Solder & Low-Melting Alloy SAC105
ISO 716
SAC105 is a low-silver lead-free solder of the Sn-Ag-Cu system, nominally 1.0% Ag and 0.5% Cu in tin, developed to cut precious-metal content relative to SAC305.
Reference datasheet — SAC105 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.
What is SAC105?
SAC105 is a low-silver lead-free solder of the Sn-Ag-Cu system, nominally 1.0% Ag and 0.5% Cu in tin, developed to cut precious-metal content relative to SAC305. Its softer, more compliant joint absorbs mechanical shock, so it is widely used in drop-sensitive mobile and handheld products; supply forms include spheres/balls, bar, solid and cored wire, paste and preforms. Mechanical properties are low — 24 MPa yield, 33 MPa tensile, 40% elongation — with a 125 °C service limit and room-temperature creep. Choose SAC305 where static joint strength matters more than drop performance. SAC105 has a density of 7.38 g/cm³ (0.267 lb/in³), lighter than 74% of solder & low-melting alloy grades. It melts at 217°C (423 °F). SAC105 has a yield strength of 24 MPa (3.48 ksi) and a tensile strength of 33 MPa (4.79 ksi) — weaker than 66% of solder & low-melting alloy grades. Elongation at break is 40% and the elastic modulus is 47 GPa (6.82 Msi).
What is SAC105 used for?
- Mobile device assembly
- Handheld electronics
- Cost-sensitive SMT soldering
Advantages
- High electrical conductivity — 13.3 % IACS, better than 91% of solder & low-melting alloy grades
- High service temperature — 125°C (257 °F), better than 80% of solder & low-melting alloy grades
- Conducts heat well — 55 W/m·K (31.8 BTU/hr·ft·°F), better than 78% of solder & low-melting alloy grades
- Stiff — 47 GPa (6.82 Msi), better than 77% of solder & low-melting alloy grades
Limitations
- High embodied carbon — 18 kg CO₂/kg, worse than 76% of solder & low-melting alloy grades
SAC105 properties
Typical room-temperature values; bars are the position among solder & low-melting alloy grades.
Physical3
SAC105 has a density of 7.38 g/cm³ (0.267 lb/in³), lighter than 74% of solder & low-melting alloy grades. It melts at 217°C (423 °F).
Mechanical11
SAC105 has a yield strength of 24 MPa (3.48 ksi) and a tensile strength of 33 MPa (4.79 ksi) — weaker than 66% of solder & low-melting alloy grades. Elongation at break is 40% and the elastic modulus is 47 GPa (6.82 Msi).
Thermal6
SAC105 is rated for continuous service to 125°C (257 °F). It conducts heat at 55 W/m·K (31.8 BTU/hr·ft·°F), better than 78% of solder & low-melting alloy grades. Thermal expansion is 22.5 µm/m·K (12.5 µin/in·°F).
Electrical3
SAC105 conducts electricity at 13.3 % IACS, better than 91% of solder & low-melting alloy grades.
Chemical & Environmental3
Corrosion resistance is fair (45/100), worse than 52% of solder & low-melting alloy grades.
Sustainability4
Producing a kilogram of SAC105 takes about 290 MJ of energy and emits 18 kg of CO₂ — more than 69% of solder & low-melting alloy grades. Typical recycled content is 30%.
Manufacturability7
SAC105's machinability is poor (25/100, worse than 82% of solder & low-melting alloy grades); weldability poor (20/100); formability excellent (90/100).
Common Calculations5
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Strength versus weight in the solder & low-melting alloy family
Yield strength against density for every solder & low-melting alloy grade FabDigit runs. SAC105 is highlighted; hover a dot for its name, or open the interactive family chart.
Working with SAC105
Is SAC105 easy to machine?
Rarely machined — extremely soft and gummy; use sharp high-rake tools, high speed, low feed and coolant to avoid smearing.
Can SAC105 be welded?
Not welded; joined by reflow/wave/hand soldering with typical reflow peak 240–250 °C and 60–90 s above 217 °C liquidus.
Can SAC105 be formed, bent or molded?
Readily extruded into wire, stamped into preforms and atomized into Type 3–6 powder; creeps at room temperature so avoid load-bearing forming.
SAC105 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Agnominal 1.0 % gives the '1' in SAC105 | 0.8 – 1.2 | 1 |
| Cu | 0.4 – 0.6 | 0.5 |
| PbRoHS limit 0.1 %; producers typically hold <0.05 % | ≤ 0.07 | |
| Sb | ≤ 0.2 | |
| Bi | ≤ 0.1 | |
| Fe | ≤ 0.02 | |
| As | ≤ 0.03 | |
| Nisome doped variants add 0.02–0.06 % Ni intentionally | ≤ 0.01 | |
| Zn | ≤ 0 | |
| Al | ≤ 0 | |
| Cd | ≤ 0 | |
| Snbalance, ~98.5 % | balance |
What surface finishes work on SAC105?
Joints are cleaned per flux type (no-clean or saponifier/IPA wash); no plating or anodizing is applied to the solder itself.
Equivalent designations
Standards and trade names that resolve to Solder & Low-Melting Alloy SAC105 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.
- ISO
- 716
How much does SAC105 cost?
SAC105 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
SAC105 — frequently asked
What is SAC105 used for?
SAC105 is typically used for mobile device assembly, handheld electronics and cost-sensitive SMT soldering. In short: drop-shock resistant SAC; low-silver, lower cost; softer than SAC305.
What is the yield strength of SAC105?
SAC105 has a typical yield strength of 24 MPa (3.48 ksi) and a tensile strength of 33 MPa (4.79 ksi) — weaker than 66% of solder & low-melting alloy grades.
Is SAC105 easy to machine?
Not especially — machinability is rated poor (25/100, worse than 82% of solder & low-melting alloy grades). Rarely machined — extremely soft and gummy; use sharp high-rake tools, high speed, low feed and coolant to avoid smearing.
Can SAC105 be welded?
Not readily — weldability is rated poor (20/100). Not welded; joined by reflow/wave/hand soldering with typical reflow peak 240–250 °C and 60–90 s above 217 °C liquidus.
What surface finishes work on SAC105?
Joints are cleaned per flux type (no-clean or saponifier/IPA wash); no plating or anodizing is applied to the solder itself.
Can SAC105 be formed, bent or molded?
Readily extruded into wire, stamped into preforms and atomized into Type 3–6 powder; creeps at room temperature so avoid load-bearing forming.
What is the maximum service temperature of SAC105?
SAC105 is rated for continuous use to about 125°C (257 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
How much does SAC105 cost?
SAC105 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sources
- J-STD-006C Requirements for Electronic Grade Solder Alloys — IPC/JEDEC (2013)
- J-STD-020 / IPC-9701 Thermal Cycling and Reflow Profiling for Lead-Free Assemblies — IPC/JEDEC (2015)
- Properties of Lead-Free Solders (solder property database) — NIST (2002)
- SAC105 alloy and solder sphere datasheets — Indium Corporation / Alpha Assembly / Senju / Nihon Superior (2023)
- ASM Handbook Vol. 6 — Welding, Brazing and Soldering (solder alloys) — ASM International (1993)
Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.