Solder & Low-Melting Alloy Sn98.3Ag1Cu0.7
ISO 715 · also IEC C7A10
Sn98.3Ag1Cu0.7 is a low-silver tin-silver-copper (SAC) solder in the lead-free Sn-Ag-Cu family, covered by IEC designation C7A10, in which silver is cut to about 1% to lower precious-metal cost while keeping usable wetting and joint strength.
Reference datasheet — Sn98.3Ag1Cu0.7 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.
What is Sn98.3Ag1Cu0.7?
Sn98.3Ag1Cu0.7 is a low-silver tin-silver-copper (SAC) solder in the lead-free Sn-Ag-Cu family, covered by IEC designation C7A10, in which silver is cut to about 1% to lower precious-metal cost while keeping usable wetting and joint strength. Engineers specify it for cost-sensitive electronics assembly and it is supplied as cast bar, solid and flux-cored wire, solder paste, spheres and stamped preforms. Strength is modest — 26 MPa yield, 38 MPa tensile at 45% elongation, 13 HB — and it creeps at room temperature, with maximum service temperature of 125 °C. Where higher joint strength is needed, SAC305 is the nearest alternative. Sn98.3Ag1Cu0.7 has a density of 7.4 g/cm³ (0.267 lb/in³), lighter than 67% of solder & low-melting alloy grades. It melts at 217°C (423 °F). Sn98.3Ag1Cu0.7 has a yield strength of 26 MPa (3.77 ksi) and a tensile strength of 38 MPa (5.51 ksi) — weaker than 55% of solder & low-melting alloy grades. Elongation at break is 45% and the elastic modulus is 47 GPa (6.82 Msi).
What is Sn98.3Ag1Cu0.7 used for?
- Cost-optimized SMT assembly
- Consumer electronics
- Wave soldering
Advantages
- High electrical conductivity — 13 % IACS, better than 87% of solder & low-melting alloy grades
- Conducts heat well — 58 W/m·K (33.5 BTU/hr·ft·°F), better than 85% of solder & low-melting alloy grades
- Ductile — tolerates forming and impact — 45%, better than 84% of solder & low-melting alloy grades
- High service temperature — 125°C (257 °F), better than 80% of solder & low-melting alloy grades
- Stiff — 47 GPa (6.82 Msi), better than 77% of solder & low-melting alloy grades
Limitations
- High embodied carbon — 20 kg CO₂/kg, worse than 86% of solder & low-melting alloy grades
Sn98.3Ag1Cu0.7 properties
Typical room-temperature values; bars are the position among solder & low-melting alloy grades.
Physical3
Sn98.3Ag1Cu0.7 has a density of 7.4 g/cm³ (0.267 lb/in³), lighter than 67% of solder & low-melting alloy grades. It melts at 217°C (423 °F).
Mechanical10
Sn98.3Ag1Cu0.7 has a yield strength of 26 MPa (3.77 ksi) and a tensile strength of 38 MPa (5.51 ksi) — weaker than 55% of solder & low-melting alloy grades. Elongation at break is 45% and the elastic modulus is 47 GPa (6.82 Msi).
Thermal6
Sn98.3Ag1Cu0.7 is rated for continuous service to 125°C (257 °F). It conducts heat at 58 W/m·K (33.5 BTU/hr·ft·°F), better than 85% of solder & low-melting alloy grades. Thermal expansion is 22 µm/m·K (12.2 µin/in·°F).
Electrical3
Sn98.3Ag1Cu0.7 conducts electricity at 13 % IACS, better than 87% of solder & low-melting alloy grades.
Chemical & Environmental3
Corrosion resistance is fair (45/100), worse than 52% of solder & low-melting alloy grades.
Sustainability4
Producing a kilogram of Sn98.3Ag1Cu0.7 takes about 330 MJ of energy and emits 20 kg of CO₂ — more than 86% of solder & low-melting alloy grades. Typical recycled content is 25%.
Manufacturability6
Sn98.3Ag1Cu0.7's machinability is poor (25/100, worse than 82% of solder & low-melting alloy grades); formability excellent (95/100).
Common Calculations5
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Strength versus weight in the solder & low-melting alloy family
Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Sn98.3Ag1Cu0.7 is highlighted; hover a dot for its name, or open the interactive family chart.
