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XPS X500

Grade

ASTM C578 · EN 13164 · GB GB/T 10801.2

X500 = x500 / ASTM C578 Type V

Highest-density XPS for airport aprons, tank bases, deep foundations and other high compressive loads.

Standard cost $$

Values for the X500 condition

Other XPS grades and fills

XPS is listed in 8 conditions; see the grade overview at XPS.

Compare all 8 grades and fillsHide
Grade · open for datasheetBest forYield MPaTensile MPaElong. %Hardness
X150 / ASTM C578 Type X
Lightest economy grade for cavity walls, sheathing and non-load-bearing insulation.0.260.33—
X200 / W200
Intermediate grade for wall and floor heating layers where 250 kPa is not required.0.350.43—
X250Default
X250 / ASTM C578 Type IV
Mainstream building board for roofs, floors and under-slab insulation; best cost/strength balance.0.40.453—
flame-retardant board, GB 8624 B1(B) rating
Mandatory grade for most Chinese building façade and roof insulation projects requiring B1 fire performance.0.40.453—
flame-retardant board, GB 8624 B2 rating
Economy fire-rated board for floors, under-slab and non-façade uses where only B2 is required.0.40.453—
X300 / ASTM C578 Type VI
For loaded floors, inverted roofs and cold-store floors with moderate traffic.0.450.53.5—
X350 / ASTM C578 Type VII
High-strength grade for road/railway frost protection and heavy under-slab loads.0.520.63.5—
X500This page
X500 / ASTM C578 Type V
Highest-density XPS for airport aprons, tank bases, deep foundations and other high compressive loads.0.70.84—

What is XPS X500?

XPS X500 is XPS in the X500 grade — highest-density XPS for airport aprons, tank bases, deep foundations and other high compressive loads. XPS X500 has a yield strength of 0.7 MPa (0.102 ksi) and a tensile strength of 0.8 MPa (0.116 ksi) — weaker than 96% of polymer grades. Elongation at break is 4% and the elastic modulus is 0.02 GPa (0.0033 Msi). XPS X500 has a density of 0.05 g/cm³ (0.0017 lb/in³), lighter than 89% of polymer grades. Its glass-transition temperature is 100°C (212 °F). X250 is the default condition FabDigit quotes; X500 is available on request or by drawing note.

Advantages

  • Lightweight — 0.05 g/cm³ (0.0017 lb/in³), better than 89% of polymer grades
  • Easy to machine — 85/100, better than 88% of polymer grades

Limitations

  • Low strength — 0.7 MPa (0.102 ksi), worse than 96% of polymer grades
  • Poor heat conductor — 0.03 W/m·K (0.0173 BTU/hr·ft·°F), worse than 96% of polymer grades
  • Degrades in UV without stabilisers — 15/100, worse than 95% of polymer grades
  • Limited formability — 15/100, worse than 79% of polymer grades
  • Limited ductility — 4%, worse than 78% of polymer grades

XPS X500 properties

Typical room-temperature values for XPS X500; 18 are specific to this condition. Other listed values are XPS reference data and may not represent this condition. Bars are the position among polymer grades.

Physical4

XPS X500 has a density of 0.05 g/cm³ (0.0017 lb/in³), lighter than 89% of polymer grades. Its glass-transition temperature is 100°C (212 °F).

Density0.05 g/cm³0 lb/in³
Glass Transition (Tg)100°C212 °F
Water Absorption (24 h)0.2%
Water Absorption (Saturation)0.7%

Mechanical10

XPS X500 has a yield strength of 0.7 MPa (0.102 ksi) and a tensile strength of 0.8 MPa (0.116 ksi) — weaker than 96% of polymer grades. Elongation at break is 4% and the elastic modulus is 0.02 GPa (0.0033 Msi).

Elastic (Young's) Modulus0.02 GPa0 Msi
Poisson's Ratio0.3
Tensile Strength (Ultimate)0.8 MPa0.12 ksi
Yield Strength (0.2% offset)0.7 MPa0.1 ksi
Elongation at Break4%
Compressive Strength0.55 MPa0.08 ksi
Compressive Modulus0.01 GPa0 Msi
Flexural Strength0.9 MPa0.13 ksi
Flexural Modulus0.03 GPa0 Msi
Shear Strength0.33 MPa0.05 ksi

Thermal9

XPS X500 is rated for continuous service to 75°C (167 °F). It conducts heat at 0.03 W/m·K (0.0173 BTU/hr·ft·°F), worse than 96% of polymer grades. Thermal expansion is 70 µm/m·K (38.9 µin/in·°F).

Thermal Conductivity0.03 W/m·K0.02 BTU/hr·ft·°F
Specific Heat Capacity1,450 J/kg·K0.35 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)70 µm/m·K38.9 µin/in·°F
Max Service Temperature (continuous)75°C167 °F
Min Service Temperature-50°C-58 °F
Vicat Softening Point (B50)95°C203 °F
Flammability (UL 94)Base grade burns (approx. HB); commercial boards use brominated polymeric FR to reach GB 8624 B1(B1 ) or B2 grade
Limiting Oxygen Index26%
Max Service Temperature (short-term)85°C185 °F

Electrical3

XPS X500 has an electrical resistivity of 1×10¹⁴ Ω·m.

