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Solder & Low-Melting Alloy SAC305 REFLOWED

Heat-treated state

ISO 711 · also IEC A30C5

Reference condition for joint-level design data straight off the reflow oven, before thermal ageing.

High cost $$$$

Values for the REFLOWED condition

Other SAC305 tempers and conditions

SAC305 is listed in 2 conditions; see the grade overview at SAC305.

Compare all 2 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Isothermally aged
Use for end-of-life / high-temperature reliability estimates, where IMC coarsening drops strength and stiffness.22334212 HB13.5 % IACS
REFLOWEDThis page
rapid cooling, fine Ag3Sn/Cu6Sn5 dispersion
Reference condition for joint-level design data straight off the reflow oven, before thermal ageing.40552517 HB13 % IACS

What is SAC305 REFLOWED?

SAC305 REFLOWED is SAC305 heat treated to REFLOWED — reference condition for joint-level design data straight off the reflow oven, before thermal ageing. SAC305 REFLOWED has a yield strength of 40 MPa (5.8 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 88% of solder & low-melting alloy grades. Elongation at break is 25% and the elastic modulus is 48 GPa (6.96 Msi). SAC305 REFLOWED has a density of 7.38 g/cm³ (0.267 lb/in³), lighter than 74% of solder & low-melting alloy grades. It melts at 217°C (423 °F).

Advantages

  • High strength — 40 MPa (5.8 ksi), better than 88% of solder & low-melting alloy grades
  • High electrical conductivity — 13 % IACS, better than 87% of solder & low-melting alloy grades
  • Conducts heat well — 58 W/m·K (33.5 BTU/hr·ft·°F), better than 85% of solder & low-melting alloy grades
  • Readily welded — 30/100, better than 83% of solder & low-melting alloy grades
  • Stiff — 48 GPa (6.96 Msi), better than 81% of solder & low-melting alloy grades

Limitations

  • Difficult to machine — 20/100, worse than 94% of solder & low-melting alloy grades
  • High embodied carbon — 24 kg CO₂/kg, worse than 94% of solder & low-melting alloy grades
  • Limited ductility — 25%, worse than 76% of solder & low-melting alloy grades

SAC305 REFLOWED properties

Typical room-temperature values for SAC305 REFLOWED; 17 are specific to this condition. Other listed values are SAC305 reference data and may not represent this condition. Bars are the position among solder & low-melting alloy grades.

Physical3

SAC305 REFLOWED has a density of 7.38 g/cm³ (0.267 lb/in³), lighter than 74% of solder & low-melting alloy grades. It melts at 217°C (423 °F).

Density7.38 g/cm³0.27 lb/in³
Melting Point (Solidus)217°C423 °F
Liquidus Temperature220°C428 °F

Mechanical11

SAC305 REFLOWED has a yield strength of 40 MPa (5.8 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 88% of solder & low-melting alloy grades. Elongation at break is 25% and the elastic modulus is 48 GPa (6.96 Msi).

Elastic (Young's) Modulus48 GPa7 Msi
Shear Modulus17.5 GPa2.5 Msi
Bulk Modulus54 GPa7.8 Msi
Poisson's Ratio0.36
Tensile Strength (Ultimate)55 MPa8 ksi
Yield Strength (0.2% offset)40 MPa5.8 ksi
Elongation at Break25%
Shear Strength38 MPa5.5 ksi
Fatigue Strength (Endurance Limit)18 MPa2.6 ksi
Hardness, Brinell17 HB
Hardness, Vickers16 HV

Thermal6

SAC305 REFLOWED is rated for continuous service to 125°C (257 °F). It conducts heat at 58 W/m·K (33.5 BTU/hr·ft·°F), better than 85% of solder & low-melting alloy grades. Thermal expansion is 22 µm/m·K (12.2 µin/in·°F).

Thermal Conductivity58 W/m·K33.5 BTU/hr·ft·°F
Specific Heat Capacity230 J/kg·K0.05 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)22 µm/m·K12.2 µin/in·°F
Latent Heat of Fusion61 J/g26.2 BTU/lb
Max Service Temperature (continuous)125°C257 °F
Min Service Temperature-55°C-67 °F

Electrical3

SAC305 REFLOWED conducts electricity at 13 % IACS, better than 87% of solder & low-melting alloy grades.

Electrical Conductivity13 % IACS
Electrical Resistivity1.32×10⁻⁷ Ω·m5.2 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is fair (45/100), worse than 52% of solder & low-melting alloy grades.

Galvanic Potential (seawater, vs SCE)-0.5 V
Corrosion ResistanceFair45/100
Chemical Resistance SummaryStable in dry air and neutral atmospheres with a thin protective SnO2 film; attacked by strong acids (HCl, H2SO4), alkalis and halide/no-clean flux residues under humidity, and dissolves rapidly in molten-tin/acidic tinning chemistries. Susceptible to electrochemical migration and tin whisker growth under bias plus humidity.

