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TiO2 Ceramic C-310 HP99

Grade

ISO IEC 60672 Type C-310

HP99 = high-purity dense titania

Pick when maximum permittivity, lowest loss and vacuum-tight, near-zero-porosity bodies are needed (RF/microwave dielectrics, feedthroughs, wear parts).

High cost $$$$

Values for the HP99 condition

What is TiO2 Ceramic C-310 HP99?

TiO2 Ceramic C-310 HP99 is TiO2 Ceramic C-310 in the HP99 grade — pick when maximum permittivity, lowest loss and vacuum-tight, near-zero-porosity bodies are needed (RF/microwave dielectrics, feedthroughs, wear parts). TiO2 Ceramic C-310 HP99 has a tensile strength of 55 MPa (7.98 ksi), weaker than 65% of ceramic grades. The elastic modulus is 250 GPa (36.3 Msi). TiO2 Ceramic C-310 HP99 has a density of 4.05 g/cm³ (0.146 lb/in³), lighter than 57% of ceramic grades. It melts at 1,843°C (3,349 °F).

TiO2 Ceramic C-310 HP99 properties

Typical room-temperature values for TiO2 Ceramic C-310 HP99; 15 are specific to this condition. Other listed values are TiO2 Ceramic C-310 reference data and may not represent this condition. Bars are the position among ceramic grades.

Physical3

TiO2 Ceramic C-310 HP99 has a density of 4.05 g/cm³ (0.146 lb/in³), lighter than 57% of ceramic grades. It melts at 1,843°C (3,349 °F).

Density4.05 g/cm³0.15 lb/in³
Melting Point (Solidus)1,843°C3,349 °F
Porosity0.2%

Mechanical11

TiO2 Ceramic C-310 HP99 has a tensile strength of 55 MPa (7.98 ksi), weaker than 65% of ceramic grades. The elastic modulus is 250 GPa (36.3 Msi).

Elastic (Young's) Modulus250 GPa36.3 Msi
Shear Modulus87 GPa12.6 Msi
Bulk Modulus160 GPa23.2 Msi
Poisson's Ratio0.27
Tensile Strength (Ultimate)55 MPa8 ksi
Compressive Strength820 MPa119 ksi
Flexural Strength145 MPa21 ksi
Fracture Toughness (K_IC)2.8 MPa·√m2.5 ksi·√in
Hardness, Vickers950 HV
Hardness, Knoop880 HK
Hardness, Mohs6.5

Thermal5

TiO2 Ceramic C-310 HP99 is rated for continuous service to 1,100°C (2,012 °F). It conducts heat at 6 W/m·K (3.47 BTU/hr·ft·°F), worse than 61% of ceramic grades. Thermal expansion is 8 µm/m·K (4.44 µin/in·°F).

Thermal Conductivity6 W/m·K3.5 BTU/hr·ft·°F
Specific Heat Capacity700 J/kg·K0.17 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)8 µm/m·K4.4 µin/in·°F
Max Service Temperature (continuous)1,100°C2,012 °F
Min Service Temperature-200°C-328 °F

Electrical5

TiO2 Ceramic C-310 HP99 is an electrical insulator with a dielectric strength of 10 kV/mm (254 V/mil) and a resistivity of 1×10¹¹ Ω·m.

Electrical Resistivity1×10¹¹ Ω·m3.94×10¹⁸ µΩ·in
Dielectric Strength10 kV/mm254 V/mil
Dielectric Constant (1 MHz)100
Dissipation Factor (1 MHz)4×10⁻⁴
Volume Resistivity1×10¹⁴ Ω·cm

Chemical & Environmental2

Corrosion resistance is excellent (85/100), better than 69% of ceramic grades.

Corrosion ResistanceExcellent85/100
Chemical Resistance SummaryInert to water, most dilute acids, alkalis and organic media; attacked by hydrofluoric acid and hot concentrated sulphuric acid; loses oxygen and turns semiconducting (blue-black) in hydrogen or vacuum above ~900 °C.

Sustainability4

Producing a kilogram of TiO2 Ceramic C-310 HP99 takes about 90 MJ of energy and emits 6.5 kg of CO₂ — less than 62% of ceramic grades. Typical recycled content is 0%.