Electrical Resistivity1×10¹⁴ Ω·m3.94×10²¹ µΩ·in
Dielectric Constant (1 MHz)1.07
Volume Resistivity1×10¹⁶ Ω·cm

Chemical & Environmental3

Corrosion resistance is very good (75/100), worse than 66% of polymer grades. UV resistance is poor.

Corrosion ResistanceVery good75/100
UV / Weathering ResistancePoor15/100
Chemical Resistance SummaryGood against water, dilute acids/alkalis, salts and cement/mortar; attacked and dissolved by aromatic and chlorinated solvents, ketones, gasoline, coal-tar and solvent-based adhesives; use water-based or PU adhesives.

Sustainability3

Producing a kilogram of XPS X500 takes about 100 MJ of energy and emits 4.5 kg of CO₂ — less than 61% of polymer grades. Typical recycled content is 10%.

Embodied Energy (primary production)100 MJ/kg42,992 BTU/lb
Embodied Carbon (primary production)4.5 kg CO₂/kg
Typical Recycled Content10%

Manufacturability4

XPS X500's machinability is excellent (85/100, better than 88% of polymer grades); weldability poor (20/100); formability poor (15/100).

MachinabilityExcellent85/100
WeldabilityPoor20/100
Formability (cold)Poor15/100
Processing Melt Temperature (typ.)200°C392 °F

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with XPS X500

Is XPS easy to machine?

Cuts easily with hot wire, knife, fine-tooth saw or CNC router; keep speeds low and vacuum the dust, and avoid overheating that melts/collapses cells.

Can XPS be welded?

Not structurally weldable; joints are made by tongue-and-groove interlock plus water-based or PU foam adhesive and taped seams.

Can XPS be formed, bent or molded?

Produced by continuous extrusion foaming with gas injection then sizing/skinning; boards are rigid and only mildly thermoformable, so shapes are cut rather than formed.

What surface finishes work on XPS?

Solvent-free coatings only; needs skin removal or grooving for plaster/mortar adhesion, and must be covered (render, screed, membrane) because it degrades under UV.

XPS chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
blowing agent (CO2 / HFO-1234ze / HCFC-1residual gas in closed cells; determines aged λ and carbon footprint1 – 63
flame retardant (brominated polymeric FRwith Sb2O3 or phosphate synergist in B1 grades0.5 – 2.51.2
talc (nucleating agent)0.2 – 1.50.5
pigment / colourantblue/pink/green brand colours0.05 – 0.50.2
polystyrene (styrene homopolymer)GPPS resin, often with some recycled PS≥ 90 (balance)—

XPS X500 — frequently asked

What is XPS X500 used for?

XPS X500 is typically used for roof/wall insulation panels, below-grade insulation, floral/craft foam and cold storage panels. In short: stronger, drier than EPS; closed-cell moisture resistance; below-grade insulation standard.

What is the yield strength of XPS X500?

XPS X500 has a typical yield strength of 0.7 MPa (0.102 ksi) and a tensile strength of 0.8 MPa (0.116 ksi) — weaker than 96% of polymer grades. Strength varies by condition: see the 8 listed tempers.

Is XPS X500 easy to machine?

Yes — machinability is rated excellent (85/100, better than 88% of polymer grades). Cuts easily with hot wire, knife, fine-tooth saw or CNC router; keep speeds low and vacuum the dust, and avoid overheating that melts/collapses cells.

Can XPS X500 be welded?

Not readily — weldability is rated poor (20/100). Not structurally weldable; joints are made by tongue-and-groove interlock plus water-based or PU foam adhesive and taped seams.

What surface finishes work on XPS X500?

Solvent-free coatings only; needs skin removal or grooving for plaster/mortar adhesion, and must be covered (render, screed, membrane) because it degrades under UV.

Can XPS X500 be formed, bent or molded?

Produced by continuous extrusion foaming with gas injection then sizing/skinning; boards are rigid and only mildly thermoformable, so shapes are cut rather than formed.

What is the maximum service temperature of XPS X500?

XPS X500 is rated for continuous use to about 75°C (167 °F), and briefly to 85°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between XPS X250 and XPS X500?

X250 is the default condition — mainstream building board for roofs, floors and under-slab insulation; best cost/strength balance. X500: highest-density XPS for airport aprons, tank bases, deep foundations and other high compressive loads. Yield strength is 0.4 MPa in X250 versus 0.7 MPa in X500.

Sources

  1. ASTM C578-22 Standard Specification for Rigid, Cellular Polystyrene Thermal Insulation — ASTM International (2022)
  2. EN 13164:2012+A1:2015 Thermal insulation products for buildings — Factory made XPS products — CEN (2015)
  3. STYROFOAM Brand XPS Insulation product data — Dow / DuPont Performance Building Solutions (2023)
  4. FOAMULAR XPS Insulation technical bulletins (Types X, IV, VI, VII, 600/1000) — Owens Corning (2022)
  5. Inventory of Carbon & Energy (ICE) — insulation materials — University of Bath / Circular Ecology (2019)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.