C0G/NP0 CZ-BME
Grade
CZ-BME = ca,Sr)(Zr,Ti)O₃ (Ni
Pick for automotive Class I parts working at 150–200 °C: the reduction-resistant body co-fires with base-metal Ni electrodes, cutting cost while keeping high insulation resistance hot.
Values for the CZ-BME condition
Other C0G/NP0 tempers and conditions
C0G/NP0 is listed in 4 conditions; see the grade overview at C0G/NP0.
Compare all 4 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Ⅰ / NP0 | Use for high-voltage disc capacitors and RF power or coupling parts: the glass-bonded low-permittivity Class I body withstands high voltage and forms easily in thick walls, at low capacitance density. | — | — | — | 620 HV | 3 W/m·K |
BNTDefault BaO–Nd₂O₃–TiO₂ C0G Ag/Pd | Use for high-capacitance Class I MLCCs: εr of about 60–90 with Ag/Pd inner electrodes gives the highest volumetric efficiency among Class I ceramics, rated to 125 °C. | — | — | — | 680 HV | 3 W/m·K |
CZ-BMEThis page Ca,Sr)(Zr,Ti)O₃ (Ni | Pick for automotive Class I parts working at 150–200 °C: the reduction-resistant body co-fires with base-metal Ni electrodes, cutting cost while keeping high insulation resistance hot. | — | — | — | 720 HV | 3 W/m·K |
MgTiO₃–CaTiO₃ Q | Choose when Q must be highest and loss lowest — RF resonators, microwave dielectric bodies, high-frequency power NP0 discs — accepting an εr of only about 20; usable to 200 °C. | — | — | — | 800 HV | 6 W/m·K |
What is C0G/NP0 CZ-BME?
C0G/NP0 CZ-BME is C0G/NP0 in the CZ-BME grade — pick for automotive Class I parts working at 150–200 °C: the reduction-resistant body co-fires with base-metal Ni electrodes, cutting cost while keeping high insulation resistance hot. C0G/NP0 CZ-BME has a tensile strength of 60 MPa (8.7 ksi), weaker than 63% of ceramic grades. The elastic modulus is 145 GPa (21 Msi). C0G/NP0 CZ-BME has a density of 4.6 g/cm³ (0.166 lb/in³), lighter than 54% of ceramic grades. It melts at 1,450°C (2,642 °F). BNT is the default condition FabDigit quotes; CZ-BME is available on request or by drawing note.
Advantages
- Good corrosion resistance — 90/100, better than 81% of ceramic grades
Limitations
- Limited service temperature — 200°C (392 °F), worse than 84% of ceramic grades
- Poor heat conductor — 2.5 W/m·K (1.44 BTU/hr·ft·°F), worse than 83% of ceramic grades
C0G/NP0 CZ-BME properties
Typical room-temperature values for C0G/NP0 CZ-BME; 11 are specific to this condition. Other listed values are C0G/NP0 reference data and may not represent this condition. Bars are the position among ceramic grades.
Physical3
C0G/NP0 CZ-BME has a density of 4.6 g/cm³ (0.166 lb/in³), lighter than 54% of ceramic grades. It melts at 1,450°C (2,642 °F).
Mechanical11
C0G/NP0 CZ-BME has a tensile strength of 60 MPa (8.7 ksi), weaker than 63% of ceramic grades. The elastic modulus is 145 GPa (21 Msi).
Thermal5
C0G/NP0 CZ-BME is rated for continuous service to 200°C (392 °F). It conducts heat at 2.5 W/m·K (1.44 BTU/hr·ft·°F), worse than 83% of ceramic grades. Thermal expansion is 10 µm/m·K (5.56 µin/in·°F).
Electrical5
C0G/NP0 CZ-BME is an electrical insulator with a dielectric strength of 25 kV/mm (635 V/mil) and a resistivity of 1×10¹¹ Ω·m.
Chemical & Environmental2
Corrosion resistance is excellent (90/100), better than 81% of ceramic grades.
