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W75Cu25 HIP (Hot isostatic pressed)

Print state

ASTM B694

Pick hot isostatically pressed stock for microwave tubes, IGBT and laser heat sinks and package bases: closed porosity below 0.5% gives the best conduction (215 W/m·K) and hermeticity.

High cost $$$$

Values for the HIP condition

Other W75Cu25 grades and fills

W75Cu25 is listed in 4 conditions; see the grade overview at W75Cu25.

Compare all 4 grades and fillsHide
Grade · open for datasheetBest forYield MPaTensile MPaElong. %Hardness
INFDefault
Press-sinter-infiltrated
Pick the press-sinter-infiltrated standard contact grade (ASTM B702 Class 75W) when arc erosion resistance must balance 200 W/m·K conduction, for HV switch contacts and general EDM electrodes.3806205—
Activated press-and-sinter
Use the lower-cost Ni/Co-activated press-and-sinter route when 650 MPa strength matters more than conduction; activator dissolved in the copper cuts thermal conductivity to 165 W/m·K.4206503—
HIPThis page
Hot isostatic pressed
Pick hot isostatically pressed stock for microwave tubes, IGBT and laser heat sinks and package bases: closed porosity below 0.5% gives the best conduction (215 W/m·K) and hermeticity.4206806—
Fine-grain / high-uniformity EDM electrode grade
Choose the 1–3 µm fine-tungsten infiltrated grade for precision EDM electrodes and micro cavities: the uniform structure polishes to a mirror finish, at 190 W/m·K and 3% elongation.4507003—

What is W75Cu25 HIP?

W75Cu25 HIP is W75Cu25 in the HIP condition — pick hot isostatically pressed stock for microwave tubes, IGBT and laser heat sinks and package bases: closed porosity below 0.5% gives the best conduction (215 W/m·K) and hermeticity. W75Cu25 HIP has a yield strength of 420 MPa (60.9 ksi) and a tensile strength of 680 MPa (98.6 ksi) — stronger than 68% of composite grades. Elongation at break is 6% and the elastic modulus is 260 GPa (37.7 Msi). W75Cu25 HIP has a density of 15 g/cm³ (0.542 lb/in³), heavier than 101% of composite grades. INF is the default condition FabDigit quotes; HIP is available on request or by drawing note.

Advantages

  • Conducts heat well — 215 W/m·K (124.2 BTU/hr·ft·°F), better than 97% of composite grades
  • Polishes to a fine finish — 70/100, better than 94% of composite grades
  • Good UV / weathering resistance — 100/100, better than 93% of composite grades
  • Stiff — 260 GPa (37.7 Msi), better than 88% of composite grades
  • Ductile — tolerates forming and impact — 6%, better than 88% of composite grades

Limitations

  • Heavy — 15 g/cm³ (0.542 lb/in³), worse than 101% of composite grades
  • Needs corrosion protection — 50/100, worse than 92% of composite grades

W75Cu25 HIP properties

Typical room-temperature values for W75Cu25 HIP; 14 are specific to this condition. Other listed values are W75Cu25 reference data and may not represent this condition. Bars are the position among composite grades.

Physical1

W75Cu25 HIP has a density of 15 g/cm³ (0.542 lb/in³), heavier than 101% of composite grades.

Density15 g/cm³0.54 lb/in³

Mechanical11

W75Cu25 HIP has a yield strength of 420 MPa (60.9 ksi) and a tensile strength of 680 MPa (98.6 ksi) — stronger than 68% of composite grades. Elongation at break is 6% and the elastic modulus is 260 GPa (37.7 Msi).

Elastic (Young's) Modulus260 GPa37.7 Msi
Shear Modulus96 GPa13.9 Msi
Bulk Modulus208 GPa30.2 Msi
Poisson's Ratio0.3
Tensile Strength (Ultimate)680 MPa98.6 ksi
Yield Strength (0.2% offset)420 MPa60.9 ksi
Elongation at Break6%
Compressive Strength980 MPa142 ksi
Flexural Strength820 MPa119 ksi
Shear Strength380 MPa55.1 ksi
Fracture Toughness (K_IC)15 MPa·√m13.7 ksi·√in

Thermal6

W75Cu25 HIP is rated for continuous service to 400°C (752 °F). It conducts heat at 215 W/m·K (124.2 BTU/hr·ft·°F), better than 97% of composite grades. Thermal expansion is 9.3 µm/m·K (5.17 µin/in·°F).

Thermal Conductivity215 W/m·K124 BTU/hr·ft·°F
Specific Heat Capacity195 J/kg·K0.05 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)9.3 µm/m·K5.2 µin/in·°F
Max Service Temperature (continuous)400°C752 °F
Min Service Temperature-196°C-321 °F
Max Service Temperature (short-term)1,000°C1,832 °F

Electrical2

W75Cu25 HIP has an electrical resistivity of 3.8×10⁻⁸ Ω·m.

