Copper Alloy C50200-H04
Supply condition
UNS C50200 · ASTM B103
H04 = full hard
Higher strength for flat springs and contacts with only gentle bends (large radii, bend across grain).
Values for the H04 condition
Other C50200 tempers and conditions
C50200 is listed in 9 conditions; see the grade overview at C50200.
Compare all 9 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Soft annealed | Maximum ductility for deep drawing, severe bending and spinning; lowest strength. | 95 | 275 | 45 | 25 HRB | 56 % IACS |
Annealed to 0.025 mm grain size | Grain-size-controlled anneal for strip that must draw cleanly without orange peel. | 105 | 290 | 42 | 62 HB | 56 % IACS |
Quarter hard | Light cold work when moderate bending is still required after forming. | 250 | 325 | 25 | 95 HB | 55 % IACS |
H02Default Half hard | Default stocked strip temper: good balance of formability, strength and spring behaviour for terminals and clips. | 320 | 370 | 12 | 112 HB | 55 % IACS |
H04This page Full hard | Higher strength for flat springs and contacts with only gentle bends (large radii, bend across grain). | 390 | 420 | 6 | 130 HB | 54 % IACS |
Hard drawn | Cold-drawn rod/wire condition for cotter pins, wire forms and fasteners. | 400 | 450 | 8 | 140 HB | 54 % IACS |
Extra hard | Use where higher elastic limit is needed and forming is limited to simple flat blanking. | 425 | 455 | 4 | 145 HB | 54 % IACS |
Spring hard | Spring temper strip for contact fingers and washers; stress-relieve after forming to hold shape. | 460 | 490 | 3 | 158 HB | 53 % IACS |
Extra spring hard | Maximum cold-rolled strength for flat springs with essentially no forming other than blanking. | 490 | 515 | 2 | 168 HB | 53 % IACS |
What is C50200-H04?
C50200-H04 is C50200 supplied in the H04 condition — higher strength for flat springs and contacts with only gentle bends (large radii, bend across grain). C50200-H04 has a yield strength of 390 MPa (56.6 ksi) and a tensile strength of 420 MPa (60.9 ksi) — stronger than 78% of copper alloy grades. Elongation at break is 6% and the elastic modulus is 116 GPa (16.8 Msi). C50200-H04 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,060°C (1,940 °F). H02 is the default condition FabDigit quotes; H04 is available on request or by drawing note.
Advantages
- Conducts heat well — 212 W/m·K (122.5 BTU/hr·ft·°F), better than 80% of copper alloy grades
- High electrical conductivity — 54 % IACS, better than 80% of copper alloy grades
- High strength — 390 MPa (56.6 ksi), better than 78% of copper alloy grades
Limitations
- Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades
- Limited ductility — 6%, worse than 89% of copper alloy grades
C50200-H04 properties
Typical room-temperature values for C50200-H04; 21 are specific to this condition. Other listed values are C50200 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C50200-H04 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,060°C (1,940 °F).
Mechanical15
C50200-H04 has a yield strength of 390 MPa (56.6 ksi) and a tensile strength of 420 MPa (60.9 ksi) — stronger than 78% of copper alloy grades. Elongation at break is 6% and the elastic modulus is 116 GPa (16.8 Msi).
Thermal6
C50200-H04 is rated for continuous service to 150°C (302 °F). It conducts heat at 212 W/m·K (122.5 BTU/hr·ft·°F), better than 80% of copper alloy grades. Thermal expansion is 17.8 µm/m·K (9.89 µin/in·°F).
Electrical3
C50200-H04 conducts electricity at 54 % IACS, better than 80% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (65/100), better than 58% of copper alloy grades.
Sustainability4
Producing a kilogram of C50200-H04 takes about 57 MJ of energy and emits 3.9 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 40%.
Manufacturability7
C50200-H04's machinability is poor (33/100, worse than 53% of copper alloy grades); weldability fair (50/100); formability fair (42/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C50200-H04
Is C50200 easy to machine?
Machinability ~20% of free-cutting brass; gummy chips — use sharp positive-rake tools, high speed, light feeds and good lubrication.
Can C50200 be welded?
Excellent soldering and brazing; resistance and GTAW welding are fair — avoid overheating and use phosphor-bronze filler; oxyacetylene welding not recommended.
Can C50200 be formed, bent or molded?
Outstanding cold formability in O60/OS tempers (deep draw, severe bend); interanneal 480–650 °C for heavy reductions and stress-relieve formed springs at 180–200 °C.
What surface finishes work on C50200?
Takes tin, silver, nickel and gold plating readily; polishes well; no anodizing — protect against ammonia-bearing environments to avoid SCC in cold-worked tempers.
C50200 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Sn | 1 – 1.5 | 1.25 |
| Pdeoxidiser residual, kept low for conductivity | ≤ 0.04 | 0.03 |
| Feimpurity limit | ≤ 0.1 | — |
| Znimpurity limit | ≤ 0.3 | — |
| Pbimpurity limit | ≤ 0.05 | — |
| CuCu + named elements ≥ 99.5 %; Ag counted as Cu | ≥ 98 (balance) | — |
C50200-H04 — frequently asked
What is C50200-H04 used for?
C50200-H04 is typically used for electrical contacts, switch blades, fasteners and cotter pins. In short: most formable phosphor bronze; low-cost spring bronze; good contact-plating base.
What is the yield strength of C50200-H04?
C50200-H04 has a typical yield strength of 390 MPa (56.6 ksi) and a tensile strength of 420 MPa (60.9 ksi) — stronger than 78% of copper alloy grades. Strength varies by condition: see the 9 listed tempers.
Is C50200-H04 easy to machine?
Not especially — machinability is rated poor (33/100, worse than 53% of copper alloy grades). Machinability ~20% of free-cutting brass; gummy chips — use sharp positive-rake tools, high speed, light feeds and good lubrication.
Can C50200-H04 be welded?
With care — weldability is rated fair (50/100). Excellent soldering and brazing; resistance and GTAW welding are fair — avoid overheating and use phosphor-bronze filler; oxyacetylene welding not recommended.
What surface finishes work on C50200-H04?
Takes tin, silver, nickel and gold plating readily; polishes well; no anodizing — protect against ammonia-bearing environments to avoid SCC in cold-worked tempers.
Can C50200-H04 be formed, bent or molded?
Outstanding cold formability in O60/OS tempers (deep draw, severe bend); interanneal 480–650 °C for heavy reductions and stress-relieve formed springs at 180–200 °C.
What is the maximum service temperature of C50200-H04?
C50200-H04 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C50200-H02 and C50200-O60?
H02 is the default condition — default stocked strip temper: good balance of formability, strength and spring behaviour for terminals and clips. O60: maximum ductility for deep drawing, severe bending and spinning; lowest strength. Yield strength is 320 MPa in H02 versus 95 MPa in O60.
Sources
- ASTM B103/B103M — Phosphor Bronze Plate, Sheet, Strip and Rolled Bar — ASTM International (2019)
- CDA Copper Alloy Datasheet C50200 — Copper Development Association (2023)
- ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.