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Copper Alloy C72500-H02

Supply condition · default condition

UNS C72500 · EN CW351H, CuNi9Sn2

H02 = half hard

Default stocked strip temper: balanced strength and formability for stamped connector shells, lead frames and terminals.

High cost $$$$

Values for the H02 condition

Other C72500 tempers and conditions

C72500 is listed in 10 conditions; see the grade overview at C72500.

Compare all 10 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed
Pick for deep drawing, severe forming or as the starting stock before customer-side stamping and stress relief.1503803545 HRB11.5 % IACS
As hot rolled
Pick for heavier plate/bar stock where no cold-rolled temper is required and further machining or forming follows.1804103050 HRB11.5 % IACS
Quarter hard
Pick when moderate strength must be combined with tight-radius bending in both grain directions.4004701566 HRB11 % IACS
H02DefaultThis page
Half hard
Default stocked strip temper: balanced strength and formability for stamped connector shells, lead frames and terminals.480530976 HRB11 % IACS
Full hard
Pick for contact springs and clips needing higher yield and stress-relaxation resistance with simple, mostly good-way bends.550590583 HRB11 % IACS
H04 + stress relieved
Pick when formed springs must keep contact force at 100–150 °C; a low-temperature bake raises yield slightly and cuts stress relaxation.5806106187 HB11.5 % IACS
Extra hard
Pick when high spring force is needed and forming is limited to gentle good-way bends.605640487 HRB11 % IACS
Spring hard
Pick for high-force contact springs and washers where bend radii are generous and stress relief follows forming.655690390 HRB11 % IACS
Extra spring hard
Pick for thin-gauge, high-deflection springs where maximum yield strength outweighs formability.6907252.592 HRB11 % IACS
Strain hardened, half hard
Pick for the highest available strength in thin strip; forming must be limited to flat blanking or very light bends.725760294 HRB11 % IACS

What is C72500-H02?

C72500-H02 is C72500 supplied in the H02 condition — default stocked strip temper: balanced strength and formability for stamped connector shells, lead frames and terminals. C72500-H02 has a yield strength of 480 MPa (69.6 ksi) and a tensile strength of 530 MPa (76.9 ksi) — stronger than 88% of copper alloy grades. Elongation at break is 9% and the elastic modulus is 138 GPa (20 Msi). C72500-H02 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,060°C (1,940 °F).

Advantages

  • Stiff — 138 GPa (20 Msi), better than 95% of copper alloy grades
  • High strength — 480 MPa (69.6 ksi), better than 88% of copper alloy grades

Limitations

  • Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades
  • Limited ductility — 9%, worse than 79% of copper alloy grades
  • Poor heat conductor — 45 W/m·K (26 BTU/hr·ft·°F), worse than 76% of copper alloy grades

C72500-H02 properties

Typical room-temperature values for C72500-H02; 11 are specific to this condition. Other listed values are C72500 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C72500-H02 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,060°C (1,940 °F).

Density8.89 g/cm³0.32 lb/in³
Melting Point (Solidus)1,060°C1,940 °F
Liquidus Temperature1,127°C2,061 °F

Mechanical11

C72500-H02 has a yield strength of 480 MPa (69.6 ksi) and a tensile strength of 530 MPa (76.9 ksi) — stronger than 88% of copper alloy grades. Elongation at break is 9% and the elastic modulus is 138 GPa (20 Msi).

Elastic (Young's) Modulus138 GPa20 Msi
Shear Modulus52 GPa7.5 Msi
Bulk Modulus138 GPa20 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)530 MPa76.9 ksi
Yield Strength (0.2% offset)480 MPa69.6 ksi
Elongation at Break9%
Shear Strength330 MPa47.9 ksi
Fatigue Strength (Endurance Limit)230 MPa33.4 ksi
Hardness, Rockwell B76 HRB
Hardness, Vickers172 HV

Thermal5

C72500-H02 is rated for continuous service to 150°C (302 °F). It conducts heat at 45 W/m·K (26 BTU/hr·ft·°F), worse than 76% of copper alloy grades. Thermal expansion is 16.2 µm/m·K (9 µin/in·°F).

Thermal Conductivity45 W/m·K26 BTU/hr·ft·°F
Specific Heat Capacity377 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)16.2 µm/m·K9 µin/in·°F
Max Service Temperature (continuous)150°C302 °F
Min Service Temperature-200°C-328 °F

Electrical3

C72500-H02 conducts electricity at 11 % IACS, worse than 68% of copper alloy grades.

Electrical Conductivity11 % IACS
Electrical Resistivity1.57×10⁻⁷ Ω·m6.18 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is very good (70/100), better than 76% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.22 V
Corrosion ResistanceVery good70/100
Chemical Resistance SummaryGood resistance to atmospheric corrosion, fresh and flowing seawater, and mild acids; better stress-corrosion resistance than brasses. Attacked by oxidising acids, ammonia/amines, sulphides and mercury compounds.

