FabDigit

Solder & Low-Melting Alloy Sn89Zn8Bi3

ISO 811 · also IEC Z80B30

Sn89Zn8Bi3 is a tin-zinc-bismuth lead-free solder, IEC designation Z80B30, in which the bismuth addition drops the melting point to about 197 °C and improves wetting compared with plain Sn-Zn.

High cost $$$$

Reference datasheet — Sn89Zn8Bi3 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.

What is Sn89Zn8Bi3?

Sn89Zn8Bi3 is a tin-zinc-bismuth lead-free solder, IEC designation Z80B30, in which the bismuth addition drops the melting point to about 197 °C and improves wetting compared with plain Sn-Zn. It is used for aluminium and dissimilar-metal joints and is supplied as bar, solid and flux-cored wire, paste, preforms and powder, with 45 MPa yield, 65 MPa tensile, 40% elongation and 22 HB. Service temperature is capped at 100 °C, the alloy needs zinc-compatible active fluxes, and zinc-rich joints tarnish and corrode in humid service. Sn91Zn9 is the closest alternative when bismuth must be avoided. Sn89Zn8Bi3 has a density of 7.35 g/cm³ (0.266 lb/in³), lighter than 84% of solder & low-melting alloy grades. It melts at 189°C (372 °F). Sn89Zn8Bi3 has a yield strength of 45 MPa (6.53 ksi) and a tensile strength of 65 MPa (9.43 ksi) — stronger than 96% of solder & low-melting alloy grades. Elongation at break is 40% and the elastic modulus is 45 GPa (6.53 Msi).

What is Sn89Zn8Bi3 used for?

  • Aluminum soldering
  • Dissimilar metal joints
  • Low-temperature soldering

Advantages

  • High strength — 45 MPa (6.53 ksi), better than 96% of solder & low-melting alloy grades
  • Conducts heat well — 58 W/m·K (33.5 BTU/hr·ft·°F), better than 85% of solder & low-melting alloy grades
  • Lightweight — 7.35 g/cm³ (0.266 lb/in³), better than 84% of solder & low-melting alloy grades
  • High electrical conductivity — 12 % IACS, better than 79% of solder & low-melting alloy grades

Limitations

  • Needs corrosion protection — 30/100, worse than 99% of solder & low-melting alloy grades

Sn89Zn8Bi3 properties

Typical room-temperature values; bars are the position among solder & low-melting alloy grades.

Physical3

Sn89Zn8Bi3 has a density of 7.35 g/cm³ (0.266 lb/in³), lighter than 84% of solder & low-melting alloy grades. It melts at 189°C (372 °F).

Density7.35 g/cm³0.27 lb/in³
Melting Point (Solidus)189°C372 °F
Liquidus Temperature197°C387 °F

Mechanical9

Sn89Zn8Bi3 has a yield strength of 45 MPa (6.53 ksi) and a tensile strength of 65 MPa (9.43 ksi) — stronger than 96% of solder & low-melting alloy grades. Elongation at break is 40% and the elastic modulus is 45 GPa (6.53 Msi).

Elastic (Young's) Modulus45 GPa6.5 Msi
Shear Modulus17 GPa2.5 Msi
Poisson's Ratio0.36
Tensile Strength (Ultimate)65 MPa9.4 ksi
Yield Strength (0.2% offset)45 MPa6.5 ksi
Elongation at Break40%
Shear Strength35 MPa5.1 ksi
Hardness, Brinell22 HB
Hardness, Vickers23 HV

Thermal6

Sn89Zn8Bi3 is rated for continuous service to 100°C (212 °F). It conducts heat at 58 W/m·K (33.5 BTU/hr·ft·°F), better than 85% of solder & low-melting alloy grades. Thermal expansion is 25 µm/m·K (13.9 µin/in·°F).

Thermal Conductivity58 W/m·K33.5 BTU/hr·ft·°F
Specific Heat Capacity230 J/kg·K0.05 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)25 µm/m·K13.9 µin/in·°F
Latent Heat of Fusion60 J/g25.8 BTU/lb
Max Service Temperature (continuous)100°C212 °F
Min Service Temperature-55°C-67 °F

Electrical3

Sn89Zn8Bi3 conducts electricity at 12 % IACS, better than 79% of solder & low-melting alloy grades.

Electrical Conductivity12 % IACS
Electrical Resistivity1.5×10⁻⁷ Ω·m5.91 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is poor (30/100), worse than 99% of solder & low-melting alloy grades.

Galvanic Potential (seawater, vs SCE)-0.75 V
Corrosion ResistancePoor30/100
Chemical Resistance SummaryZinc content makes the alloy readily oxidized and attacked by humidity, chlorides and acidic flux residues; residues must be cleaned. Stable in dry air and neutral organics.

