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PF LAM-G

Grade

ASTM D700 · GB GB/T 34483

LAM-G = glass-fabric phenolic laminate

Highest-strength phenolic sheet for hot, humid structural-insulation duty where epoxy G-10 cost is not justified.

Standard cost $$

Values for the LAM-G condition

Other PF grades and fills

PF is listed in 10 conditions; see the grade overview at PF.

Compare all 10 grades and fillsHide
Grade · open for datasheetBest forYield MPaTensile MPaElong. %Hardness
Friction/brake compound
Binder-based friction formulation for brake pads, linings and clutch facings — designed for stable µ at 300–400 °C flash temperatures.—180.3110 HRR
Graphite / PTFE / MoS₂ lubricated bearing grade
Choose for dry-running bushings, thrust washers and water-lubricated marine bearings.—400.5105 HRM
Mineral filled heat-resistant grade
Use for continuous 170–180 °C electrical service and better arc/heat resistance than wood-flour grades.—420.4115 HRM
WFDefault
Wood-flour / cellulose filled general purpose
The default low-cost black/brown molding compound for knobs, handles, switch bodies and closures.—520.6108 HRM
As cast
Choose when a translucent/coloured, void-free polishable phenolic is needed (billiard balls, decorative rod, dominoes).—551.2100 HRM
Cotton/rag (cellulose fabric) filled impact grade
Pick where phenolic must survive assembly shock or threaded/insert loading — 3–5× the notched impact of GP.—551100 HRM
Glass-fiber filled (25–55 %) structural/electrical grade
Highest strength, stiffness and HDT phenolic — commutators, pump housings, ignition and under-hood parts.—850.7118 HRM
Paper-base phenolic laminate
Cheapest insulating sheet/rod stock; punchable at room or warm temperature for low-cost electrical panels and single-sided PCB base.—85——
Cotton-fabric phenolic laminate
Tough, machinable laminate for gears, bushings, wear strips and structural insulators where paper base is too brittle.—95——
LAM-GThis page
Glass-fabric phenolic laminate
Highest-strength phenolic sheet for hot, humid structural-insulation duty where epoxy G-10 cost is not justified.—220——

What is PF LAM-G?

PF LAM-G is PF in the LAM-G grade — highest-strength phenolic sheet for hot, humid structural-insulation duty where epoxy G-10 cost is not justified. PF LAM-G has a tensile strength of 220 MPa (31.9 ksi), stronger than 100% of polymer grades. Elongation at break is 0.6% and the elastic modulus is 7 GPa (1.02 Msi). PF LAM-G has a density of 1.8 g/cm³ (0.065 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 160°C (320 °F). WF is the default condition FabDigit quotes; LAM-G is available on request or by drawing note.

Advantages

  • Stiff — 7 GPa (1.02 Msi), better than 90% of polymer grades
  • Conducts heat well — 0.3 W/m·K (0.173 BTU/hr·ft·°F), better than 83% of polymer grades
  • High service temperature — 155°C (311 °F), better than 81% of polymer grades

Limitations

  • Limited ductility — 0.6%, worse than 99% of polymer grades
  • Difficult to weld — 0/100, worse than 98% of polymer grades
  • Heavy — 1.8 g/cm³ (0.065 lb/in³), worse than 95% of polymer grades
  • Limited formability — 5/100, worse than 95% of polymer grades
  • Low fracture toughness — 1 MPa·√m (0.91 ksi·√in), worse than 87% of polymer grades

PF LAM-G properties

Typical room-temperature values for PF LAM-G; 11 are specific to this condition. Other listed values are PF reference data and may not represent this condition. Bars are the position among polymer grades.

Physical4

PF LAM-G has a density of 1.8 g/cm³ (0.065 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 160°C (320 °F).

Density1.8 g/cm³0.07 lb/in³
Glass Transition (Tg)160°C320 °F
Water Absorption (24 h)0.6%
Water Absorption (Saturation)1.4%

Mechanical14

PF LAM-G has a tensile strength of 220 MPa (31.9 ksi), stronger than 100% of polymer grades. Elongation at break is 0.6% and the elastic modulus is 7 GPa (1.02 Msi).

Elastic (Young's) Modulus7 GPa1 Msi
Shear Modulus2.6 GPa0.38 Msi
Bulk Modulus6 GPa0.87 Msi
Poisson's Ratio0.33
Tensile Strength (Ultimate)220 MPa31.9 ksi
Elongation at Break0.6%
Compressive Strength350 MPa50.8 ksi
Compressive Modulus6.5 GPa0.94 Msi
Flexural Strength270 MPa39.2 ksi
Flexural Modulus20 GPa2.9 Msi
Shear Strength55 MPa8 ksi
Fracture Toughness (K_IC)1 MPa·√m0.91 ksi·√in
Izod Impact, Notched400 J/m7.5 ft·lbf/in
Hardness, Rockwell M108 HRM

Thermal10

PF LAM-G is rated for continuous service to 155°C (311 °F). It conducts heat at 0.3 W/m·K (0.173 BTU/hr·ft·°F), better than 83% of polymer grades. Thermal expansion is 15 µm/m·K (8.33 µin/in·°F).

Thermal Conductivity0.3 W/m·K0.17 BTU/hr·ft·°F
Specific Heat Capacity1,500 J/kg·K0.36 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)15 µm/m·K8.3 µin/in·°F
Max Service Temperature (continuous)155°C311 °F
Min Service Temperature-50°C-58 °F
Heat Deflection Temp. @ 0.45 MPa185°C365 °F
Heat Deflection Temp. @ 1.8 MPa165°C329 °F
Flammability (UL 94)V-0 typical at ≥1.5 mm
Limiting Oxygen Index32%
Max Service Temperature (short-term)190°C374 °F

Electrical7

PF LAM-G is an electrical insulator with a dielectric strength of 12 kV/mm (304.8 V/mil) and a resistivity of 1×10¹⁰ Ω·m.

