XPS200 FLR (/)
Grade
GB GB/T 10801.2 XPS200
Choose the underfloor-heating board with foil facing or moulded studs for radiant floor screed layers, prioritising compressive load capacity and long-term dimensional stability up to 70 °C.
Values for the FLR condition
Other XPS200 grades and fills
XPS200 is listed in 4 conditions; see the grade overview at XPS200.
Compare all 4 grades and fillsHide
| Grade · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness |
|---|---|---|---|---|---|
CO₂-blown, HFC-free grade | Use the CO₂/HFO-blown board to meet environmental and green building material requirements in place of HCFC/HFC blowing agents, accepting slightly higher long-term conductivity of 0.032 W/m·K. | — | 0.4 | 2.5 | — |
/ | Choose the graphite-modified grey board when the insulation layer must stay thin: infrared absorbers reduce radiant heat transfer, giving 0.027 W/m·K at the same thickness. | — | 0.42 | 2.2 | — |
GB 8624 B1B-s1,d0 | Use where fire acceptance applies, such as external wall insulation systems; the flame-retardant formulation meets GB 8624 B1 (B-s1,d0) at a density of 32 kg/m³. | — | 0.43 | 2.5 | — |
FLRThis page / | Choose the underfloor-heating board with foil facing or moulded studs for radiant floor screed layers, prioritising compressive load capacity and long-term dimensional stability up to 70 °C. | — | 0.45 | 2.5 | — |
What is XPS200 FLR?
XPS200 FLR is XPS200 in the FLR grade — choose the underfloor-heating board with foil facing or moulded studs for radiant floor screed layers, prioritising compressive load capacity and long-term dimensional stability up to 70 °C. XPS200 FLR has a tensile strength of 0.45 MPa (0.0653 ksi), weaker than 90% of polymer grades. The elastic modulus is 0.01 GPa (0.0019 Msi). XPS200 FLR has a density of 0.03 g/cm³ (0.0012 lb/in³), lighter than 92% of polymer grades. Its glass-transition temperature is 100°C (212 °F).
Advantages
- Lightweight — 0.03 g/cm³ (0.0012 lb/in³), better than 92% of polymer grades
- Easy to machine — 80/100, better than 84% of polymer grades
Limitations
- Poor heat conductor — 0.03 W/m·K (0.0173 BTU/hr·ft·°F), worse than 96% of polymer grades
- Degrades in UV without stabilisers — 15/100, worse than 95% of polymer grades
- Limited formability — 10/100, worse than 87% of polymer grades
- Low stiffness — 0.01 GPa (0.0019 Msi), worse than 78% of polymer grades
- Limited service temperature — 70°C (158 °F), worse than 77% of polymer grades
XPS200 FLR properties
Typical room-temperature values for XPS200 FLR; 17 are specific to this condition. Other listed values are XPS200 reference data and may not represent this condition. Bars are the position among polymer grades.
Physical4
XPS200 FLR has a density of 0.03 g/cm³ (0.0012 lb/in³), lighter than 92% of polymer grades. Its glass-transition temperature is 100°C (212 °F).
Mechanical8
XPS200 FLR has a tensile strength of 0.45 MPa (0.0653 ksi), weaker than 90% of polymer grades. The elastic modulus is 0.01 GPa (0.0019 Msi).
Thermal8
XPS200 FLR is rated for continuous service to 70°C (158 °F). It conducts heat at 0.03 W/m·K (0.0173 BTU/hr·ft·°F), worse than 96% of polymer grades. Thermal expansion is 70 µm/m·K (38.9 µin/in·°F).
Electrical4
XPS200 FLR has an electrical resistivity of 1×10¹⁴ Ω·m.
Chemical & Environmental2
UV resistance is poor.
Sustainability3
Producing a kilogram of XPS200 FLR takes about 100 MJ of energy and emits 4.5 kg of CO₂ — less than 61% of polymer grades. Typical recycled content is 15%.
Manufacturability2
XPS200 FLR's machinability is very good (80/100, better than 84% of polymer grades); formability not recommended (10/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with XPS200 FLR
Is XPS200 easy to machine?
Hot-wire cutting or a fine-tooth band saw or circular saw is sufficient; keep feed fast to avoid melted edges. CNC routing can produce profiles but needs dust extraction, as the static-charged chips scatter easily.
Can XPS200 be welded?
Not fusion welded. Close board joints with dedicated polyurethane foam adhesive or water-based adhesive, or lap and stagger the joints; solvent-based adhesives must not be used.
Can XPS200 be formed, bent or molded?
Produced by extrusion foaming (extruder with blowing-agent injection and sizing rolls) as rigid board. On site it can only be cut — no cold bending or thermoforming.
What surface finishes work on XPS200?
The extrusion skin must be planed off and the surface grooved, scratched or treated with a bonding primer before plaster or adhesive is applied. The finished surface must be covered with render mortar, cement board or a coating to prevent UV aging and flame contact.
XPS200 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| blowing agent residue (CO2 / HFO / HFC)gas in closed cells, partly replaced by air over time | 1 – 4 | 2.5 |
| flame retardant (polymeric brominated / upper end of range for fire class B1 | 0.5 – 3 | 1.5 |
| talc (nucleating agent) | 0.2 – 1 | 0.5 |
| pigment / IR absorber (graphite, carbon up to 1-2% in graphite-modified grades | 0 – 2 | 0.3 |
| polystyrene (styrene homopolymer)GPPS matrix, often contains recycled PS | ≥ 90 (balance) | — |
XPS200 FLR — frequently asked
What is XPS200 FLR used for?
XPS200 FLR is typically used for exterior wall insulation boards, inverted (protected membrane) roof insulation, underfloor heating and floor screed insulation, foundation and below-grade wall insulation, cold storage floor insulation and road and railway frost protection layers. In short: 200 kPa XPS board; load-bearing XPS grade; lower conductivity than EPS.
What is the tensile strength of XPS200 FLR?
XPS200 FLR has a typical tensile strength of 0.45 MPa (0.0653 ksi) — weaker than 90% of polymer grades. Strength varies by condition: see the 4 listed tempers.
Is XPS200 FLR easy to machine?
Yes — machinability is rated very good (80/100, better than 84% of polymer grades). Hot-wire cutting or a fine-tooth band saw or circular saw is sufficient; keep feed fast to avoid melted edges. CNC routing can produce profiles but needs dust extraction, as the static-charged chips scatter easily.
Can XPS200 FLR be welded?
Not fusion welded. Close board joints with dedicated polyurethane foam adhesive or water-based adhesive, or lap and stagger the joints; solvent-based adhesives must not be used.
What surface finishes work on XPS200 FLR?
The extrusion skin must be planed off and the surface grooved, scratched or treated with a bonding primer before plaster or adhesive is applied. The finished surface must be covered with render mortar, cement board or a coating to prevent UV aging and flame contact.
Can XPS200 FLR be formed, bent or molded?
Produced by extrusion foaming (extruder with blowing-agent injection and sizing rolls) as rigid board. On site it can only be cut — no cold bending or thermoforming.
What is the maximum service temperature of XPS200 FLR?
XPS200 FLR is rated for continuous use to about 70°C (158 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- EN 13164 Thermal insulation products — Factory made XPS products — CEN (2015)
- Materials and the Environment (embodied energy of polymer foams) — Ashby / Butterworth-Heinemann (2013)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.