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Tungsten Alloy W70Cu30 HIP-VD

Grade

also CuW70

HIP-VD = hIP/vacuum-degassed high-density electronic grade

Choose for microwave packages, vacuum interrupters and hermetic heat sinks where closed porosity, outgassing and plating quality matter.

High cost $$$$

Values for the HIP-VD condition

Other W70Cu30 tempers and conditions

W70Cu30 is listed in 3 conditions; see the grade overview at W70Cu30.

Compare all 3 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Mixed-powder press & liquid-phase sintered
Lower-cost route for simple contact shapes; slightly lower density and conductivity because of residual closed porosity.4005503175 HB38 % IACS
INFDefault
Copper-infiltrated
Standard commercial condition for EDM electrodes, switchgear contacts and heat spreaders — highest density and conductivity for a given W content.—6205185 HB42 % IACS
HIP-VDThis page
HIP/vacuum-degassed high-density electronic grade
Choose for microwave packages, vacuum interrupters and hermetic heat sinks where closed porosity, outgassing and plating quality matter.—6606190 HB45 % IACS

What is W70Cu30 HIP-VD?

W70Cu30 HIP-VD is W70Cu30 in the HIP-VD grade — choose for microwave packages, vacuum interrupters and hermetic heat sinks where closed porosity, outgassing and plating quality matter. W70Cu30 HIP-VD has a yield strength of 450 MPa (65.3 ksi) and a tensile strength of 660 MPa (95.7 ksi) — weaker than 100% of tungsten alloy grades. Elongation at break is 6% and the elastic modulus is 230 GPa (33.4 Msi). W70Cu30 HIP-VD has a density of 14.2 g/cm³ (0.513 lb/in³), lighter than 95% of tungsten alloy grades. It melts at 1,083°C (1,981 °F). INF is the default condition FabDigit quotes; HIP-VD is available on request or by drawing note.

Advantages

  • Conducts heat well — 220 W/m·K (127.1 BTU/hr·ft·°F), better than 105% of tungsten alloy grades
  • High electrical conductivity — 45 % IACS, better than 105% of tungsten alloy grades
  • Lightweight — 14.2 g/cm³ (0.513 lb/in³), better than 95% of tungsten alloy grades
  • Ductile — tolerates forming and impact — 6%, better than 90% of tungsten alloy grades
  • Easy to machine — 35/100, better than 90% of tungsten alloy grades

Limitations

  • Low strength — 450 MPa (65.3 ksi), worse than 100% of tungsten alloy grades
  • Low stiffness — 230 GPa (33.4 Msi), worse than 100% of tungsten alloy grades

W70Cu30 HIP-VD properties

Typical room-temperature values for W70Cu30 HIP-VD; 10 are specific to this condition. Other listed values are W70Cu30 reference data and may not represent this condition. Bars are the position among tungsten alloy grades.

Physical2

W70Cu30 HIP-VD has a density of 14.2 g/cm³ (0.513 lb/in³), lighter than 95% of tungsten alloy grades. It melts at 1,083°C (1,981 °F).

Density14.2 g/cm³0.51 lb/in³
Melting Point (Solidus)1,083°C1,981 °F

Mechanical13

W70Cu30 HIP-VD has a yield strength of 450 MPa (65.3 ksi) and a tensile strength of 660 MPa (95.7 ksi) — weaker than 100% of tungsten alloy grades. Elongation at break is 6% and the elastic modulus is 230 GPa (33.4 Msi).

Elastic (Young's) Modulus230 GPa33.4 Msi
Shear Modulus90 GPa13.1 Msi
Bulk Modulus195 GPa28.3 Msi
Poisson's Ratio0.3
Tensile Strength (Ultimate)660 MPa95.7 ksi
Yield Strength (0.2% offset)450 MPa65.3 ksi
Elongation at Break6%
Compressive Strength1,000 MPa145 ksi
Shear Strength380 MPa55.1 ksi
Fracture Toughness (K_IC)20 MPa·√m18.2 ksi·√in
Hardness, Brinell190 HB
Hardness, Rockwell B96 HRB
Hardness, Vickers200 HV

Thermal5

W70Cu30 HIP-VD is rated for continuous service to 800°C (1,472 °F). It conducts heat at 220 W/m·K (127.1 BTU/hr·ft·°F), better than 105% of tungsten alloy grades. Thermal expansion is 9.4 µm/m·K (5.22 µin/in·°F).

Thermal Conductivity220 W/m·K127 BTU/hr·ft·°F
Specific Heat Capacity205 J/kg·K0.05 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)9.4 µm/m·K5.2 µin/in·°F
Max Service Temperature (continuous)800°C1,472 °F
Min Service Temperature-196°C-321 °F

Electrical3

W70Cu30 HIP-VD conducts electricity at 45 % IACS, better than 105% of tungsten alloy grades.

Electrical Conductivity45 % IACS
Electrical Resistivity3.8×10⁻⁸ Ω·m1.5 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is fair (50/100), worse than 69% of tungsten alloy grades.