Sustainability4

Producing a kilogram of SAC305 REFLOWED takes about 350 MJ of energy and emits 24 kg of CO₂ — more than 92% of solder & low-melting alloy grades. Typical recycled content is 25%.

Embodied Energy (primary production)350 MJ/kg150,473 BTU/lb
Embodied Carbon (primary production)24 kg CO₂/kg
Embodied Water900 L/kg108 gal/lb
Typical Recycled Content25%

Manufacturability6

SAC305 REFLOWED's machinability is poor (20/100, worse than 94% of solder & low-melting alloy grades); weldability poor (30/100); formability excellent (85/100).

MachinabilityPoor20/100
WeldabilityPoor30/100
Formability (cold)Excellent85/100
CastabilityExcellent95/100
Brazeability / SolderabilityExcellent100/100
PolishabilityPoor25/100

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with SAC305 REFLOWED

Is SAC305 easy to machine?

Rarely machined — extremely soft and gummy; use sharp positive-rake tools, high rake, kerosene-type lubricant, or simply stamp/shear preforms instead.

Can SAC305 be welded?

Not a welding alloy; joints are made by melting the solder itself — reflow peak 235–250 °C, wave pot 255–265 °C, with N2 helpful for wetting and dross control.

Can SAC305 be formed, bent or molded?

Casts to bar/ingot readily and draws to sub-0.3 mm wire or rolls to thin foil without intermediate anneal; atomized under inert gas for paste powder and BGA spheres.

What surface finishes work on SAC305?

No coating normally applied; keep flux residues per IPC J-STD-001 cleanliness limits, and consider conformal coating or Ni/Bi-modified variants to suppress tin whiskers and dendritic migration.

SAC305 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
AgJ-STD-006 Sn96.5Ag3.0Cu0.5 (SAC305)2.9 – 3.23
Cu0.4 – 0.60.5
PbRoHS-compliant limit; many suppliers hold ≤0.05≤ 0.07—
Sbimpurity limit≤ 0.05—
Biimpurity limit≤ 0.05—
Feimpurity limit≤ 0.02—
Asimpurity limit≤ 0.03—
Cdimpurity limit≤ 0—
Znimpurity limit≤ 0—
Alimpurity limit≤ 0—
Niimpurity limit (intentional Ni additions give SAC305+Ni variants)≤ 0.01—
Snbalance, nominally 96.5 %balance—

SAC305 REFLOWED — frequently asked

What is SAC305 REFLOWED used for?

SAC305 REFLOWED is typically used for reflow SMT soldering, wave soldering, solder paste/preforms and roHS-compliant electronics manufacturing. In short: industry-standard lead-free solder; widest form availability; roHS default alloy.

What is the yield strength of SAC305 REFLOWED?

SAC305 REFLOWED has a typical yield strength of 40 MPa (5.8 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 88% of solder & low-melting alloy grades. Strength varies by condition: see the 2 listed tempers.

Is SAC305 REFLOWED easy to machine?

Not especially — machinability is rated poor (20/100, worse than 94% of solder & low-melting alloy grades). Rarely machined — extremely soft and gummy; use sharp positive-rake tools, high rake, kerosene-type lubricant, or simply stamp/shear preforms instead.

Can SAC305 REFLOWED be welded?

Not readily — weldability is rated poor (30/100). Not a welding alloy; joints are made by melting the solder itself — reflow peak 235–250 °C, wave pot 255–265 °C, with N2 helpful for wetting and dross control.

What surface finishes work on SAC305 REFLOWED?

No coating normally applied; keep flux residues per IPC J-STD-001 cleanliness limits, and consider conformal coating or Ni/Bi-modified variants to suppress tin whiskers and dendritic migration.

Can SAC305 REFLOWED be formed, bent or molded?

Casts to bar/ingot readily and draws to sub-0.3 mm wire or rolls to thin foil without intermediate anneal; atomized under inert gas for paste powder and BGA spheres.

What is the maximum service temperature of SAC305 REFLOWED?

SAC305 REFLOWED is rated for continuous use to about 125°C (257 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Sources

  1. IPC J-STD-006 — Requirements for Electronic Grade Solder Alloys — IPC (2013)
  2. IPC J-STD-005 / J-STD-004 — Solder paste and flux requirements — IPC (2012)
  3. IEC 61190-1-3 — Solder alloys (A30C5 designation) — IEC (2017)
  4. GB/T 20422 — SAC (China) (2018)
  5. SAC305 alloy and solder paste technical datasheets — Indium Corporation / AIM Solder / Kester / Alpha Assembly (2023)
  6. Properties of Lead-Free Solders / Pb-free solder property database — NIST (2002)
  7. Lead-Free Soldering — mechanical and reliability data compilations — Springer / IPC-9701 reliability literature (2011)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.