Aluminum Nitride AlN-200
Grade
also AlN
AlN-200 = high thermal conductivity grade, 190–230 W/m·K
High-purity, oxygen-lean grade with long sinter/anneal cycle — pick for high-power IGBT, laser diode and RF heat spreaders.
Values for the AlN-200 condition
Other Aluminum Nitride tempers and conditions
Aluminum Nitride is listed in 4 conditions; see the grade overview at Aluminum Nitride.
Compare all 4 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Economy grade, 120–150 W/m·K | Lower-cost grade with more sintering aid / grain-boundary oxide — use where insulation and moderate heat spreading suffice. | 180 | 0 | 1,050 HV | 140 W/m·K | |
SinteredDefault pressureless sintered AlN, ~170 W/m·K standard grade | Default commercial power-electronics substrate and heat-sink grade: best balance of thermal conductivity, strength and price. | 200 | 0 | 1,100 HV | 175 W/m·K | |
AlN-200This page High thermal conductivity grade, 190–230 W/m·K | High-purity, oxygen-lean grade with long sinter/anneal cycle — pick for high-power IGBT, laser diode and RF heat spreaders. | 1,150 HV | 205 W/m·K | |||
Hot-pressed AlN, fine grain, high strength | Hot-pressed billets for thick heat sinks, crucibles and molten-metal parts where maximum density and bend strength matter more than substrate flatness. | 1,200 HV | 170 W/m·K |
What is Aluminum Nitride AlN-200?
Aluminum Nitride AlN-200 is Aluminum Nitride in the AlN-200 grade — high-purity, oxygen-lean grade with long sinter/anneal cycle — pick for high-power IGBT, laser diode and RF heat spreaders. Aluminum Nitride AlN-200 has a tensile strength of 200 MPa (29 ksi), stronger than 60% of ceramic grades. Elongation at break is 0% and the elastic modulus is 325 GPa (47.1 Msi). Aluminum Nitride AlN-200 has a density of 3.28 g/cm³ (0.118 lb/in³), lighter than 69% of ceramic grades. It melts at 2,200°C (3,992 °F). Sintered is the default condition FabDigit quotes; AlN-200 is available on request or by drawing note.
Advantages
- Conducts heat well — 205 W/m·K (118.4 BTU/hr·ft·°F), better than 96% of ceramic grades
Aluminum Nitride AlN-200 properties
Typical room-temperature values for Aluminum Nitride AlN-200; 10 are specific to this condition. Other listed values are Aluminum Nitride reference data and may not represent this condition. Bars are the position among ceramic grades.
Physical4
Aluminum Nitride AlN-200 has a density of 3.28 g/cm³ (0.118 lb/in³), lighter than 69% of ceramic grades. It melts at 2,200°C (3,992 °F).
Mechanical13
Aluminum Nitride AlN-200 has a tensile strength of 200 MPa (29 ksi), stronger than 60% of ceramic grades. Elongation at break is 0% and the elastic modulus is 325 GPa (47.1 Msi).
Thermal5
Aluminum Nitride AlN-200 is rated for continuous service to 1,000°C (1,832 °F). It conducts heat at 205 W/m·K (118.4 BTU/hr·ft·°F), better than 96% of ceramic grades. Thermal expansion is 4.5 µm/m·K (2.5 µin/in·°F).
Electrical5
Aluminum Nitride AlN-200 is an electrical insulator with a dielectric strength of 17 kV/mm (431.8 V/mil) and a resistivity of 1×10¹² Ω·m.
Chemical & Environmental2
Corrosion resistance is very good (82/100), better than 61% of ceramic grades.
Sustainability3
Producing a kilogram of Aluminum Nitride AlN-200 takes about 250 MJ of energy and emits 20 kg of CO₂ — more than 67% of ceramic grades. Typical recycled content is 0%.
Manufacturability3
Aluminum Nitride AlN-200's machinability is not recommended (5/100, worse than 59% of ceramic grades).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with Aluminum Nitride AlN-200
Is Aluminum Nitride easy to machine?
Green/pre-sintered bodies can be milled or drilled; after sintering only diamond grinding, lapping, ultrasonic or laser cutting (CO2/UV) — expect 5–10× alumina tooling cost.
Can Aluminum Nitride be welded?
Not weldable; joined by active-metal-braze (Ti-containing AgCu) or DBC/DBA copper-aluminium direct bonding, or glass/solder sealing.
Can Aluminum Nitride be formed, bent or molded?
Shaped by tape casting (substrates), dry/isostatic pressing or injection moulding of AlN+Y2O3 powder, then de-bindered and sintered 1700–1900 °C in flowing N2 with ~15–20 % linear shrinkage.
What surface finishes work on Aluminum Nitride?
As-fired, lapped or polished (Ra <0.05 µm) surfaces; metallised by thick-film W/Mo-Mn co-fire, thin-film Ti/Pt/Au sputtering or DBC copper; store dry to avoid surface hydrolysis before metallisation.
Aluminum Nitride chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Y2O3sintering aid; CaO or CaF2 used in some grades | 1 – 5 | 3 |
| Olattice + grain-boundary oxygen; lower O = higher thermal conductivity | 0.5 – 2 | 1 |
| Cresidual from carbothermal reduction | ≤ 0.15 | 0.05 |
| AlNstoichiometric AlN = 65.8 % Al, 34.2 % N | ≥ 94 (balance) |
Aluminum Nitride AlN-200 — frequently asked
What is Aluminum Nitride AlN-200 used for?
Aluminum Nitride AlN-200 is typically used for power module substrates (DBC/AMB), heat spreaders for IGBT and MOSFET packages, LED packaging submounts, semiconductor wafer chucks and ceramic heaters, RF and microwave package bases and laser diode submounts. In short: thermally conductive insulator.
What is the tensile strength of Aluminum Nitride AlN-200?
Aluminum Nitride AlN-200 has a typical tensile strength of 200 MPa (29 ksi) — stronger than 60% of ceramic grades. Strength varies by condition: see the 4 listed tempers.
Is Aluminum Nitride AlN-200 easy to machine?
Not especially — machinability is rated not recommended (5/100, worse than 59% of ceramic grades). Green/pre-sintered bodies can be milled or drilled; after sintering only diamond grinding, lapping, ultrasonic or laser cutting (CO2/UV) — expect 5–10× alumina tooling cost.
Can Aluminum Nitride AlN-200 be welded?
Not weldable; joined by active-metal-braze (Ti-containing AgCu) or DBC/DBA copper-aluminium direct bonding, or glass/solder sealing.
What surface finishes work on Aluminum Nitride AlN-200?
As-fired, lapped or polished (Ra <0.05 µm) surfaces; metallised by thick-film W/Mo-Mn co-fire, thin-film Ti/Pt/Au sputtering or DBC copper; store dry to avoid surface hydrolysis before metallisation.
Can Aluminum Nitride AlN-200 be formed, bent or molded?
Shaped by tape casting (substrates), dry/isostatic pressing or injection moulding of AlN+Y2O3 powder, then de-bindered and sintered 1700–1900 °C in flowing N2 with ~15–20 % linear shrinkage.
What is the maximum service temperature of Aluminum Nitride AlN-200?
Aluminum Nitride AlN-200 is rated for continuous use to about 1,000°C (1,832 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- Engineered Materials Handbook, Vol. 4: Ceramics and Glasses — ASM International (1991)
- AlN Aluminum Nitride technical ceramic data — CoorsTek (2023)
- Fine Ceramics — Aluminum Nitride (AlN) substrate properties — Kyocera (2023)
- AlN substrate product specifications — Maruwa Co., Ltd. (2022)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.