X5R HK-THIN
Grade
HK-THIN = ultra-fine-grain high-K thin-layer X5R
Pick for maximum capacitance density in 0402/0201 cases or 100 µF-class MLCCs: sub-micron core–shell BaTiO₃ fired at low temperature, at the cost of higher DF, stronger DC-bias capacitance loss and an 85 °C limit.
Values for the HK-THIN condition
Other X5R tempers and conditions
X5R is listed in 3 conditions; see the grade overview at X5R.
Compare all 3 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Precious-metal (Ag/Pd) electrode, air-fired X5R dielectric | Choose for legacy, high-reliability or low-volume MLCC/disc lines fired in air where Ag/Pd electrodes and simpler oxidizing firing are preferred. | — | 48 | 0 | 540 HV | 3 W/m·K |
BMEDefault Base-metal (Ni) electrode, reduction-resistant X5R dielectric | Mainstream commercial X5R for Ni-electrode MLCCs: acceptor/rare-earth co-doped BaTiO3 fired in reducing atmosphere; best cost and volumetric efficiency. | — | 50 | 0 | 560 HV | 3 W/m·K |
HK-THINThis page Ultra-fine-grain high-K thin-layer X5R | Pick for maximum capacitance density in 0402/0201 cases or 100 µF-class MLCCs: sub-micron core–shell BaTiO₃ fired at low temperature, at the cost of higher DF, stronger DC-bias capacitance loss and an 85 °C limit. | — | — | — | — | — |
What is X5R HK-THIN?
X5R HK-THIN is X5R in the HK-THIN grade — pick for maximum capacitance density in 0402/0201 cases or 100 µF-class MLCCs: sub-micron core–shell BaTiO₃ fired at low temperature, at the cost of higher DF, stronger DC-bias capacitance loss and an 85 °C limit. X5R HK-THIN has a tensile strength of 50 MPa (7.25 ksi), weaker than 67% of ceramic grades. Elongation at break is 0% and the elastic modulus is 115 GPa (16.7 Msi). X5R HK-THIN has a density of 5.7 g/cm³ (0.206 lb/in³), heavier than 58% of ceramic grades. It melts at 1,618°C (2,944 °F). BME is the default condition FabDigit quotes; HK-THIN is available on request or by drawing note.
Limitations
- Limited service temperature — 85°C (185 °F), worse than 99% of ceramic grades
- Low fracture toughness — 1 MPa·√m (0.91 ksi·√in), worse than 84% of ceramic grades
- Poor heat conductor — 3 W/m·K (1.73 BTU/hr·ft·°F), worse than 77% of ceramic grades
X5R HK-THIN properties
Typical room-temperature values for X5R HK-THIN; 10 are specific to this condition. Other listed values are X5R reference data and may not represent this condition. Bars are the position among ceramic grades.
Physical4
X5R HK-THIN has a density of 5.7 g/cm³ (0.206 lb/in³), heavier than 58% of ceramic grades. It melts at 1,618°C (2,944 °F).
Mechanical12
X5R HK-THIN has a tensile strength of 50 MPa (7.25 ksi), weaker than 67% of ceramic grades. Elongation at break is 0% and the elastic modulus is 115 GPa (16.7 Msi).
Thermal5
X5R HK-THIN is rated for continuous service to 85°C (185 °F). It conducts heat at 3 W/m·K (1.73 BTU/hr·ft·°F), worse than 77% of ceramic grades. Thermal expansion is 10 µm/m·K (5.56 µin/in·°F).
Electrical5
X5R HK-THIN is an electrical insulator with a dielectric strength of 80 kV/mm (2,032 V/mil) and a resistivity of 1×10¹⁰ Ω·m.
Chemical & Environmental2
Corrosion resistance is very good (78/100), better than 53% of ceramic grades.
Sustainability4
Producing a kilogram of X5R HK-THIN takes about 70 MJ of energy and emits 6 kg of CO₂ — less than 71% of ceramic grades. Typical recycled content is 0%.
