X7R ULTRA-THIN
Grade
For high-capacitance small-case MLCCs with <1 µm dielectric layers; fine hydrothermal BaTiO3 powder, higher breakdown field but reduced K due to size effect.
Values for the ULTRA-THIN condition
Other X7R tempers and conditions
X7R is listed in 4 conditions; see the grade overview at X7R.
Compare all 4 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Precious-metal (Ag/Pd) electrode formulation, air-fired | Choose for legacy/high-reliability air-fired MLCCs, thick-film hybrids and disc capacitors where Ni co-firing is not available. | — | 50 | 0 | 580 HV | 3 W/m·K |
BMEDefault Base-metal (Ni) electrode formulation, reducing-atmosphere fired | Standard modern MLCC dielectric: rare-earth/Mg/Mn core-shell BaTiO3 co-fired with Ni electrodes in low-pO2 atmosphere; lowest cost per µF. | — | 55 | 0 | 620 HV | 3 W/m·K |
High-voltage / thick-layer X7R formulation | Lower-K, coarser or heavily shell-doped composition for 500 V–3 kV MLCCs and ceramic discs, giving higher breakdown field and flatter DC-bias behaviour. | — | 58 | 0 | 640 HV | 3 W/m·K |
ULTRA-THINThis page sub-micron fine-grain core-shell X7R | For high-capacitance small-case MLCCs with <1 µm dielectric layers; fine hydrothermal BaTiO3 powder, higher breakdown field but reduced K due to size effect. | — | 62 | 0 | 680 HV | 3 W/m·K |
What is X7R ULTRA-THIN?
X7R ULTRA-THIN is X7R in the ULTRA-THIN grade — for high-capacitance small-case MLCCs with <1 µm dielectric layers; fine hydrothermal BaTiO3 powder, higher breakdown field but reduced K due to size effect. X7R ULTRA-THIN has a tensile strength of 62 MPa (8.99 ksi), weaker than 62% of ceramic grades. Elongation at break is 0% and the elastic modulus is 125 GPa (18.1 Msi). X7R ULTRA-THIN has a density of 5.7 g/cm³ (0.206 lb/in³), heavier than 58% of ceramic grades. It melts at 1,618°C (2,944 °F). BME is the default condition FabDigit quotes; ULTRA-THIN is available on request or by drawing note.
Limitations
- Limited service temperature — 125°C (257 °F), worse than 94% of ceramic grades
- Poor heat conductor — 2.6 W/m·K (1.5 BTU/hr·ft·°F), worse than 80% of ceramic grades
X7R ULTRA-THIN properties
Typical room-temperature values for X7R ULTRA-THIN; 19 are specific to this condition. Other listed values are X7R reference data and may not represent this condition. Bars are the position among ceramic grades.
Physical3
X7R ULTRA-THIN has a density of 5.7 g/cm³ (0.206 lb/in³), heavier than 58% of ceramic grades. It melts at 1,618°C (2,944 °F).
Mechanical12
X7R ULTRA-THIN has a tensile strength of 62 MPa (8.99 ksi), weaker than 62% of ceramic grades. Elongation at break is 0% and the elastic modulus is 125 GPa (18.1 Msi).
Thermal5
X7R ULTRA-THIN is rated for continuous service to 125°C (257 °F). It conducts heat at 2.6 W/m·K (1.5 BTU/hr·ft·°F), worse than 80% of ceramic grades. Thermal expansion is 10 µm/m·K (5.56 µin/in·°F).
Electrical5
X7R ULTRA-THIN is an electrical insulator with a dielectric strength of 90 kV/mm (2,286 V/mil) and a resistivity of 1×10¹⁰ Ω·m.
Chemical & Environmental2
Corrosion resistance is very good (78/100), better than 53% of ceramic grades.
Sustainability4
Producing a kilogram of X7R ULTRA-THIN takes about 90 MJ of energy and emits 7.5 kg of CO₂ — less than 62% of ceramic grades. Typical recycled content is 0%.
