C578 Type XI NON-FR
Flame-retardant grade
NON-FR = packaging / void-fill grade without flame retardant
Cheapest option for packaging, void fill and floats where no building fire code applies.
Values for the NON-FR condition
Other C578 Type XI grades and fills
C578 Type XI is listed in 3 conditions; see the grade overview at C578 Type XI.
Compare all 3 grades and fillsHide
| Grade · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness |
|---|---|---|---|---|---|
FRDefault Flame-retardant block-molded board | Default construction/insulation board: FR bead (polymeric brominated FR replacing HBCD), cut from aged block to ASTM C578 Type XI. | — | 0.08 | 2.5 | — |
NON-FRThis page Packaging / void-fill grade without flame retardant | Cheapest option for packaging, void fill and floats where no building fire code applies. | — | 0.08 | 2.5 | — |
Steam shape-molded parts | Pick when the geometry is molded directly (cushions, corner blocks, ICF-style forms) rather than cut from block. | — | 0.09 | 2.5 | — |
What is C578 Type XI NON-FR?
C578 Type XI NON-FR is C578 Type XI in the NON-FR grade — cheapest option for packaging, void fill and floats where no building fire code applies. C578 Type XI NON-FR has a tensile strength of 0.08 MPa (0.0116 ksi), weaker than 100% of polymer grades. Elongation at break is 2.5% and the elastic modulus is 0 GPa (3.19×10⁻⁴ Msi). C578 Type XI NON-FR has a density of 0.01 g/cm³ (4.34×10⁻⁴ lb/in³), lighter than 100% of polymer grades. Its glass-transition temperature is 100°C (212 °F). FR is the default condition FabDigit quotes; NON-FR is available on request or by drawing note.
Advantages
- Lightweight — 0.01 g/cm³ (4.34×10⁻⁴ lb/in³), better than 100% of polymer grades
- Low embodied carbon — 3.3 kg CO₂/kg, better than 78% of polymer grades
Limitations
- Degrades in UV without stabilisers — 15/100, worse than 95% of polymer grades
- Low stiffness — 0 GPa (3.19×10⁻⁴ Msi), worse than 94% of polymer grades
- Limited ductility — 2.5%, worse than 89% of polymer grades
- Poor heat conductor — 0.04 W/m·K (0.0225 BTU/hr·ft·°F), worse than 88% of polymer grades
- Absorbs moisture — dry before molding — 1%, worse than 84% of polymer grades
C578 Type XI NON-FR properties
Typical room-temperature values for C578 Type XI NON-FR; 18 are specific to this condition. Other listed values are C578 Type XI reference data and may not represent this condition. Bars are the position among polymer grades.
Physical4
C578 Type XI NON-FR has a density of 0.01 g/cm³ (4.34×10⁻⁴ lb/in³), lighter than 100% of polymer grades. Its glass-transition temperature is 100°C (212 °F).
Mechanical9
C578 Type XI NON-FR has a tensile strength of 0.08 MPa (0.0116 ksi), weaker than 100% of polymer grades. Elongation at break is 2.5% and the elastic modulus is 0 GPa (3.19×10⁻⁴ Msi).
Thermal9
C578 Type XI NON-FR is rated for continuous service to 75°C (167 °F). It conducts heat at 0.04 W/m·K (0.0225 BTU/hr·ft·°F), worse than 88% of polymer grades. Thermal expansion is 65 µm/m·K (36.1 µin/in·°F).
Electrical3
C578 Type XI NON-FR has an electrical resistivity of 1×10¹⁴ Ω·m.
Chemical & Environmental3
Corrosion resistance is excellent (85/100), better than 65% of polymer grades. UV resistance is poor.
Sustainability4
Producing a kilogram of C578 Type XI NON-FR takes about 105 MJ of energy and emits 3.3 kg of CO₂ — more than 54% of polymer grades. Typical recycled content is 5%.
Manufacturability4
C578 Type XI NON-FR's machinability is good (55/100, worse than 64% of polymer grades); weldability poor (25/100); formability poor (15/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C578 Type XI NON-FR
Is C578 Type XI easy to machine?
Cut with hot wire, hot knife or fine-tooth band saw; router/CNC works dry with vacuum extraction, but low-density foam crumbles under any clamping force and generates static bead dust.
Can C578 Type XI be welded?
Not weldable in the conventional sense — join with water-based or foam-safe polyurethane/EPS adhesives, or heat-fuse skins; solvent-based cements dissolve the foam.
Can C578 Type XI be formed, bent or molded?
Made by pre-expanding beads with pentane, aging, then steam block-molding (~0.5–1.0 bar, 105–120 °C) and hot-wire cutting; shape moulding needs long dwell for the very low fill weight.
What surface finishes work on C578 Type XI?
Accepts cement- or acrylic-based renders, water-based paints, and laminated facers; requires a protective coat or facer against UV, mechanical damage and solvent contact.
C578 Type XI chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| pentane (blowing agent, residual)up to ~5-6 % in unexpanded bead; largely diffused out after aging | 0.2 – 3 | 1 |
| polymeric brominated flame retardantFR grades only; HBCD-free pFR since ~2015 | 0.3 – 1.5 | 0.8 |
| air (cell gas)>97 % of volume | — | — |
| polystyrene (styrene homopolymer)expanded bead matrix | ≥ 90 (balance) | — |
C578 Type XI NON-FR — frequently asked
What is C578 Type XI NON-FR used for?
C578 Type XI NON-FR is typically used for lightweight packaging, non-structural void fill and model/craft foam. In short: lightest C578 EPS; lowest-cost bead foam; non-structural use only.
What is the tensile strength of C578 Type XI NON-FR?
C578 Type XI NON-FR has a typical tensile strength of 0.08 MPa (0.0116 ksi) — weaker than 100% of polymer grades. Strength varies by condition: see the 3 listed tempers.
Is C578 Type XI NON-FR easy to machine?
Reasonably — machinability is rated good (55/100, worse than 64% of polymer grades). Cut with hot wire, hot knife or fine-tooth band saw; router/CNC works dry with vacuum extraction, but low-density foam crumbles under any clamping force and generates static bead dust.
Can C578 Type XI NON-FR be welded?
Not readily — weldability is rated poor (25/100). Not weldable in the conventional sense — join with water-based or foam-safe polyurethane/EPS adhesives, or heat-fuse skins; solvent-based cements dissolve the foam.
What surface finishes work on C578 Type XI NON-FR?
Accepts cement- or acrylic-based renders, water-based paints, and laminated facers; requires a protective coat or facer against UV, mechanical damage and solvent contact.
Can C578 Type XI NON-FR be formed, bent or molded?
Made by pre-expanding beads with pentane, aging, then steam block-molding (~0.5–1.0 bar, 105–120 °C) and hot-wire cutting; shape moulding needs long dwell for the very low fill weight.
What is the maximum service temperature of C578 Type XI NON-FR?
C578 Type XI NON-FR is rated for continuous use to about 75°C (167 °F), and briefly to 90°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- ASTM C578 Standard Specification for Rigid, Cellular Polystyrene Thermal Insulation — ASTM International (2022)
- GB/T 10801.1 (EPS) — SAC (2021)
- ASM Engineered Materials Handbook, Vol. 2: Engineering Plastics — ASM International (1988)
- EPS insulation board technical data (block-molded, 12–16 kg/m³) — EPS Industry Alliance / member producers (2023)
- Inventory of Carbon & Energy (ICE) — EPS foam — University of Bath / Circular Ecology (2019)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.