Electrical Resistivity3.8×10⁻⁸ Ω·m1.5 µΩ·in
Volume Resistivity4×10⁻⁶ Ω·cm

Chemical & Environmental3

Corrosion resistance is fair (50/100), worse than 92% of composite grades. UV resistance is excellent.

Corrosion ResistanceFair50/100
UV / Weathering ResistanceExcellent100/100
Chemical Resistance Summary—

Sustainability4

Producing a kilogram of W75Cu25 HIP takes about 280 MJ of energy and emits 18 kg of CO₂ — more than 63% of composite grades. Typical recycled content is 20%.

Embodied Energy (primary production)280 MJ/kg120,378 BTU/lb
Embodied Carbon (primary production)18 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content20%

Manufacturability2

W75Cu25 HIP's machinability is poor (28/100, worse than 57% of composite grades).

MachinabilityPoor28/100
PolishabilityVery good70/100

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with W75Cu25 HIP

Is W75Cu25 easy to machine?

The tungsten phase is strongly abrasive; use sharp carbide or PCD tooling at low speed with a heavier feed and ample coolant. Deep cavities and precision forms are better produced by wire EDM or form grinding.

Can W75Cu25 be welded?

Not fusion weldable — the copper phase melts out and the tungsten does not melt. Braze with BAg silver-copper or Cu-P fillers in vacuum or hydrogen, or resistance-braze onto copper or steel carriers.

Can W75Cu25 be formed, bent or molded?

No cold forming capability. Parts are made net-shape by powder metallurgy (press, sinter, infiltrate), with complex geometry produced by machining or by the PM die shape.

What surface finishes work on W75Cu25?

Ni, Ag or Au plating improves joinability and corrosion resistance. EDM electrode faces are ground or lapped to Ra below 0.4 µm; the material is not suitable for anodizing.

W75Cu25 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Wtungsten skeleton, about 58 vol%73 – 7775
Nisintering activator, activated-sintered (PS) grades only0 – 0.5—
Feimpurity0 – 0.2—
other impurities (total)total of C, O, Si and other impurities0 – 0.5—
Cuinfiltrated copper phase, balance≥ 23 (balance)—

W75Cu25 HIP — frequently asked

What is W75Cu25 HIP used for?

W75Cu25 HIP is typically used for circuit breaker contacts, EDM electrodes, vacuum interrupter contacts and welding electrode tips. In short: arc-erosion contact material; standard EDM electrode grade; very high density.

What is the yield strength of W75Cu25 HIP?

W75Cu25 HIP has a typical yield strength of 420 MPa (60.9 ksi) and a tensile strength of 680 MPa (98.6 ksi) — stronger than 68% of composite grades. Strength varies by condition: see the 4 listed tempers.

Is W75Cu25 HIP easy to machine?

Not especially — machinability is rated poor (28/100, worse than 57% of composite grades). The tungsten phase is strongly abrasive; use sharp carbide or PCD tooling at low speed with a heavier feed and ample coolant. Deep cavities and precision forms are better produced by wire EDM or form grinding.

Can W75Cu25 HIP be welded?

Not fusion weldable — the copper phase melts out and the tungsten does not melt. Braze with BAg silver-copper or Cu-P fillers in vacuum or hydrogen, or resistance-braze onto copper or steel carriers.

What surface finishes work on W75Cu25 HIP?

Ni, Ag or Au plating improves joinability and corrosion resistance. EDM electrode faces are ground or lapped to Ra below 0.4 µm; the material is not suitable for anodizing.

Can W75Cu25 HIP be formed, bent or molded?

No cold forming capability. Parts are made net-shape by powder metallurgy (press, sinter, infiltrate), with complex geometry produced by machining or by the PM die shape.

What is the maximum service temperature of W75Cu25 HIP?

W75Cu25 HIP is rated for continuous use to about 400°C (752 °F), and briefly to 1,000°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between W75Cu25 INF and W75Cu25 FG?

INF is the default condition — pick the press-sinter-infiltrated standard contact grade (ASTM B702 Class 75W) when arc erosion resistance must balance 200 W/m·K conduction, for HV switch contacts and general EDM electrodes. FG: choose the 1–3 µm fine-tungsten infiltrated grade for precision EDM electrodes and micro cavities: the uniform structure polishes to a mirror finish, at 190 W/m·K and 3% elongation. Yield strength is 380 MPa in INF versus 450 MPa in FG.

Sources

  1. ASTM B702 — Copper-Tungsten Electrical Contact Material — ASTM International (2016)
  2. ASM Handbook Vol.7: Powder Metallurgy (infiltrated W-Cu) — ASM International (2015)
  3. Tungsten-Copper (W-Cu) material data — Plansee / Mi-Tech Metals (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.