Cr3C2 vs HPSiC
Ceramic · grade comparison
Cr3C2 and HPSiC are both ceramic grades. HPSiC is the stronger of the two: tensile strength 350 MPa (50.8 ksi) against 200 MPa (29 ksi) for Cr3C2, about 75% more. HPSiC is harder — 2,600 HV against 1,400 HV for Cr3C2 — which matters for wear surfaces and threads. HPSiC is lighter (3.2 g/cm³ vs 6.68 g/cm³ for Cr3C2) and HPSiC is stiffer (450 GPa vs 373 GPa).
HPSiCChoose it when strength drives the design, or when surface hardness matters.
Cr3C2 vs HPSiC: propertiesHow to read these bars
- One bar per material. A full bar is the highest value among all ceramic grades in the FabDigit library; each bar is drawn as a share of that.
- The better value (by the usual engineering direction) is in bold. Rows with no direction — density, thermal conductivity — have no bold.
- Values are typical room-temperature figures for the condition named on each card.
- Confirm against the certified mill or resin datasheet before design release.
How to read these bars
- One bar per material. A full bar is the highest value among all ceramic grades in the FabDigit library; each bar is drawn as a share of that.
- The better value (by the usual engineering direction) is in bold. Rows with no direction — density, thermal conductivity — have no bold.
- Values are typical room-temperature figures for the condition named on each card.
- Confirm against the certified mill or resin datasheet before design release.
Mechanical
Strength, stiffness, ductility and hardness at room temperature.
Elastic (Young's) Modulus
Shear Modulus
Bulk Modulus
Poisson's Ratio
Tensile Strength (Ultimate)
Elongation at Break
Compressive Strength
Flexural Strength
Shear Strength
Hardness, Vickers
Hardness, Knoop
Hardness, Mohs
Same in both: Fracture Toughness (K_IC) 4 MPa·√m3.6 ksi·√in
Physical
Density and transition temperatures.
Density
Melting Point (Solidus)
Porosity
Thermal
How each material carries heat and how hot it can run.
Thermal Conductivity
Specific Heat Capacity
Thermal Expansion (CTE, 20–100 °C)
Max Service Temperature (continuous)
Same in both: Min Service Temperature -200°C-328 °F
Electrical
Conductivity and insulation.
Electrical Resistivity
Volume Resistivity
Chemical & Environmental
Corrosion and environmental resistance (0–100 scores).
Corrosion Resistance
Manufacturability
FabDigit workshop ratings (0–100 scores) — how each material behaves on the machine.
Machinability
Polishability
Sintering / Firing Temperature
Sustainability
Primary-production footprint per kilogram.
Embodied Energy (primary production)
Embodied Carbon (primary production)
Typical Recycled Content
Embodied Water
Common Calculations
Ratios derived from the values above.
Specific Strength (UTS / density)
Specific Stiffness (E / density)
Thermal Diffusivity
Thermal Shock Resistance Index
Strength versus weight
Yield strength against density for every ceramic grade in the FabDigit library; the compared grades are highlighted. Up and left is stronger for its weight.
Manufacturing and finishing
| Capability | Cr3C2 | HPSiC |
|---|---|---|
| Default condition | — | — |
| Relative cost | $$$$ High | $$$$ High |
| Min. machined wall | — | — |
| Best machined surface | — | — |
Cr3C2 vs HPSiC — frequently asked
Is HPSiC stronger than Cr3C2?
Yes. HPSiC has a typical tensile strength of 350 MPa (50.8 ksi) against 200 MPa (29 ksi) for Cr3C2 — about 75% more.
Which is cheaper, Cr3C2 or HPSiC?
Both sit in the same relative cost tier ($$$$, high); the part price will be decided by machining time, tolerance and quantity rather than by the material.
When should I choose Cr3C2 over HPSiC?
Pick HPSiC when strength drives the design, or when surface hardness matters.
Ready to make it?
Upload a CAD file and FabDigit prices the part in Cr3C2 and HPSiC side by side — material, machining time, tolerance and finish in one quote. Certified material data ships with the order on request.
Typical handbook values for the conditions named above, normalised for comparison. Hardness on non-Brinell scales is converted approximately for charting only. Request certified data with your order for design-critical properties.