Manufacturability3
X7R ULTRA-THIN's machinability is not recommended (4/100, worse than 85% of ceramic grades).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with X7R ULTRA-THIN
Is X7R easy to machine?
Fired bodies require diamond grinding/dicing; all real shaping is done on green tape (doctor-bladed, punched, laser-cut, screen-printed with Ni or Ag/Pd electrode ink).
Can X7R be welded?
Not weldable — joining is by soldering/brazing of the fired-on Cu/Ni/Sn terminations or by glass/epoxy bonding.
Can X7R be formed, bent or molded?
Tape casting plus stacking, isostatic lamination, dicing, binder burnout and co-firing at ~1150–1350 °C (low pO2 for BME), followed by re-oxidation anneal.
What surface finishes work on X7R?
Barrel-polish or tumble the fired chips, then terminate with Cu/Ag paste plus Ni/Sn barrier plating; avoid mechanical or thermal shock that causes flex cracks.
X7R chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Dy2O3/Ho2O3/Y2O3 (rare-earth shell formeflattens Curie peak, improves insulation-resistance lifetime | 0.5 – 3 | 1.5 |
| MgOacceptor, suppresses reduction of Ti4+ | 0.3 – 2 | 1 |
| MnO/Mn3O4acceptor / oxygen-vacancy trap for BME firing | 0.05 – 0.5 | 0.2 |
| SiO2 + BaO/CaO glass sintering aid | 0.5 – 3 | 1.5 |
| CaZrO3 / ZrO2 / Nb2O5 (shifters)TCC shaping additives, formulation dependent | 0 – 3 | 1 |
| BaTiO3core-shell base, Ba/Ti ratio ~1.000–1.005 | ≥ 88 (balance) | — |
X7R ULTRA-THIN — frequently asked
What is X7R ULTRA-THIN used for?
X7R ULTRA-THIN is typically used for MLCC capacitors, decoupling capacitors and general filtering. In short: default general-purpose MLCC; ±15% to 125 °C; bias- and age-sensitive capacitance.
What is the tensile strength of X7R ULTRA-THIN?
X7R ULTRA-THIN has a typical tensile strength of 62 MPa (8.99 ksi) — weaker than 62% of ceramic grades. Strength varies by condition: see the 4 listed tempers.
Is X7R ULTRA-THIN easy to machine?
Not especially — machinability is rated not recommended (4/100, worse than 85% of ceramic grades). Fired bodies require diamond grinding/dicing; all real shaping is done on green tape (doctor-bladed, punched, laser-cut, screen-printed with Ni or Ag/Pd electrode ink).
Can X7R ULTRA-THIN be welded?
Not weldable — joining is by soldering/brazing of the fired-on Cu/Ni/Sn terminations or by glass/epoxy bonding.
What surface finishes work on X7R ULTRA-THIN?
Barrel-polish or tumble the fired chips, then terminate with Cu/Ag paste plus Ni/Sn barrier plating; avoid mechanical or thermal shock that causes flex cracks.
Can X7R ULTRA-THIN be formed, bent or molded?
Tape casting plus stacking, isostatic lamination, dicing, binder burnout and co-firing at ~1150–1350 °C (low pO2 for BME), followed by re-oxidation anneal.
What is the maximum service temperature of X7R ULTRA-THIN?
X7R ULTRA-THIN is rated for continuous use to about 125°C (257 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- EIA RS-198 / IEC 60384-21 Class II ceramic dielectric temperature characteristics — EIA / IEC (2019)
- ASM Engineered Materials Handbook Vol.4 — Ceramics and Glasses (BaTiO3 dielectrics) — ASM International (1991)
- Moulson & Herbert, Electroceramics: Materials, Properties, Applications — Wiley (2003)
- MLCC X7R dielectric characteristics and dielectric powder datasheets — Murata / KEMET / Sakai Chemical / (2023)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.