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Copper Alloy C50200-OS025

Temper

UNS C50200 · ASTM B103

OS025 = annealed to 0.025 mm grain size

Grain-size-controlled anneal for strip that must draw cleanly without orange peel.

High cost $$$$

Values for the OS025 condition

Other C50200 tempers and conditions

C50200 is listed in 9 conditions; see the grade overview at C50200.

Compare all 9 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Soft annealed
Maximum ductility for deep drawing, severe bending and spinning; lowest strength.952754525 HRB56 % IACS
OS025This page
Annealed to 0.025 mm grain size
Grain-size-controlled anneal for strip that must draw cleanly without orange peel.1052904262 HB56 % IACS
Quarter hard
Light cold work when moderate bending is still required after forming.2503252595 HB55 % IACS
H02Default
Half hard
Default stocked strip temper: good balance of formability, strength and spring behaviour for terminals and clips.32037012112 HB55 % IACS
Full hard
Higher strength for flat springs and contacts with only gentle bends (large radii, bend across grain).3904206130 HB54 % IACS
Hard drawn
Cold-drawn rod/wire condition for cotter pins, wire forms and fasteners.4004508140 HB54 % IACS
Extra hard
Use where higher elastic limit is needed and forming is limited to simple flat blanking.4254554145 HB54 % IACS
Spring hard
Spring temper strip for contact fingers and washers; stress-relieve after forming to hold shape.4604903158 HB53 % IACS
Extra spring hard
Maximum cold-rolled strength for flat springs with essentially no forming other than blanking.4905152168 HB53 % IACS

What is C50200-OS025?

C50200-OS025 is C50200 in the OS025 temper — grain-size-controlled anneal for strip that must draw cleanly without orange peel. C50200-OS025 has a yield strength of 105 MPa (15.2 ksi) and a tensile strength of 290 MPa (42.1 ksi) — weaker than 85% of copper alloy grades. Elongation at break is 42% and the elastic modulus is 115 GPa (16.7 Msi). C50200-OS025 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,060°C (1,940 °F). H02 is the default condition FabDigit quotes; OS025 is available on request or by drawing note.

Advantages

  • Forms and bends easily — 92/100, better than 91% of copper alloy grades
  • Ductile — tolerates forming and impact — 42%, better than 86% of copper alloy grades
  • High electrical conductivity — 56 % IACS, better than 81% of copper alloy grades
  • Conducts heat well — 218 W/m·K (126 BTU/hr·ft·°F), better than 80% of copper alloy grades

Limitations

  • Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades
  • Difficult to machine — 25/100, worse than 86% of copper alloy grades
  • Low strength — 105 MPa (15.2 ksi), worse than 85% of copper alloy grades

C50200-OS025 properties

Typical room-temperature values for C50200-OS025; 19 are specific to this condition. Other listed values are C50200 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C50200-OS025 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,060°C (1,940 °F).

Density8.89 g/cm³0.32 lb/in³
Melting Point (Solidus)1,060°C1,940 °F
Liquidus Temperature1,080°C1,976 °F

Mechanical15

C50200-OS025 has a yield strength of 105 MPa (15.2 ksi) and a tensile strength of 290 MPa (42.1 ksi) — weaker than 85% of copper alloy grades. Elongation at break is 42% and the elastic modulus is 115 GPa (16.7 Msi).

Elastic (Young's) Modulus115 GPa16.7 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus125 GPa18.1 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)290 MPa42.1 ksi
Yield Strength (0.2% offset)105 MPa15.2 ksi
Elongation at Break42%
Reduction in Area55%
Compressive Strength325 MPa47.1 ksi
Shear Strength195 MPa28.3 ksi
Fatigue Strength (Endurance Limit)105 MPa15.2 ksi
Charpy V-Notch Impact (RT)40 J29.5 ft·lbf
Hardness, Brinell62 HB
Hardness, Rockwell B25 HRB
Hardness, Vickers68 HV

Thermal6

C50200-OS025 is rated for continuous service to 150°C (302 °F). It conducts heat at 218 W/m·K (126 BTU/hr·ft·°F), better than 80% of copper alloy grades. Thermal expansion is 17.8 µm/m·K (9.89 µin/in·°F).

Thermal Conductivity218 W/m·K126 BTU/hr·ft·°F
Specific Heat Capacity377 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.8 µm/m·K9.9 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)150°C302 °F
Min Service Temperature-196°C-321 °F

Electrical3

C50200-OS025 conducts electricity at 56 % IACS, better than 81% of copper alloy grades.

