Ce-TZP HIP (Hot isostatic pressed)
Print state
Choose for the highest strength and finest surface finish in Ce-TZP (wire-drawing dies, precision wear parts) where porosity-initiated failure must be eliminated.
Values for the HIP condition
Other Ce-TZP tempers and conditions
Ce-TZP is listed in 4 conditions; see the grade overview at Ce-TZP.
Compare all 4 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
10Ce-TZP | Pick when peak fracture toughness / damage tolerance matters more than strength or hardness; more transformable, so watch stability near room temperature. | — | 280 | 0.2 | 950 HV | 2 W/m·K |
HIPThis page Hot isostatic pressed | Choose for the highest strength and finest surface finish in Ce-TZP (wire-drawing dies, precision wear parts) where porosity-initiated failure must be eliminated. | — | 430 | 0.2 | 1,130 HV | 3 W/m·K |
12CEDefault 12Ce-TZP | Standard commercial Ce-TZP: best balance of ~550 MPa strength and 10–14 MPa·√m toughness with good phase stability. | — | — | — | 1,030 HV | 3 W/m·K |
Ce-TZP/Al2O3 nanocomposite | Alumina-dispersed Ce-TZP: restores hardness and doubles strength while keeping very high toughness — the grade used for hip joint heads and heavily loaded tooling. | — | — | — | 1,200 HV | 6 W/m·K |
What is Ce-TZP HIP?
Ce-TZP HIP is Ce-TZP in the HIP condition — choose for the highest strength and finest surface finish in Ce-TZP (wire-drawing dies, precision wear parts) where porosity-initiated failure must be eliminated. Ce-TZP HIP has a tensile strength of 430 MPa (62.4 ksi), stronger than 76% of ceramic grades. The elastic modulus is 212 GPa (30.7 Msi). Ce-TZP HIP has a density of 6.24 g/cm³ (0.225 lb/in³), heavier than 69% of ceramic grades. It melts at 2,650°C (4,802 °F). 12CE is the default condition FabDigit quotes; HIP is available on request or by drawing note.
Advantages
- Good corrosion resistance — 94/100, better than 96% of ceramic grades
- Polishes to a fine finish — 94/100, better than 95% of ceramic grades
- Tough — resists crack growth — 10 MPa·√m (9.1 ksi·√in), better than 87% of ceramic grades
Limitations
- Poor heat conductor — 2.7 W/m·K (1.56 BTU/hr·ft·°F), worse than 80% of ceramic grades
Ce-TZP HIP properties
Typical room-temperature values for Ce-TZP HIP; 16 are specific to this condition. Other listed values are Ce-TZP reference data and may not represent this condition. Bars are the position among ceramic grades.
Physical4
Ce-TZP HIP has a density of 6.24 g/cm³ (0.225 lb/in³), heavier than 69% of ceramic grades. It melts at 2,650°C (4,802 °F).
Mechanical11
Ce-TZP HIP has a tensile strength of 430 MPa (62.4 ksi), stronger than 76% of ceramic grades. The elastic modulus is 212 GPa (30.7 Msi).
Thermal5
Ce-TZP HIP is rated for continuous service to 1,050°C (1,922 °F). It conducts heat at 2.7 W/m·K (1.56 BTU/hr·ft·°F), worse than 80% of ceramic grades. Thermal expansion is 10.5 µm/m·K (5.83 µin/in·°F).
Electrical5
Ce-TZP HIP is an electrical insulator with a dielectric strength of 12 kV/mm (304.8 V/mil) and a resistivity of 1×10⁸ Ω·m.
Chemical & Environmental2
Corrosion resistance is excellent (94/100), better than 96% of ceramic grades.
Sustainability4
Producing a kilogram of Ce-TZP HIP takes about 110 MJ of energy and emits 7.5 kg of CO₂ — less than 52% of ceramic grades. Typical recycled content is 0%.
