Aluminum Nitride HP
Other
also AlN
HP = hot-pressed AlN, fine grain, high strength
Hot-pressed billets for thick heat sinks, crucibles and molten-metal parts where maximum density and bend strength matter more than substrate flatness.
Values for the HP condition
Other Aluminum Nitride tempers and conditions
Aluminum Nitride is listed in 4 conditions; see the grade overview at Aluminum Nitride.
Compare all 4 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Economy grade, 120–150 W/m·K | Lower-cost grade with more sintering aid / grain-boundary oxide — use where insulation and moderate heat spreading suffice. | 180 | 0 | 1,050 HV | 140 W/m·K | |
SinteredDefault pressureless sintered AlN, ~170 W/m·K standard grade | Default commercial power-electronics substrate and heat-sink grade: best balance of thermal conductivity, strength and price. | 200 | 0 | 1,100 HV | 175 W/m·K | |
High thermal conductivity grade, 190–230 W/m·K | High-purity, oxygen-lean grade with long sinter/anneal cycle — pick for high-power IGBT, laser diode and RF heat spreaders. | 1,150 HV | 205 W/m·K | |||
HPThis page Hot-pressed AlN, fine grain, high strength | Hot-pressed billets for thick heat sinks, crucibles and molten-metal parts where maximum density and bend strength matter more than substrate flatness. | 1,200 HV | 170 W/m·K |
What is Aluminum Nitride HP?
Aluminum Nitride HP is Aluminum Nitride in the HP condition — hot-pressed billets for thick heat sinks, crucibles and molten-metal parts where maximum density and bend strength matter more than substrate flatness. Aluminum Nitride HP has a tensile strength of 200 MPa (29 ksi), stronger than 60% of ceramic grades. Elongation at break is 0% and the elastic modulus is 330 GPa (47.9 Msi). Aluminum Nitride HP has a density of 3.31 g/cm³ (0.12 lb/in³), lighter than 68% of ceramic grades. It melts at 2,200°C (3,992 °F). Sintered is the default condition FabDigit quotes; HP is available on request or by drawing note.
Advantages
- Conducts heat well — 170 W/m·K (98.2 BTU/hr·ft·°F), better than 94% of ceramic grades
Aluminum Nitride HP properties
Typical room-temperature values for Aluminum Nitride HP; 11 are specific to this condition. Other listed values are Aluminum Nitride reference data and may not represent this condition. Bars are the position among ceramic grades.
Physical4
Aluminum Nitride HP has a density of 3.31 g/cm³ (0.12 lb/in³), lighter than 68% of ceramic grades. It melts at 2,200°C (3,992 °F).
Mechanical13
Aluminum Nitride HP has a tensile strength of 200 MPa (29 ksi), stronger than 60% of ceramic grades. Elongation at break is 0% and the elastic modulus is 330 GPa (47.9 Msi).
Thermal5
Aluminum Nitride HP is rated for continuous service to 1,000°C (1,832 °F). It conducts heat at 170 W/m·K (98.2 BTU/hr·ft·°F), better than 94% of ceramic grades. Thermal expansion is 4.5 µm/m·K (2.5 µin/in·°F).
Electrical5
Aluminum Nitride HP is an electrical insulator with a dielectric strength of 17 kV/mm (431.8 V/mil) and a resistivity of 1×10¹² Ω·m.
Chemical & Environmental2
Corrosion resistance is very good (82/100), better than 61% of ceramic grades.
Sustainability3
Producing a kilogram of Aluminum Nitride HP takes about 250 MJ of energy and emits 20 kg of CO₂ — more than 67% of ceramic grades. Typical recycled content is 0%.
Manufacturability3
Aluminum Nitride HP's machinability is not recommended (4/100, worse than 85% of ceramic grades).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with Aluminum Nitride HP
Is Aluminum Nitride easy to machine?
Green/pre-sintered bodies can be milled or drilled; after sintering only diamond grinding, lapping, ultrasonic or laser cutting (CO2/UV) — expect 5–10× alumina tooling cost.
Can Aluminum Nitride be welded?
Not weldable; joined by active-metal-braze (Ti-containing AgCu) or DBC/DBA copper-aluminium direct bonding, or glass/solder sealing.
Can Aluminum Nitride be formed, bent or molded?
Shaped by tape casting (substrates), dry/isostatic pressing or injection moulding of AlN+Y2O3 powder, then de-bindered and sintered 1700–1900 °C in flowing N2 with ~15–20 % linear shrinkage.
What surface finishes work on Aluminum Nitride?
As-fired, lapped or polished (Ra <0.05 µm) surfaces; metallised by thick-film W/Mo-Mn co-fire, thin-film Ti/Pt/Au sputtering or DBC copper; store dry to avoid surface hydrolysis before metallisation.
Aluminum Nitride chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Y2O3sintering aid; CaO or CaF2 used in some grades | 1 – 5 | 3 |
| Olattice + grain-boundary oxygen; lower O = higher thermal conductivity | 0.5 – 2 | 1 |
| Cresidual from carbothermal reduction | ≤ 0.15 | 0.05 |
| AlNstoichiometric AlN = 65.8 % Al, 34.2 % N | ≥ 94 (balance) |
Aluminum Nitride HP — frequently asked
What is Aluminum Nitride HP used for?
Aluminum Nitride HP is typically used for power module substrates (DBC/AMB), heat spreaders for IGBT and MOSFET packages, LED packaging submounts, semiconductor wafer chucks and ceramic heaters, RF and microwave package bases and laser diode submounts. In short: thermally conductive insulator.
What is the tensile strength of Aluminum Nitride HP?
Aluminum Nitride HP has a typical tensile strength of 200 MPa (29 ksi) — stronger than 60% of ceramic grades. Strength varies by condition: see the 4 listed tempers.
Is Aluminum Nitride HP easy to machine?
Not especially — machinability is rated not recommended (4/100, worse than 85% of ceramic grades). Green/pre-sintered bodies can be milled or drilled; after sintering only diamond grinding, lapping, ultrasonic or laser cutting (CO2/UV) — expect 5–10× alumina tooling cost.
Can Aluminum Nitride HP be welded?
Not weldable; joined by active-metal-braze (Ti-containing AgCu) or DBC/DBA copper-aluminium direct bonding, or glass/solder sealing.
What surface finishes work on Aluminum Nitride HP?
As-fired, lapped or polished (Ra <0.05 µm) surfaces; metallised by thick-film W/Mo-Mn co-fire, thin-film Ti/Pt/Au sputtering or DBC copper; store dry to avoid surface hydrolysis before metallisation.
Can Aluminum Nitride HP be formed, bent or molded?
Shaped by tape casting (substrates), dry/isostatic pressing or injection moulding of AlN+Y2O3 powder, then de-bindered and sintered 1700–1900 °C in flowing N2 with ~15–20 % linear shrinkage.
What is the maximum service temperature of Aluminum Nitride HP?
Aluminum Nitride HP is rated for continuous use to about 1,000°C (1,832 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- Engineered Materials Handbook, Vol. 4: Ceramics and Glasses — ASM International (1991)
- AlN Aluminum Nitride technical ceramic data — CoorsTek (2023)
- Fine Ceramics — Aluminum Nitride (AlN) substrate properties — Kyocera (2023)
- AlN substrate product specifications — Maruwa Co., Ltd. (2022)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.