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Copper Alloy C69700-H04

Supply condition

UNS C69700

H04 = full hard

Maximum strength/wear resistance for stems and shafts; ductility and further forming are limited.

High cost $$$$

Values for the H04 condition

Other C69700 tempers and conditions

C69700 is listed in 6 conditions; see the grade overview at C69700.

Compare all 6 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Soft annealed
Pick when maximum ductility for bending, riveting or secondary forming is needed.1704153885 HB—
M20Default
As hot rolled
Standard stocked condition for extruded rod and bar destined for machining or forging.24048528120 HB—
As hot extruded
Condition of finished hot forgings (valve bodies, stems) with no subsequent cold work.25550025128 HB6.5 % IACS
Quarter hard
Light cold draw for better straightness, surface finish and moderate strength increase on rod.38055018150 HB—
Half hard
Use where higher yield strength and good chip control on automatic lathes are required.45062012170 HB—
H04This page
Full hard
Maximum strength/wear resistance for stems and shafts; ductility and further forming are limited.5206908185 HB—

What is C69700-H04?

C69700-H04 is C69700 supplied in the H04 condition — maximum strength/wear resistance for stems and shafts; ductility and further forming are limited. C69700-H04 has a yield strength of 520 MPa (75.4 ksi) and a tensile strength of 690 MPa (100 ksi) — stronger than 91% of copper alloy grades. Elongation at break is 8% and the elastic modulus is 105 GPa (15.2 Msi). C69700-H04 has a density of 8.3 g/cm³ (0.3 lb/in³), lighter than 80% of copper alloy grades. It melts at 820°C (1,508 °F). M20 is the default condition FabDigit quotes; H04 is available on request or by drawing note.

Advantages

  • Low embodied carbon — 2.9 kg CO₂/kg, better than 99% of copper alloy grades
  • High strength — 520 MPa (75.4 ksi), better than 91% of copper alloy grades
  • Easy to machine — 78/100, better than 82% of copper alloy grades

Limitations

  • Low electrical conductivity — 6.5 % IACS, worse than 91% of copper alloy grades
  • Poor heat conductor — 33 W/m·K (19.1 BTU/hr·ft·°F), worse than 89% of copper alloy grades
  • Limited ductility — 8%, worse than 83% of copper alloy grades
  • Limited formability — 15/100, worse than 79% of copper alloy grades
  • Difficult to weld — 25/100, worse than 78% of copper alloy grades

C69700-H04 properties

Typical room-temperature values for C69700-H04; 10 are specific to this condition. Other listed values are C69700 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C69700-H04 has a density of 8.3 g/cm³ (0.3 lb/in³), lighter than 80% of copper alloy grades. It melts at 820°C (1,508 °F).

Density8.3 g/cm³0.3 lb/in³
Melting Point (Solidus)820°C1,508 °F
Liquidus Temperature900°C1,652 °F

Mechanical12

C69700-H04 has a yield strength of 520 MPa (75.4 ksi) and a tensile strength of 690 MPa (100 ksi) — stronger than 91% of copper alloy grades. Elongation at break is 8% and the elastic modulus is 105 GPa (15.2 Msi).

Elastic (Young's) Modulus105 GPa15.2 Msi
Shear Modulus39 GPa5.7 Msi
Bulk Modulus110 GPa16 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)690 MPa100 ksi
Yield Strength (0.2% offset)520 MPa75.4 ksi
Elongation at Break8%
Shear Strength390 MPa56.6 ksi
Fatigue Strength (Endurance Limit)195 MPa28.3 ksi
Charpy V-Notch Impact (RT)30 J22.1 ft·lbf
Hardness, Brinell185 HB
Hardness, Rockwell B90 HRB

Thermal6

C69700-H04 is rated for continuous service to 200°C (392 °F). It conducts heat at 33 W/m·K (19.1 BTU/hr·ft·°F), worse than 89% of copper alloy grades. Thermal expansion is 20.5 µm/m·K (11.4 µin/in·°F).

Thermal Conductivity33 W/m·K19.1 BTU/hr·ft·°F
Specific Heat Capacity380 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)20.5 µm/m·K11.4 µin/in·°F
Latent Heat of Fusion175 J/g75.2 BTU/lb
Max Service Temperature (continuous)200°C392 °F
Min Service Temperature-196°C-321 °F

Electrical3

C69700-H04 conducts electricity at 6.5 % IACS, worse than 91% of copper alloy grades.