Sustainability4

Producing a kilogram of C72500-H02 takes about 62 MJ of energy and emits 4.2 kg of CO₂ — more than 76% of copper alloy grades. Typical recycled content is 30%.

Embodied Energy (primary production)62 MJ/kg26,655 BTU/lb
Embodied Carbon (primary production)4.2 kg CO₂/kg
Embodied Water260 L/kg31.2 gal/lb
Typical Recycled Content30%

Manufacturability7

C72500-H02's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability good (55/100); formability good (55/100).

MachinabilityPoor30/100
Machinability Rating (AISI 1212 = 100 %)30%
WeldabilityGood55/100
Formability (cold)Good55/100
Brazeability / SolderabilityExcellent90/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper alloy; use tin, nickel, silver or gold plating instead

Common Calculations5

Specific Strength (UTS / density)calculated60 kN·m/kg
Specific Stiffness (E / density)calculated15.5 MN·m/kg
Modulus of Resiliencecalculated835 kJ/m³
Thermal Diffusivitycalculated13.4 mm²/s
Thermal Shock Resistance Indexcalculated11

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C72500-H02

Is C72500 easy to machine?

Gummy, low machinability (~20–30 % of free-cutting brass): use sharp, positive-rake carbide, high coolant flow and moderate speeds; harder tempers chip more cleanly than annealed.

Can C72500 be welded?

Resistance and laser welding are good; GTAW/GMAW possible with Cu-Ni filler but keep heat input low and avoid oxide/sulphur pickup — soldering and brazing are the preferred joining routes.

Can C72500 be formed, bent or molded?

Anneal or H01/H02 for deep drawing and tight bends; in H06–H14 restrict to good-way bends with generous radii and stress-relieve formed springs at 200–260 °C.

What surface finishes work on C72500?

Not anodizable; solders and plates readily with Sn, Ni, Ag or Au — Ni underplate is common for lead frames, and bright-rolled strip polishes to a warm silver-grey finish.

C72500 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Niincluding Co8.5 – 10.59.5
Sn1.8 – 2.82.3
Fe≤ 0.60.1
Mn≤ 0.20.05
Zn≤ 0.5—
Pb≤ 0.05—
CuCu + named elements 99.8 % minbalance—

C72500-H02 — frequently asked

What is C72500-H02 used for?

C72500-H02 is typically used for connectors, relay springs, lead frames and switch contacts. In short: beryllium-free spring alloy; good stress-relaxation resistance; solders and plates easily.

What is the yield strength of C72500-H02?

C72500-H02 has a typical yield strength of 480 MPa (69.6 ksi) and a tensile strength of 530 MPa (76.9 ksi) — stronger than 88% of copper alloy grades. Strength varies by condition: see the 10 listed tempers.

Is C72500-H02 easy to machine?

Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Gummy, low machinability (~20–30 % of free-cutting brass): use sharp, positive-rake carbide, high coolant flow and moderate speeds; harder tempers chip more cleanly than annealed.

Can C72500-H02 be welded?

Yes — weldability is rated good (55/100). Resistance and laser welding are good; GTAW/GMAW possible with Cu-Ni filler but keep heat input low and avoid oxide/sulphur pickup — soldering and brazing are the preferred joining routes.

What surface finishes work on C72500-H02?

Not anodizable; solders and plates readily with Sn, Ni, Ag or Au — Ni underplate is common for lead frames, and bright-rolled strip polishes to a warm silver-grey finish.

Can C72500-H02 be formed, bent or molded?

Anneal or H01/H02 for deep drawing and tight bends; in H06–H14 restrict to good-way bends with generous radii and stress-relieve formed springs at 200–260 °C.

What is the maximum service temperature of C72500-H02?

C72500-H02 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C72500-H02 and C72500-O61?

H02 is the default condition — default stocked strip temper: balanced strength and formability for stamped connector shells, lead frames and terminals. O61: pick for deep drawing, severe forming or as the starting stock before customer-side stamping and stress relief. Yield strength is 480 MPa in H02 versus 150 MPa in O61.

Sources

  1. ASTM B122/B122M — Copper-Nickel-Tin, Copper-Nickel and Copper-Nickel-Zinc Plate, Sheet, Strip and Rolled Bar — ASTM International (2022)
  2. EN 1654 / EN 1652 — Copper and copper alloys, strip for springs and connectors (CuNi9Sn2, CW351H) — CEN (2019)
  3. C72500 alloy datasheet (properties, tempers, machinability rating) — Copper Development Association (copper.org) (2023)
  4. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys and Special-Purpose Materials — ASM International (1990)
  5. ASM Handbook Vol. 13B — Corrosion: Materials (copper and copper alloys) — ASM International (2005)
  6. Cu-Ni-Sn connector strip datasheets (temper strength/hardness tables) — Wieland / Aurubis Stolberg / Materion (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.