Galvanic Potential (seawater, vs SCE)-0.15 V
Corrosion ResistanceFair50/100
Chemical Resistance SummaryStable in dry air, neutral water and most organics; the copper phase is attacked by ammonia/amines, oxidizing acids (HNO3), sulphur compounds and moist chlorides, while the tungsten skeleton dissolves in hot alkaline oxidizers (NaOH+H2O2) and HF/HNO3 mixtures — selective leaching of Cu can leave a porous W surface.

Sustainability4

Producing a kilogram of W70Cu30 HIP-VD takes about 300 MJ of energy and emits 19 kg of CO₂ — less than 88% of tungsten alloy grades. Typical recycled content is 25%.

Embodied Energy (primary production)300 MJ/kg128,977 BTU/lb
Embodied Carbon (primary production)19 kg CO₂/kg
Embodied Water250 L/kg30 gal/lb
Typical Recycled Content25%

Manufacturability7

W70Cu30 HIP-VD's machinability is fair (35/100, better than 90% of tungsten alloy grades); weldability poor (15/100); formability not recommended (5/100).

MachinabilityFair35/100
Machinability Rating (AISI 1212 = 100 %)28%
WeldabilityPoor15/100
Formability (cold)Not recommended5/100
Brazeability / SolderabilityExcellent85/100
PolishabilityVery good75/100
Anodizing Responsen/a — not an anodizable alloy; use Ni or Ag electroplating for solderability and oxidation protection

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with W70Cu30 HIP-VD

Is W70Cu30 easy to machine?

Turn/mill with sharp micrograin-carbide or CBN tooling, light feeds, flood coolant and rigid setups; wire- and sinker-EDM, surface grinding and lapping are the preferred finishing routes.

Can W70Cu30 be welded?

Not fusion weldable — join by silver brazing (BAg-series) or Cu/Ag interlayer diffusion bonding to copper shanks and steel holders; keep braze cycles below ~900 °C to avoid copper sweat-out.

Can W70Cu30 be formed, bent or molded?

No cold or hot forming; net shape comes from powder pressing/infiltration plus machining, with sintered blanks in plate, rod, bar and custom preform forms.

What surface finishes work on W70Cu30?

Electroless/electrolytic Ni (2–5 µm) followed by Au or Ag plating for solderability and oxidation resistance; degas and bake before plating to avoid blistering from residual porosity.

W70Cu30 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Wtungsten skeleton, 68–72 wt% typical trade tolerance ±2 %68 – 7270
Nioptional sintering activator in press-sintered variants only0 – 0.5—
Other impurities (Fe, Mo, C, O)total, per GB/T 8320 / producer specs≤ 0.5—
Cuinfiltrant / matrix≥ 28 (balance)—

W70Cu30 HIP-VD — frequently asked

What is W70Cu30 HIP-VD used for?

W70Cu30 HIP-VD is typically used for EDM electrodes, high-voltage switch contacts, heat sinks and resistance welding electrodes. In short: best-conducting W-Cu grade; workhorse EDM electrode; balanced erosion and conductivity.

What is the yield strength of W70Cu30 HIP-VD?

W70Cu30 HIP-VD has a typical yield strength of 450 MPa (65.3 ksi) and a tensile strength of 660 MPa (95.7 ksi) — weaker than 100% of tungsten alloy grades. Strength varies by condition: see the 3 listed tempers.

Is W70Cu30 HIP-VD easy to machine?

Not especially — machinability is rated fair (35/100, better than 90% of tungsten alloy grades). Turn/mill with sharp micrograin-carbide or CBN tooling, light feeds, flood coolant and rigid setups; wire- and sinker-EDM, surface grinding and lapping are the preferred finishing routes.

Can W70Cu30 HIP-VD be welded?

Not readily — weldability is rated poor (15/100). Not fusion weldable — join by silver brazing (BAg-series) or Cu/Ag interlayer diffusion bonding to copper shanks and steel holders; keep braze cycles below ~900 °C to avoid copper sweat-out.

What surface finishes work on W70Cu30 HIP-VD?

Electroless/electrolytic Ni (2–5 µm) followed by Au or Ag plating for solderability and oxidation resistance; degas and bake before plating to avoid blistering from residual porosity.

Can W70Cu30 HIP-VD be formed, bent or molded?

No cold or hot forming; net shape comes from powder pressing/infiltration plus machining, with sintered blanks in plate, rod, bar and custom preform forms.

What is the maximum service temperature of W70Cu30 HIP-VD?

W70Cu30 HIP-VD is rated for continuous use to about 800°C (1,472 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between W70Cu30-INF and W70Cu30-PS?

INF is the default condition — standard commercial condition for EDM electrodes, switchgear contacts and heat spreaders — highest density and conductivity for a given W content. PS: lower-cost route for simple contact shapes; slightly lower density and conductivity because of residual closed porosity. Yield strength is 450 MPa in INF versus 400 MPa in PS.

Sources

  1. ASTM B702 Standard Specification for Copper-Tungsten Electrical Contact Material — ASTM (2017)
  2. ASM Handbook Vol. 7: Powder Metallurgy (infiltrated W-Cu composites) — ASM International (2015)
  3. ASM Handbook Vol. 2: Properties and Selection — Refractory Metals and Alloys — ASM International (1990)
  4. Tungsten-copper WCu70/30 material data — Plansee / Mi-Tech Tungsten Metals (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.