Electrical Conductivity56 % IACS
Electrical Resistivity3.08×10⁻⁸ Ω·m1.21 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (65/100), better than 58% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.3 V
Corrosion ResistanceGood65/100
Chemical Resistance SummaryGood resistance to atmosphere, fresh and salt water, non-oxidizing acids and most organics; attacked by ammonia/amines (stress-corrosion risk in cold-worked tempers), nitric acid, oxidizing acids and sulphides.

Sustainability4

Producing a kilogram of C50200-OS025 takes about 57 MJ of energy and emits 3.9 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 40%.

Embodied Energy (primary production)57 MJ/kg24,506 BTU/lb
Embodied Carbon (primary production)3.9 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content40%

Manufacturability7

C50200-OS025's machinability is poor (25/100, worse than 86% of copper alloy grades); weldability good (55/100); formability excellent (92/100).

MachinabilityPoor25/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityGood55/100
Formability (cold)Excellent92/100
Brazeability / SolderabilityExcellent90/100
PolishabilityVery good75/100
Anodizing Responsen/a — copper alloy; use tin, silver or nickel plating instead of anodizing

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C50200-OS025

Is C50200 easy to machine?

Machinability ~20% of free-cutting brass; gummy chips — use sharp positive-rake tools, high speed, light feeds and good lubrication.

Can C50200 be welded?

Excellent soldering and brazing; resistance and GTAW welding are fair — avoid overheating and use phosphor-bronze filler; oxyacetylene welding not recommended.

Can C50200 be formed, bent or molded?

Outstanding cold formability in O60/OS tempers (deep draw, severe bend); interanneal 480–650 °C for heavy reductions and stress-relieve formed springs at 180–200 °C.

What surface finishes work on C50200?

Takes tin, silver, nickel and gold plating readily; polishes well; no anodizing — protect against ammonia-bearing environments to avoid SCC in cold-worked tempers.

C50200 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Sn1 – 1.51.25
Pdeoxidiser residual, kept low for conductivity≤ 0.040.03
Feimpurity limit≤ 0.1—
Znimpurity limit≤ 0.3—
Pbimpurity limit≤ 0.05—
CuCu + named elements ≥ 99.5 %; Ag counted as Cu≥ 98 (balance)—

C50200-OS025 — frequently asked

What is C50200-OS025 used for?

C50200-OS025 is typically used for electrical contacts, switch blades, fasteners and cotter pins. In short: most formable phosphor bronze; low-cost spring bronze; good contact-plating base.

What is the yield strength of C50200-OS025?

C50200-OS025 has a typical yield strength of 105 MPa (15.2 ksi) and a tensile strength of 290 MPa (42.1 ksi) — weaker than 85% of copper alloy grades. Strength varies by condition: see the 9 listed tempers.

Is C50200-OS025 easy to machine?

Not especially — machinability is rated poor (25/100, worse than 86% of copper alloy grades). Machinability ~20% of free-cutting brass; gummy chips — use sharp positive-rake tools, high speed, light feeds and good lubrication.

Can C50200-OS025 be welded?

Yes — weldability is rated good (55/100). Excellent soldering and brazing; resistance and GTAW welding are fair — avoid overheating and use phosphor-bronze filler; oxyacetylene welding not recommended.

What surface finishes work on C50200-OS025?

Takes tin, silver, nickel and gold plating readily; polishes well; no anodizing — protect against ammonia-bearing environments to avoid SCC in cold-worked tempers.

Can C50200-OS025 be formed, bent or molded?

Outstanding cold formability in O60/OS tempers (deep draw, severe bend); interanneal 480–650 °C for heavy reductions and stress-relieve formed springs at 180–200 °C.

What is the maximum service temperature of C50200-OS025?

C50200-OS025 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C50200-H02 and C50200-O60?

H02 is the default condition — default stocked strip temper: good balance of formability, strength and spring behaviour for terminals and clips. O60: maximum ductility for deep drawing, severe bending and spinning; lowest strength. Yield strength is 320 MPa in H02 versus 95 MPa in O60.

Sources

  1. ASTM B103/B103M — Phosphor Bronze Plate, Sheet, Strip and Rolled Bar — ASTM International (2019)
  2. CDA Copper Alloy Datasheet C50200 — Copper Development Association (2023)
  3. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.