Embodied Energy (primary production)90 MJ/kg38,693 BTU/lb
Embodied Carbon (primary production)6.5 kg CO₂/kg
Embodied Water120 L/kg14.4 gal/lb
Typical Recycled Content0%

Manufacturability3

TiO2 Ceramic C-310 HP99's machinability is not recommended (4/100, worse than 85% of ceramic grades).

MachinabilityNot recommended4/100
PolishabilityVery good80/100
Sintering / Firing Temperature1,350°C2,462 °F

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with TiO2 Ceramic C-310 HP99

Is TiO2 Ceramic C-310 easy to machine?

Machine in the green or bisque state wherever possible; the fired body needs diamond grinding, lapping or laser/ultrasonic machining and chips easily at edges.

Can TiO2 Ceramic C-310 be welded?

Not weldable — join by active-metal brazing (Ti/Ag-Cu), glass sealing or metallising (Mo-Mn + Ni) followed by soldering; match CTE (~8 µm/m·K) with Kovar-class or Ni-Fe hardware.

Can TiO2 Ceramic C-310 be formed, bent or molded?

Shaped by dry pressing, isostatic pressing, extrusion or slip casting of the milled TiO2 powder, then sintered at ~1300–1400 °C in air; firing shrinkage is typically 14–18 %.

What surface finishes work on TiO2 Ceramic C-310?

Available as-fired, ground, lapped or glazed; metallisable for electrodes and solderable terminations, and can be diamond-polished to a low-Ra dielectric surface.

TiO2 Ceramic C-310 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
SiO2from clay/flux additions0 – 31.5
Al2O30 – 21
CaOsintering aid / permittivity modifier0 – 20.8
MgOsintering aid0 – 20.5
ZrO2optional grain-growth control0 – 10.2
Fe2O3impurity; raises dielectric loss0 – 0.20.05
TiO2rutile phase after firing≥ 90 (balance)—

TiO2 Ceramic C-310 HP99 — frequently asked

What is TiO2 Ceramic C-310 HP99 used for?

TiO2 Ceramic C-310 HP99 is typically used for high-K capacitors, temperature-compensating capacitor dielectrics and microwave components. In short: high-permittivity dielectric ceramic; compact capacitance density; brittle, diamond-machined only.

What is the tensile strength of TiO2 Ceramic C-310 HP99?

TiO2 Ceramic C-310 HP99 has a typical tensile strength of 55 MPa (7.98 ksi) — weaker than 65% of ceramic grades.

Is TiO2 Ceramic C-310 HP99 easy to machine?

Not especially — machinability is rated not recommended (4/100, worse than 85% of ceramic grades). Machine in the green or bisque state wherever possible; the fired body needs diamond grinding, lapping or laser/ultrasonic machining and chips easily at edges.

Can TiO2 Ceramic C-310 HP99 be welded?

Not weldable — join by active-metal brazing (Ti/Ag-Cu), glass sealing or metallising (Mo-Mn + Ni) followed by soldering; match CTE (~8 µm/m·K) with Kovar-class or Ni-Fe hardware.

What surface finishes work on TiO2 Ceramic C-310 HP99?

Available as-fired, ground, lapped or glazed; metallisable for electrodes and solderable terminations, and can be diamond-polished to a low-Ra dielectric surface.

Can TiO2 Ceramic C-310 HP99 be formed, bent or molded?

Shaped by dry pressing, isostatic pressing, extrusion or slip casting of the milled TiO2 powder, then sintered at ~1300–1400 °C in air; firing shrinkage is typically 14–18 %.

What is the maximum service temperature of TiO2 Ceramic C-310 HP99?

TiO2 Ceramic C-310 HP99 is rated for continuous use to about 1,100°C (2,012 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Sources

  1. IEC 60672-1 Ceramic and glass insulating materials — Definitions and classification — IEC (1995)
  2. IEC 60672-3 Ceramic and glass insulating materials — Specifications for individual materials (group C 310) — IEC (1997)
  3. ASM Engineered Materials Handbook Vol. 4: Ceramics and Glasses — ASM International (1991)
  4. Technical ceramics — titanium dioxide / titanate dielectric bodies — CeramTec / CoorsTek (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.