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CeO2 NANO

Grade

NANO = nanopowder

Choose for catalysis, oxygen-storage washcoats, UV-blocking additives and fine CMP slurries needing very high specific surface area.

Premium cost $$$

Values for the NANO condition

Other CeO2 tempers and conditions

CeO2 is listed in 4 conditions; see the grade overview at CeO2.

Compare all 4 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
99.9-SINTDefault
99.9 % CeO2
Choose for dense structural/functional ceria parts: crucibles, sputtering targets, catalyst supports and oxygen-storage components.———600 HV12 W/m·K
Polishing powder grade
Choose for glass, panel, optics and wafer CMP polishing slurries where chemical-mechanical removal rate matters more than mechanical strength.———600 HV11 W/m·K
NANOThis page
Nanopowder
Choose for catalysis, oxygen-storage washcoats, UV-blocking additives and fine CMP slurries needing very high specific surface area.———650 HV6 W/m·K
10 mol % Gd-doped ceria (Ce0.9Gd0.1O1.95) electrolyte grade
Choose for intermediate-temperature SOFC electrolytes/barrier layers where high oxygen-ion conductivity at 500–700 °C is required.———650 HV3 W/m·K

What is CeO2 NANO?

CeO2 NANO is CeO2 in the NANO grade — choose for catalysis, oxygen-storage washcoats, UV-blocking additives and fine CMP slurries needing very high specific surface area. The elastic modulus is 165 GPa (23.9 Msi). CeO2 NANO has a density of 7.2 g/cm³ (0.26 lb/in³), heavier than 72% of ceramic grades. It melts at 2,400°C (4,352 °F). 99.9-SINT is the default condition FabDigit quotes; NANO is available on request or by drawing note.

Advantages

  • Polishes to a fine finish — 92/100, better than 89% of ceramic grades

CeO2 NANO properties

Typical room-temperature values for CeO2 NANO; 16 are specific to this condition. Other listed values are CeO2 reference data and may not represent this condition. Bars are the position among ceramic grades.

Physical4

CeO2 NANO has a density of 7.2 g/cm³ (0.26 lb/in³), heavier than 72% of ceramic grades. It melts at 2,400°C (4,352 °F).

Density7.2 g/cm³0.26 lb/in³
Melting Point (Solidus)2,400°C4,352 °F
Refractive Index2.2
Porosity2%

Mechanical10

The elastic modulus is 165 GPa (23.9 Msi).

Elastic (Young's) Modulus165 GPa23.9 Msi
Shear Modulus70 GPa10.2 Msi
Bulk Modulus200 GPa29 Msi
Poisson's Ratio0.29
Compressive Strength500 MPa72.5 ksi
Flexural Strength150 MPa21.8 ksi
Fracture Toughness (K_IC)1.6 MPa·√m1.5 ksi·√in
Hardness, Vickers650 HV
Hardness, Knoop560 HK
Hardness, Mohs6

Thermal5

CeO2 NANO is rated for continuous service to 900°C (1,652 °F). It conducts heat at 6 W/m·K (3.47 BTU/hr·ft·°F), worse than 61% of ceramic grades. Thermal expansion is 10 µm/m·K (5.56 µin/in·°F).

Thermal Conductivity6 W/m·K3.5 BTU/hr·ft·°F
Specific Heat Capacity360 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)10 µm/m·K5.6 µin/in·°F
Max Service Temperature (continuous)900°C1,652 °F
Min Service Temperature-200°C-328 °F

Electrical3

CeO2 NANO has an electrical resistivity of 10,000 Ω·m.

Electrical Resistivity10,000 Ω·m3.94×10¹¹ µΩ·in
Dielectric Constant (1 MHz)23
Volume Resistivity1×10⁷ Ω·cm

Chemical & Environmental2

Corrosion resistance is very good (78/100), better than 53% of ceramic grades.