Sustainability4
Producing a kilogram of C0G/NP0 CZ-BME takes about 70 MJ of energy and emits 6 kg of CO₂ — less than 71% of ceramic grades. Typical recycled content is 0%.
Manufacturability3
C0G/NP0 CZ-BME's machinability is not recommended (5/100, worse than 59% of ceramic grades).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C0G/NP0 CZ-BME
Is C0G/NP0 easy to machine?
After firing, only diamond grinding or laser scribing is practical; complex shapes must be punched, stacked or turned in the green state and then sintered.
Can C0G/NP0 be welded?
Ceramic cannot be welded. Parts are terminated with screen-printed Ag/Cu electrodes and Ni/Sn plating for reflow or wave soldering, or metallised with glass solder or active brazing.
Can C0G/NP0 be formed, bent or molded?
Discs are dry pressed; MLCCs are tape cast with screen-printed internal electrodes and isostatically laminated. After binder burnout, fire at 1100–1380 °C in air or in a reducing atmosphere.
What surface finishes work on C0G/NP0?
Dip terminations in silver or copper paste and fire in, then electroplate Ni/Sn as a solder barrier. Surfaces can be ground and polished, and chips are tumbled to deburr and preserve dielectric edge integrity.
C0G/NP0 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| TiO2main crystalline phase former (BNT system) | 40 – 52 | 46 |
| Nd2O3partly replaceable by Sm2O3/La2O3 to tune TCC | 26 – 38 | 32 |
| BaOusually introduced as BaCO3 | 12 – 22 | 18 |
| Bi2O3lowers sintering temperature, fine-tunes TCC | 0 – 6 | 3 |
| SiO2 + MnO +sintering aid/grain-boundary modifier; controls IR and Q | ≥ 0.2 (balance) | — |
C0G/NP0 CZ-BME — frequently asked
What is C0G/NP0 CZ-BME used for?
C0G/NP0 CZ-BME is typically used for RF filters, oscillator circuits, precision timing capacitors and resonant circuits. In short: most stable ceramic dielectric; class I, near-zero TCC; low capacitance density.
What is the tensile strength of C0G/NP0 CZ-BME?
C0G/NP0 CZ-BME has a typical tensile strength of 60 MPa (8.7 ksi) — weaker than 63% of ceramic grades. Strength varies by condition: see the 4 listed tempers.
Is C0G/NP0 CZ-BME easy to machine?
Not especially — machinability is rated not recommended (5/100, worse than 59% of ceramic grades). After firing, only diamond grinding or laser scribing is practical; complex shapes must be punched, stacked or turned in the green state and then sintered.
Can C0G/NP0 CZ-BME be welded?
Ceramic cannot be welded. Parts are terminated with screen-printed Ag/Cu electrodes and Ni/Sn plating for reflow or wave soldering, or metallised with glass solder or active brazing.
What surface finishes work on C0G/NP0 CZ-BME?
Dip terminations in silver or copper paste and fire in, then electroplate Ni/Sn as a solder barrier. Surfaces can be ground and polished, and chips are tumbled to deburr and preserve dielectric edge integrity.
Can C0G/NP0 CZ-BME be formed, bent or molded?
Discs are dry pressed; MLCCs are tape cast with screen-printed internal electrodes and isostatically laminated. After binder burnout, fire at 1100–1380 °C in air or in a reducing atmosphere.
What is the maximum service temperature of C0G/NP0 CZ-BME?
C0G/NP0 CZ-BME is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- EIA-198 / IEC 60384-8 & 60384-21 Class I ceramic dielectrics (COG/NP0) — ECIA / IEC (2019)
- ASM Engineered Materials Handbook Vol.4: Ceramics and Glasses — ASM International (1991)
- Ceramic Materials for Electronics (Buchanan) — CRC Press (2004)
- MLCC — Class I (C0G) — KEMET / Murata / (2023)
- Electronic dielectric powders (BNT / MgTiO₃-CaTiO₃ systems) — Ferro (Vibrantz) / TAM Ceramics (2022)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.