Electrical Resistivity1×10¹⁰ Ω·m3.94×10¹⁷ µΩ·in
Dielectric Strength12 kV/mm305 V/mil
Dielectric Constant (1 MHz)5.5
Dissipation Factor (1 MHz)0.04
Volume Resistivity1×10¹² Ω·cm
Surface Resistivity1×10¹² Ω
Comparative Tracking Index (CTI)150 V

Chemical & Environmental3

Corrosion resistance is good (68/100), worse than 85% of polymer grades. UV resistance is poor.

Corrosion ResistanceGood68/100
UV / Weathering ResistancePoor30/100
Chemical Resistance SummaryGood against water, weak acids, oils, fuels, alcohols and most solvents; attacked by strong alkalis, hot concentrated acids and oxidizers; surface chalks and darkens on prolonged UV exposure.

Sustainability4

Producing a kilogram of PF LAM-G takes about 87 MJ of energy and emits 4 kg of CO₂ — less than 77% of polymer grades. Typical recycled content is 0%.

Embodied Energy (primary production)87 MJ/kg37,403 BTU/lb
Embodied Carbon (primary production)4 kg CO₂/kg
Embodied Water220 L/kg26.4 gal/lb
Typical Recycled Content0%

Manufacturability7

PF LAM-G's machinability is fair (35/100, worse than 84% of polymer grades); weldability not recommended (0/100); formability not recommended (5/100).

MachinabilityFair35/100
WeldabilityNot recommended0/100
Formability (cold)Not recommended5/100
PolishabilityGood60/100
Mold Shrinkage0.6%
Processing Melt Temperature (typ.)85°C185 °F
Mold Temperature (typ.)175°C347 °F

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with PF LAM-G

Is PF easy to machine?

Machines easily but is abrasive and dusty — use carbide or PCD tools, positive rake, sharp edges, high speed with light feed and vacuum dust extraction; no coolant needed on laminates.

Can PF be welded?

Not weldable (thermoset); join by fasteners, molded-in inserts, or structural adhesives (epoxy) after abrading and degreasing.

Can PF be formed, bent or molded?

Compression and transfer molding at 150–190 °C mold with 15–35 MPa and 15–30 s/mm cure; preheat (RF or IR) to 90–110 °C to shorten cure; vent to release condensation water and ammonia.

What surface finishes work on PF?

Molded parts release with a glossy skin; deflash by tumbling or media blast, then buff/wax-polish for cast grades; paint or plate only after alkaline etch and a primer — plating adhesion is fair at best.

PF chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
phenol-formaldehyde resin (novolac/resolmatrix binder35 – 5545
wood flour / cellulose fillerdefault GP filler; replaced by mineral, cotton or glass in other variants35 – 5545
hexamethylenetetramine (hexa) curing ageon resin basis for novolac systems5 – 128
lime / magnesium oxideacid scavenger, cure accelerator0.5 – 31.5
stearate lubricant / mold release0.5 – 21
carbon black / pigmentphenolics are only available in dark colors0.5 – 31.5

PF LAM-G — frequently asked

What is PF LAM-G used for?

PF LAM-G is typically used for electrical switchgear, brake pads/friction parts, cookware handles and bakelite housings. In short: lowest-cost high-heat thermoset; 150 °C continuous service; machinable laminate stock.

What is the tensile strength of PF LAM-G?

PF LAM-G has a typical tensile strength of 220 MPa (31.9 ksi) — stronger than 100% of polymer grades. Strength varies by condition: see the 10 listed tempers.

Is PF LAM-G easy to machine?

Not especially — machinability is rated fair (35/100, worse than 84% of polymer grades). Machines easily but is abrasive and dusty — use carbide or PCD tools, positive rake, sharp edges, high speed with light feed and vacuum dust extraction; no coolant needed on laminates.

Can PF LAM-G be welded?

Not readily — weldability is rated not recommended (0/100). Not weldable (thermoset); join by fasteners, molded-in inserts, or structural adhesives (epoxy) after abrading and degreasing.

What surface finishes work on PF LAM-G?

Molded parts release with a glossy skin; deflash by tumbling or media blast, then buff/wax-polish for cast grades; paint or plate only after alkaline etch and a primer — plating adhesion is fair at best.

Can PF LAM-G be formed, bent or molded?

Compression and transfer molding at 150–190 °C mold with 15–35 MPa and 15–30 s/mm cure; preheat (RF or IR) to 90–110 °C to shorten cure; vent to release condensation water and ammonia.

What is the maximum service temperature of PF LAM-G?

PF LAM-G is rated for continuous use to about 155°C (311 °F), and briefly to 190°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Sources

  1. ASTM D700 — Standard Specification for Phenolic Molding Compounds — ASTM International (2021)
  2. ISO 14526 Plastics — Phenolic powder moulding compounds (PF-PMCs) — ISO (2020)
  3. Engineered Materials Handbook Vol.2: Engineering Plastics — Phenolics — ASM International (1988)
  4. NEMA LI 1 — Industrial Laminated Thermosetting Products (grades X, XX, XPC, C, CE, L, LE, G-3) — NEMA (1998)
  5. Phenolic molding compound and laminate technical datasheets — Hexion / Sumitomo Bakelite / Ensinger (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.