Manufacturability3
X5R HK-THIN's machinability is not recommended (4/100, worse than 85% of ceramic grades).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with X5R HK-THIN
Is X5R easy to machine?
No conventional machining — shape in the green (tape-cast/laminated) state by punching, dicing or laser; fired bodies need diamond grinding/lapping only.
Can X5R be welded?
Not weldable; joining is by fired-on Cu or Ag termination plus Ni/Sn barrier plating and solder or conductive adhesive.
Can X5R be formed, bent or molded?
Tape casting of slip, screen-printed Ni or Ag/Pd electrodes, stacking/isostatic lamination, binder burnout, then co-firing at 1120–1350 °C (reducing atmosphere with pO2 control for BME).
What surface finishes work on X5R?
Barrel-tumble to round edges, apply termination paste and re-fire, then electroplate Ni/Sn; avoid grinding-induced microcracks that degrade insulation resistance.
X5R chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| CaZrO3Curie-point shifter / shell former (also BaZrO3, CaTiO3) | 0 – 4 | 2 |
| Dy2O3rare-earth shell dopant; Ho2O3/Y2O3/Er2O3 used interchangeably | 0.5 – 3 | 1.5 |
| MgOacceptor, reduction resistance for BME firing | 0.3 – 1.5 | 0.8 |
| MnOacceptor / IR life improver | 0.05 – 0.4 | 0.15 |
| SiO2sintering aid, part of Ba-Ca-Si glass frit | 0.4 – 2.5 | 1.2 |
| V2O5optional reliability dopant | 0 – 0.2 | 0.05 |
| BaTiO3core-shell barium titanate matrix, Ba/Ti ≈ 1.00–1.01 | ≥ 88 (balance) | — |
X5R HK-THIN — frequently asked
What is X5R HK-THIN used for?
X5R HK-THIN is typically used for compact MLCC capacitors, bypass and decoupling in consumer electronics, DC-DC converter input and output capacitors, battery-line bulk capacitance, low-profile capacitors for modules and embedded boards and handheld-device power filtering. In short: higher capacitance density than X7R; 85 °C temperature ceiling; compact-electronics workhorse.
What is the tensile strength of X5R HK-THIN?
X5R HK-THIN has a typical tensile strength of 50 MPa (7.25 ksi) — weaker than 67% of ceramic grades. Strength varies by condition: see the 3 listed tempers.
Is X5R HK-THIN easy to machine?
Not especially — machinability is rated not recommended (4/100, worse than 85% of ceramic grades). No conventional machining — shape in the green (tape-cast/laminated) state by punching, dicing or laser; fired bodies need diamond grinding/lapping only.
Can X5R HK-THIN be welded?
Not weldable; joining is by fired-on Cu or Ag termination plus Ni/Sn barrier plating and solder or conductive adhesive.
What surface finishes work on X5R HK-THIN?
Barrel-tumble to round edges, apply termination paste and re-fire, then electroplate Ni/Sn; avoid grinding-induced microcracks that degrade insulation resistance.
Can X5R HK-THIN be formed, bent or molded?
Tape casting of slip, screen-printed Ni or Ag/Pd electrodes, stacking/isostatic lamination, binder burnout, then co-firing at 1120–1350 °C (reducing atmosphere with pO2 control for BME).
What is the maximum service temperature of X5R HK-THIN?
X5R HK-THIN is rated for continuous use to about 85°C (185 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- EIA RS-198 / IEC 60384-21 — Class II ceramic dielectric temperature characteristics (X5R) — EIA / IEC (2019)
- Engineered Materials Handbook Vol.4: Ceramics and Glasses — Electronic ceramics — ASM International (1991)
- Piezoelectric and Dielectric Ceramics (BaTiO3 property data) — Academic literature compilation (2015)
- MLCC general technical information and dielectric characteristics — Murata / TDK / Samsung Electro-Mechanics (2024)
- MLCC-grade barium titanate powder datasheets — Sakai Chemical / Ferro / (Sinocera) (2024)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.