Working with Sn98.3Ag1Cu0.7
Is Sn98.3Ag1Cu0.7 easy to machine?
Rarely machined — extremely soft and gummy; use sharp high-rake tools, flood coolant or simply stamp/shear preforms.
Can Sn98.3Ag1Cu0.7 be welded?
Not welded; it is the joining filler — pot temperature 255–275 °C for wave, reflow peak 235–250 °C with 60–90 s above 217 °C.
Can Sn98.3Ag1Cu0.7 be formed, bent or molded?
Cast into bars, extruded and drawn to wire, gas-atomized to Type 3–5 powder, stamped to preforms; all readily done at or near room temperature.
Sn98.3Ag1Cu0.7 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| AgJ-STD-006 alloy 715 / IEC C7A10 | 0.9 – 1.1 | 1 |
| Cu | 0.6 – 0.8 | 0.7 |
| PbRoHS-compliant lead limit; J-STD-006 impurity max 0.10 | ≤ 0.07 | |
| Sbimpurity | ≤ 0.1 | |
| Biimpurity | ≤ 0.1 | |
| Feimpurity | ≤ 0.02 | |
| Znimpurity | ≤ 0 | |
| Alimpurity | ≤ 0 | |
| Asimpurity | ≤ 0.03 | |
| Cdimpurity | ≤ 0 | |
| Snbalance, ≈98.3 % | balance |
What surface finishes work on Sn98.3Ag1Cu0.7?
Joints are cleaned (saponified or no-clean) rather than plated; avoid abrasive polishing, and control Cu dissolution and dross to keep the bath in spec.
Equivalent designations
Standards and trade names that resolve to Solder & Low-Melting Alloy Sn98.3Ag1Cu0.7 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.
- ISO
- 715
- Trade names
- IEC C7A10
How much does Sn98.3Ag1Cu0.7 cost?
Sn98.3Ag1Cu0.7 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sn98.3Ag1Cu0.7 — frequently asked
What is Sn98.3Ag1Cu0.7 used for?
Sn98.3Ag1Cu0.7 is typically used for cost-optimized SMT assembly, consumer electronics and wave soldering. In short: low-silver SAC cost option; ductile lead-free joint; drop-in for SAC305 lines.
What is the yield strength of Sn98.3Ag1Cu0.7?
Sn98.3Ag1Cu0.7 has a typical yield strength of 26 MPa (3.77 ksi) and a tensile strength of 38 MPa (5.51 ksi) — weaker than 55% of solder & low-melting alloy grades.
Is Sn98.3Ag1Cu0.7 easy to machine?
Not especially — machinability is rated poor (25/100, worse than 82% of solder & low-melting alloy grades). Rarely machined — extremely soft and gummy; use sharp high-rake tools, flood coolant or simply stamp/shear preforms.
Can Sn98.3Ag1Cu0.7 be welded?
Not welded; it is the joining filler — pot temperature 255–275 °C for wave, reflow peak 235–250 °C with 60–90 s above 217 °C.
What surface finishes work on Sn98.3Ag1Cu0.7?
Joints are cleaned (saponified or no-clean) rather than plated; avoid abrasive polishing, and control Cu dissolution and dross to keep the bath in spec.
Can Sn98.3Ag1Cu0.7 be formed, bent or molded?
Cast into bars, extruded and drawn to wire, gas-atomized to Type 3–5 powder, stamped to preforms; all readily done at or near room temperature.
What is the maximum service temperature of Sn98.3Ag1Cu0.7?
Sn98.3Ag1Cu0.7 is rated for continuous use to about 125°C (257 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
How much does Sn98.3Ag1Cu0.7 cost?
Sn98.3Ag1Cu0.7 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sources
- J-STD-006 Requirements for Electronic Grade Solder Alloys — IPC/JEDEC (2013)
- IEC 61190-1-3 Requirements for electronic grade solder alloys — IEC (2007)
- GB/T 20422 (2018)
- Low-silver SAC alloy (SAC105/SAC107) technical data — Indium Corporation / Alpha Assembly Solutions (2023)
- Properties of Lead-Free Solders (solder property database) — NIST (2002)
- ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.