SSiC HIP (Hot isostatic pressed)
Print state
Highest density and strength route for small, high-reliability parts (precision optics substrates, high-load bearings); highest cost and limited part size.
Values for the HIP condition
Other SSiC tempers and conditions
SSiC is listed in 6 conditions; see the grade overview at SSiC.
Compare all 6 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
SSiC-C | Pick when crack deflection and thermal-shock/impact tolerance matter more than peak bend strength (armour tiles, large kiln and pump parts). | — | 230 | 0.06 | 2,400 HV | 130 W/m·K |
FDefault As fabricated | Default choice for mechanical seal faces, bushings and slurry components needing maximum corrosion resistance and hardness. | — | 260 | — | 2,500 HV | 120 W/m·K |
LPS-SiC | Pick when higher strength and roughly double the fracture toughness are worth lower thermal conductivity and reduced resistance to hot caustics/HF. | — | — | — | 2,100 HV | 70 W/m·K |
SSiC-G | Choose for seal faces that must survive dry running, flashing or poorly lubricated media — dispersed graphite gives emergency lubrication at the cost of strength. | — | — | — | 2,200 HV | 100 W/m·K |
SSiC-P | Use where closed spherical micro-pores are needed as lubricant reservoirs / hydrodynamic pockets in seal faces running on marginal films. | — | — | — | 2,300 HV | 95 W/m·K |
HIPThis page Hot isostatic pressed | Highest density and strength route for small, high-reliability parts (precision optics substrates, high-load bearings); highest cost and limited part size. | — | — | — | 2,700 HV | 130 W/m·K |
What is SSiC HIP?
SSiC HIP is SSiC in the HIP condition — highest density and strength route for small, high-reliability parts (precision optics substrates, high-load bearings); highest cost and limited part size. SSiC HIP has a tensile strength of 260 MPa (37.7 ksi), stronger than 65% of ceramic grades. The elastic modulus is 440 GPa (63.8 Msi). SSiC HIP has a density of 3.2 g/cm³ (0.116 lb/in³), lighter than 72% of ceramic grades. It melts at 2,700°C (4,892 °F). F is the default condition FabDigit quotes; HIP is available on request or by drawing note.
Advantages
- Good corrosion resistance — 97/100, better than 99% of ceramic grades
- Polishes to a fine finish — 95/100, better than 97% of ceramic grades
- Conducts heat well — 130 W/m·K (75.1 BTU/hr·ft·°F), better than 91% of ceramic grades
- High service temperature — 1,650°C (3,002 °F), better than 88% of ceramic grades
SSiC HIP properties
Typical room-temperature values for SSiC HIP; 11 are specific to this condition. Other listed values are SSiC reference data and may not represent this condition. Bars are the position among ceramic grades.
Physical3
SSiC HIP has a density of 3.2 g/cm³ (0.116 lb/in³), lighter than 72% of ceramic grades. It melts at 2,700°C (4,892 °F).
Mechanical11
SSiC HIP has a tensile strength of 260 MPa (37.7 ksi), stronger than 65% of ceramic grades. The elastic modulus is 440 GPa (63.8 Msi).
Thermal5
SSiC HIP is rated for continuous service to 1,650°C (3,002 °F). It conducts heat at 130 W/m·K (75.1 BTU/hr·ft·°F), better than 91% of ceramic grades. Thermal expansion is 4 µm/m·K (2.22 µin/in·°F).
Electrical2
SSiC HIP has an electrical resistivity of 100 Ω·m.
Chemical & Environmental2
Corrosion resistance is excellent (97/100), better than 99% of ceramic grades.
Sustainability4
Producing a kilogram of SSiC HIP takes about 110 MJ of energy and emits 8 kg of CO₂ — less than 52% of ceramic grades. Typical recycled content is 5%.
Manufacturability3
SSiC HIP's machinability is not recommended (4/100, worse than 85% of ceramic grades).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with SSiC HIP
Is SSiC easy to machine?
Shape in the green/bisque state (green machining or CIP + turning); after sintering only diamond grinding, lapping and polishing are possible — allow 0.1–0.3 mm grind stock and expect ~2 % sintering shrinkage scatter.
Can SSiC be welded?
Not weldable; join by active-metal brazing (Ti/Ag-Cu-Ti) up to ~600 °C service, glass/ceramic sealing, diffusion bonding or shrink-fit into metal holders — respect the 4 µm/m·K CTE mismatch with steel.
Can SSiC be formed, bent or molded?
Formed as a powder body by dry/CIP pressing, slip or gel casting, extrusion or injection moulding, then debound and pressureless sintered at 2050–2150 °C in argon.
What surface finishes work on SSiC?
Seal and bearing faces are diamond-lapped to Ra ≤ 0.05 µm and 1–2 helium light bands flatness; no coating is normally needed, though laser texturing or DLC overlays are used for dry-running duties.
SSiC chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| C (free)carbon sintering aid, removes surface SiO₂ | 0.3 – 1.5 | 0.8 |
| Badded as B or B₄C, solid-state sintering aid | 0.2 – 0.8 | 0.5 |
| Si (free)essentially silicon-free — key difference vs SiSiC | 0 – 0.1 | 0 |
| Al₂O₃ + Y₂O₃only in the LPS-SiC variant (typically 5–10 % combined) | 0 – 10 | 0 |
| SiCα-SiC (6H) dominant after sintering | ≥ 98 (balance) | — |
SSiC HIP — frequently asked
What is SSiC HIP used for?
SSiC HIP is typically used for mechanical seal rings, slurry pump components, bulletproof armor tiles, bearing sleeves and chemical pump parts. In short: most corrosion-resistant SiC; no free silicon phase; standard seal-face ceramic.
What is the tensile strength of SSiC HIP?
SSiC HIP has a typical tensile strength of 260 MPa (37.7 ksi) — stronger than 65% of ceramic grades. Strength varies by condition: see the 6 listed tempers.
Is SSiC HIP easy to machine?
Not especially — machinability is rated not recommended (4/100, worse than 85% of ceramic grades). Shape in the green/bisque state (green machining or CIP + turning); after sintering only diamond grinding, lapping and polishing are possible — allow 0.1–0.3 mm grind stock and expect ~2 % sintering shrinkage scatter.
Can SSiC HIP be welded?
Not weldable; join by active-metal brazing (Ti/Ag-Cu-Ti) up to ~600 °C service, glass/ceramic sealing, diffusion bonding or shrink-fit into metal holders — respect the 4 µm/m·K CTE mismatch with steel.
What surface finishes work on SSiC HIP?
Seal and bearing faces are diamond-lapped to Ra ≤ 0.05 µm and 1–2 helium light bands flatness; no coating is normally needed, though laser texturing or DLC overlays are used for dry-running duties.
Can SSiC HIP be formed, bent or molded?
Formed as a powder body by dry/CIP pressing, slip or gel casting, extrusion or injection moulding, then debound and pressureless sintered at 2050–2150 °C in argon.
What is the maximum service temperature of SSiC HIP?
SSiC HIP is rated for continuous use to about 1,650°C (3,002 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- ASM Engineered Materials Handbook, Vol. 4: Ceramics and Glasses — ASM International (1991)
- Hexoloy SA / SP Sintered Silicon Carbide datasheets — Saint-Gobain Performance Ceramics (2023)
- EKasic F / C / P / F plus silicon carbide grade data — 3M Technical Ceramics (ESK) (2022)
- Sintered Silicon Carbide (SSiC) material properties — CoorsTek / Kyocera Fine Ceramics (2023)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.