Manufacturability3
Ce-TZP HIP's machinability is not recommended (3/100, worse than 95% of ceramic grades).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with Ce-TZP HIP
Is Ce-TZP easy to machine?
Green/bisque machine wherever possible; after sintering only diamond grinding, lapping or laser/ultrasonic machining — but Ce-TZP tolerates grinding far better than Y-TZP thanks to its high toughness.
Can Ce-TZP be welded?
Not weldable; join by active-metal brazing (Ti-containing AgCu), glass sealing or mechanical/shrink fits, allowing for the ~10.5 µm/m·K CTE mismatch with steels.
Can Ce-TZP be formed, bent or molded?
Formed by uniaxial/CIP pressing, slip or injection molding of granulate, then sintering at 1450–1550 °C in air; avoid reducing atmospheres and vacuum sintering, which reduce ceria and darken/destabilize the body.
What surface finishes work on Ce-TZP?
Diamond lapping and polishing to Ra <0.05 µm; grinding-induced compressive surface stress from t→m transformation actually raises strength, and no LTD annealing is needed as with Y-TZP.
Ce-TZP chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| CeO2≈10–12 mol% CeO2 expressed in wt% | 13 – 17 | 16 |
| Al2O3sintering aid in monolithic grades; 20–30 vol% in Ce-TZP/A composite | 0 – 0.5 | 0.25 |
| HfO2naturally present with zirconia | 1 – 2.5 | 1.8 |
| SiO2impurity | 0 – 0.1 | 0.02 |
| Fe2O3impurity | 0 – 0.05 | 0.01 |
| Na2Oimpurity | 0 – 0.05 | 0.01 |
| ZrO2balance, tetragonal phase | balance | — |
Ce-TZP HIP — frequently asked
What is Ce-TZP HIP used for?
Ce-TZP HIP is typically used for biomedical implants, impact-resistant components and layered ZTA/Ce-TZP composites. In short: highest-toughness zirconia; no hydrothermal ageing; damage-tolerant Y-TZP substitute.
What is the tensile strength of Ce-TZP HIP?
Ce-TZP HIP has a typical tensile strength of 430 MPa (62.4 ksi) — stronger than 76% of ceramic grades. Strength varies by condition: see the 4 listed tempers.
Is Ce-TZP HIP easy to machine?
Not especially — machinability is rated not recommended (3/100, worse than 95% of ceramic grades). Green/bisque machine wherever possible; after sintering only diamond grinding, lapping or laser/ultrasonic machining — but Ce-TZP tolerates grinding far better than Y-TZP thanks to its high toughness.
Can Ce-TZP HIP be welded?
Not weldable; join by active-metal brazing (Ti-containing AgCu), glass sealing or mechanical/shrink fits, allowing for the ~10.5 µm/m·K CTE mismatch with steels.
What surface finishes work on Ce-TZP HIP?
Diamond lapping and polishing to Ra <0.05 µm; grinding-induced compressive surface stress from t→m transformation actually raises strength, and no LTD annealing is needed as with Y-TZP.
Can Ce-TZP HIP be formed, bent or molded?
Formed by uniaxial/CIP pressing, slip or injection molding of granulate, then sintering at 1450–1550 °C in air; avoid reducing atmospheres and vacuum sintering, which reduce ceria and darken/destabilize the body.
What is the maximum service temperature of Ce-TZP HIP?
Ce-TZP HIP is rated for continuous use to about 1,050°C (1,922 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- CEZ series ceria-stabilized zirconia powder data — Tosoh (2022)
- ASM Engineered Materials Handbook Vol.4: Ceramics and Glasses — ASM International (1991)
- Transformation toughening in Ce-TZP and Ce-TZP/Al2O3 composites (review chapters) — Journal of the American Ceramic Society / Elsevier (2010)
- Zirconia ceramic material properties (TZP grades) — CoorsTek / Kyocera (2023)
- ISO 13356 — Implants for surgery: ceramic materials based on yttria-stabilized tetragonal zirconia (reference for TZP test methods) — ISO (2015)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.