Electrical Conductivity6.5 % IACS
Electrical Resistivity2.65×10⁻⁷ Ω·m10.4 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (62/100), worse than 57% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.25 V
Corrosion ResistanceGood62/100
Chemical Resistance SummaryGood in fresh and mildly brackish water, steam and non-oxidizing acids; silicon addition markedly improves dezincification and stress-corrosion resistance versus plain brass. Attacked by ammonia, oxidizing acids, chlorides at high velocity and by sulphides; lead content excludes it from lead-free potable-water service.

Sustainability4

Producing a kilogram of C69700-H04 takes about 45 MJ of energy and emits 2.9 kg of CO₂ — less than 97% of copper alloy grades. Typical recycled content is 40%.

Embodied Energy (primary production)45 MJ/kg19,347 BTU/lb
Embodied Carbon (primary production)2.9 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content40%

Manufacturability7

C69700-H04's machinability is very good (78/100, better than 82% of copper alloy grades); weldability poor (25/100); formability poor (15/100).

MachinabilityVery good78/100
Machinability Rating (AISI 1212 = 100 %)75%
WeldabilityPoor25/100
Formability (cold)Poor15/100
Brazeability / SolderabilityVery good70/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper alloys are not anodized; use clear lacquer, tin/nickel plating or chemical patina

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C69700-H04

Is C69700 easy to machine?

Machines well for a silicon brass thanks to the lead: use sharp positive-rake carbide, high speed, light feeds and copious coolant; chips are shorter than lead-free silicon brass but longer than C36000.

Can C69700 be welded?

Not recommended for fusion welding — lead promotes hot cracking and porosity; join by soft soldering or silver brazing with low heat input, or use mechanical joints.

Can C69700 be formed, bent or molded?

Excellent hot workability (extrusion/forging around 650–780 °C); cold formability is only moderate, so anneal between heavy bending or heading operations.

What surface finishes work on C69700?

Polishes to a bright golden finish and takes nickel, chrome or tin plating readily; not anodizable, so use lacquer or patina for decorative parts.

C69700 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Cu75 – 8077.5
Sisolid-solution strengthener; improves dezincification resistance2.5 – 3.53
Pbfree-machining addition0.5 – 1.51
Fe≤ 0.2—
Znremainder, nominally ~18–19%balance—

C69700-H04 — frequently asked

What is C69700-H04 used for?

C69700-H04 is typically used for machined plumbing components, valve parts and hardware fittings. In short: free-machining silicon brass; service to 200 °C; machines faster than C69430.

What is the yield strength of C69700-H04?

C69700-H04 has a typical yield strength of 520 MPa (75.4 ksi) and a tensile strength of 690 MPa (100 ksi) — stronger than 91% of copper alloy grades. Strength varies by condition: see the 6 listed tempers.

Is C69700-H04 easy to machine?

Yes — machinability is rated very good (78/100, better than 82% of copper alloy grades). Machines well for a silicon brass thanks to the lead: use sharp positive-rake carbide, high speed, light feeds and copious coolant; chips are shorter than lead-free silicon brass but longer than C36000.

Can C69700-H04 be welded?

Not readily — weldability is rated poor (25/100). Not recommended for fusion welding — lead promotes hot cracking and porosity; join by soft soldering or silver brazing with low heat input, or use mechanical joints.

What surface finishes work on C69700-H04?

Polishes to a bright golden finish and takes nickel, chrome or tin plating readily; not anodizable, so use lacquer or patina for decorative parts.

Can C69700-H04 be formed, bent or molded?

Excellent hot workability (extrusion/forging around 650–780 °C); cold formability is only moderate, so anneal between heavy bending or heading operations.

What is the maximum service temperature of C69700-H04?

C69700-H04 is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C69700-M20 and C69700-H04?

M20 is the default condition — standard stocked condition for extruded rod and bar destined for machining or forging. H04: maximum strength/wear resistance for stems and shafts; ductility and further forming are limited. Yield strength is 240 MPa in M20 versus 520 MPa in H04.

Sources

  1. C69700 alloy datasheet (leaded silicon brass) — Copper Development Association (2023)
  2. ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys and Special-Purpose Materials — ASM International (1990)
  3. ASTM B124 / B283 — Copper and copper-alloy forging rod, bar and shapes; die forgings — ASTM International (2020)
  4. ASM Handbook Vol.13B — Corrosion: Materials (copper alloys) — ASM International (2005)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.