Corrosion ResistanceVery good78/100
Chemical Resistance SummaryInsoluble in water and alkalis; resistant to most molten metals and to steam. Dissolves slowly in hot concentrated sulfuric/nitric acid, rapidly in acids containing a reducing agent (H2O2, HCl+H2O2). Reversibly loses oxygen in H2/CO above ~600 °C forming CeO2-x with lattice expansion and possible cracking.

Sustainability4

Producing a kilogram of CeO2 NANO takes about 220 MJ of energy and emits 16 kg of CO₂ — more than 64% of ceramic grades. Typical recycled content is 5%.

Embodied Energy (primary production)220 MJ/kg94,583 BTU/lb
Embodied Carbon (primary production)16 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content5%

Manufacturability3

CeO2 NANO's machinability is not recommended (8/100, better than 69% of ceramic grades).

MachinabilityNot recommended8/100
PolishabilityExcellent92/100
Sintering / Firing Temperature1,300°C2,372 °F

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with CeO2 NANO

Is CeO2 easy to machine?

Machine green or bisque-fired bodies with carbide tooling; after sintering only diamond grinding/lapping is practical and chipping at edges is common due to low toughness.

Can CeO2 be welded?

Not weldable — join by ceramic–metal brazing (Ag-Cu-Ti active braze) or glass sealing; CTE ~10–12 µm/m·K matches many ferritic stainless steels.

Can CeO2 be formed, bent or molded?

Uniaxial or isostatic pressing, tape casting and screen printing of submicron powder, then pressureless sintering at 1400–1650 °C; keep the firing atmosphere oxidising to avoid CeO2-x expansion cracking.

What surface finishes work on CeO2?

Lapped and diamond-polished to optical/sputter-target flatness; the powder itself is the standard chemical-mechanical polishing medium for silica glass and wafers.

CeO2 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Cestoichiometric CeO2, Ce as Ce(IV)80.5 – 81.581.41
other rare earth oxides (La, Pr, Nd)typical residual in 99.5–99.9 % technical grades0 – 0.50.1
Fe2O3 + SiO2 + CaOnon-rare-earth impurities0 – 0.10.03
Osub-stoichiometric CeO2-x forms in reducing atmospheresbalance—

CeO2 NANO — frequently asked

What is CeO2 NANO used for?

CeO2 NANO is typically used for glass/wafer CMP polishing, solid oxide fuel cell components, catalytic supports and UV-blocking coatings. In short: standard glass-polishing oxide; oxygen-storage functional ceramic; doped GDC10 for SOFC.

Is CeO2 NANO easy to machine?

Not especially — machinability is rated not recommended (8/100, better than 69% of ceramic grades). Machine green or bisque-fired bodies with carbide tooling; after sintering only diamond grinding/lapping is practical and chipping at edges is common due to low toughness.

Can CeO2 NANO be welded?

Not weldable — join by ceramic–metal brazing (Ag-Cu-Ti active braze) or glass sealing; CTE ~10–12 µm/m·K matches many ferritic stainless steels.

What surface finishes work on CeO2 NANO?

Lapped and diamond-polished to optical/sputter-target flatness; the powder itself is the standard chemical-mechanical polishing medium for silica glass and wafers.

Can CeO2 NANO be formed, bent or molded?

Uniaxial or isostatic pressing, tape casting and screen printing of submicron powder, then pressureless sintering at 1400–1650 °C; keep the firing atmosphere oxidising to avoid CeO2-x expansion cracking.

What is the maximum service temperature of CeO2 NANO?

CeO2 NANO is rated for continuous use to about 900°C (1,652 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Sources

  1. Engineered Materials Handbook Vol. 4: Ceramics and Glasses — ASM International (1991)
  2. NIST-JANAF Thermochemical Tables — CeO2 — NIST (1998)
  3. Cerium oxide polishing and catalyst grades — technical data — Solvay / Treibacher Industrie AG (2022)
  4. GDC10 / CGO electrolyte powder and tape specifications — fuelcellmaterials (Nexceris) (2021)
  5. Handbook on the Physics and Chemistry of Rare Earths — ceria properties — Elsevier (2016)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.