquidus Temperature1,110°C2,030 °F

Mechanical12

C73500-H01 has a yield strength of 310 MPa (45 ksi) and a tensile strength of 430 MPa (62.4 ksi) — stronger than 64% of copper alloy grades. Elongation at break is 20% and the elastic modulus is 127 GPa (18.4 Msi).

Elastic (Young's) Modulus127 GPa18.4 Msi
Shear Modulus47 GPa6.8 Msi
Bulk Modulus128 GPa18.6 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)430 MPa62.4 ksi
Yield Strength (0.2% offset)310 MPa45 ksi
Elongation at Break20%
Shear Strength305 MPa44.2 ksi
Fatigue Strength (Endurance Limit)185 MPa26.8 ksi
Hardness, Brinell108 HB
Hardness, Rockwell B60 HRB
Hardness, Vickers140 HV

Thermal6

C73500-H01 is rated for continuous service to 200°C (392 °F). It conducts heat at 33 W/m·K (19.1 BTU/hr·ft·°F), worse than 89% of copper alloy grades. Thermal expansion is 16.2 µm/m·K (9 µin/in·°F).

Thermal Conductivity33 W/m·K19.1 BTU/hr·ft·°F
Specific Heat Capacity377 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)16.2 µm/m·K9 µin/in·°F
Latent Heat of Fusion210 J/g90.3 BTU/lb
Max Service Temperature (continuous)200°C392 °F
Min Service Temperature-200°C-328 °F

Electrical3

C73500-H01 conducts electricity at 6.3 % IACS, worse than 92% of copper alloy grades.

Electrical Conductivity6.3 % IACS
Electrical Resistivity2.78×10⁻⁷ Ω·m10.9 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (62/100), worse than 57% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.25 V
Corrosion ResistanceGood62/100
Chemical Resistance SummaryGood resistance to fresh water, atmospheres, foodstuffs and mild alkalis; tarnishes slowly to a grey-brown film. Attacked by oxidising and mineral acids, sulphides and moist ammonia; ammonia and amines can cause stress-corrosion cracking in hard tempers, and hot chloride waters can cause dezincification.

Sustainability4

Producing a kilogram of C73500-H01 takes about 78 MJ of energy and emits 5.6 kg of CO₂ — more than 90% of copper alloy grades. Typical recycled content is 35%.

Embodied Energy (primary production)78 MJ/kg33,534 BTU/lb
Embodied Carbon (primary production)5.6 kg CO₂/kg
Embodied Water250 L/kg30 gal/lb
Typical Recycled Content35%

Manufacturability8

C73500-H01's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability good (55/100); formability very good (70/100).

MachinabilityPoor30/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityGood55/100
Formability (cold)Very good70/100
CastabilityFair40/100
Brazeability / SolderabilityExcellent85/100
PolishabilityExcellent90/100
Anodizing Responsen/a — copper alloy; use bright polish, lacquer, nickel/chrome or silver plating instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C73500-H01

Is C73500 easy to machine?

Rated only ~20 % of free-cutting brass — gummy, work-hardening chips; use sharp positive-rake carbide/HSS tools, moderate speed, heavy feed and soluble-oil coolant, and avoid dwelling.

Can C73500 be welded?

Solders and brazes very well and resistance/spot welds acceptably; gas welding is not recommended because of zinc loss, and TIG requires low heat input plus post-weld stress relief.

Can C73500 be formed, bent or molded?

Excellent cold formability in O61/H01 (deep drawing, spinning, stamping); interanneal at 600–750 °C and stress-relieve hard tempers at ~250–300 °C to avoid ammonia stress-corrosion cracking.

What surface finishes work on C73500?

Takes a bright silver-white polish and buffs easily; commonly lacquered, oxidised/antiqued, or nickel-, chrome- or silver-plated. Not anodizable.

C73500 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Cu70.5 – 73.572
NiNi + Co16.5 – 19.518
Mn≤ 0.5—
Fe≤ 0.25—
Pb≤ 0.1—
Znremainder, ~7–13 %balance—

C73500-H01 — frequently asked

What is C73500-H01 used for?

C73500-H01 is typically used for flatware, hardware fittings, optical/instrument parts and zippers. In short: spring-temper nickel silver; bright silver-white finish; low machinability, good formability.

What is the yield strength of C73500-H01?

C73500-H01 has a typical yield strength of 310 MPa (45 ksi) and a tensile strength of 430 MPa (62.4 ksi) — stronger than 64% of copper alloy grades. Strength varies by condition: see the 8 listed tempers.

Is C73500-H01 easy to machine?

Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Rated only ~20 % of free-cutting brass — gummy, work-hardening chips; use sharp positive-rake carbide/HSS tools, moderate speed, heavy feed and soluble-oil coolant, and avoid dwelling.

Can C73500-H01 be welded?

Yes — weldability is rated good (55/100). Solders and brazes very well and resistance/spot welds acceptably; gas welding is not recommended because of zinc loss, and TIG requires low heat input plus post-weld stress relief.

What surface finishes work on C73500-H01?

Takes a bright silver-white polish and buffs easily; commonly lacquered, oxidised/antiqued, or nickel-, chrome- or silver-plated. Not anodizable.

Can C73500-H01 be formed, bent or molded?

Excellent cold formability in O61/H01 (deep drawing, spinning, stamping); interanneal at 600–750 °C and stress-relieve hard tempers at ~250–300 °C to avoid ammonia stress-corrosion cracking.

What is the maximum service temperature of C73500-H01?

C73500-H01 is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C73500-H02 and C73500-O61?

H02 is the default condition — the general-purpose stocked temper: good balance of strength, formability and finish for hardware, flatware and instrument parts. O61: pick for deep drawing, spinning and severe bending of decorative parts before final work-hardening. Yield strength is 415 MPa in H02 versus 145 MPa in O61.

Sources

  1. ASTM B122/B122M — Copper-Nickel-Tin, Copper-Nickel-Zinc (Nickel Silver) Plate, Sheet, Strip and Rolled Bar — ASTM International (2021)
  2. ASTM B151/B151M — Copper-Nickel-Zinc and Copper-Nickel Rod and Bar — ASTM International (2021)
  3. CDA Alloy Database — C73500 Nickel Silver 72-18 — Copper Development Association (2023)
  4. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  5. GB/T 2040 / GB/T 2059 (BZn18-10 ) — SAC (2017)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.