Sustainability4

Producing a kilogram of Sn89Zn8Bi3 takes about 280 MJ of energy and emits 17 kg of CO₂ — more than 65% of solder & low-melting alloy grades. Typical recycled content is 30%.

Embodied Energy (primary production)280 MJ/kg120,378 BTU/lb
Embodied Carbon (primary production)17 kg CO₂/kg
Embodied Water1,500 L/kg180 gal/lb
Typical Recycled Content30%

Manufacturability6

Sn89Zn8Bi3's machinability is fair (35/100, better than 58% of solder & low-melting alloy grades); formability excellent (90/100).

MachinabilityFair35/100
Formability (cold)Excellent90/100
CastabilityVery good80/100
Brazeability / SolderabilityVery good80/100
PolishabilityPoor30/100
Anodizing Responsen/a — tin-based solder alloy is not anodized

Common Calculations5

Specific Strength (UTS / density)calculated9 kN·m/kg
Specific Stiffness (E / density)calculated6.1 MN·m/kg
Modulus of Resiliencecalculated23 kJ/m³
Thermal Diffusivitycalculated34.3 mm²/s
Thermal Shock Resistance Indexcalculated3

Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.

Strength versus weight in the solder & low-melting alloy family

Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Sn89Zn8Bi3 is highlighted; hover a dot for its name, or open the interactive family chart.

125102050891011Density (g/cm³)Yield strength (MPa) — log scaleSn89Zn8Bi3

Working with Sn89Zn8Bi3

Is Sn89Zn8Bi3 easy to machine?

Rarely machined; extremely soft and gummy — use sharp high-rake tools, high speed, low feed and paraffin/kerosene lubricant, or simply cast/stamp to shape.

Can Sn89Zn8Bi3 be welded?

Not welded; it is itself a filler — solder at 210–250 °C pot temperature with a zinc-compatible active (halide or reaction-type) flux and keep dwell short to limit dross.

Can Sn89Zn8Bi3 be formed, bent or molded?

Casts into bar readily and extrudes/draws into 0.5–3 mm wire without annealing; keep melt under cover or N₂ to suppress ZnO dross.

Sn89Zn8Bi3 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Znwets/penetrates aluminium oxide; main dross former7.5 – 8.58
Bidepresses melting range and improves spreading2.5 – 3.53
PbRoHS lead-free limit≤ 0.07
Cuimpurity≤ 0.05
Feimpurity≤ 0.02
Alimpurity≤ 0.01
Sbimpurity≤ 0.05
Agimpurity≤ 0.05
Snbalance

What surface finishes work on Sn89Zn8Bi3?

No anodizing or plating; clean flux residues immediately and, for humid service, conformal-coat the joint since Zn-rich joints tarnish and corrode.

Equivalent designations

Standards and trade names that resolve to Solder & Low-Melting Alloy Sn89Zn8Bi3 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.

ISO
811
Trade names
IEC Z80B30

How much does Sn89Zn8Bi3 cost?

Sn89Zn8Bi3 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.

Sn89Zn8Bi3 — frequently asked

What is Sn89Zn8Bi3 used for?

Sn89Zn8Bi3 is typically used for aluminum soldering, dissimilar metal joints and low-temperature soldering. In short: lowest-melting Sn-Zn solder; better wetting than Sn-Zn; aluminium-capable filler.

What is the yield strength of Sn89Zn8Bi3?

Sn89Zn8Bi3 has a typical yield strength of 45 MPa (6.53 ksi) and a tensile strength of 65 MPa (9.43 ksi) — stronger than 96% of solder & low-melting alloy grades.

Is Sn89Zn8Bi3 easy to machine?

Not especially — machinability is rated fair (35/100, better than 58% of solder & low-melting alloy grades). Rarely machined; extremely soft and gummy — use sharp high-rake tools, high speed, low feed and paraffin/kerosene lubricant, or simply cast/stamp to shape.

Can Sn89Zn8Bi3 be welded?

Not welded; it is itself a filler — solder at 210–250 °C pot temperature with a zinc-compatible active (halide or reaction-type) flux and keep dwell short to limit dross.

What surface finishes work on Sn89Zn8Bi3?

No anodizing or plating; clean flux residues immediately and, for humid service, conformal-coat the joint since Zn-rich joints tarnish and corrode.

Can Sn89Zn8Bi3 be formed, bent or molded?

Casts into bar readily and extrudes/draws into 0.5–3 mm wire without annealing; keep melt under cover or N₂ to suppress ZnO dross.

What is the maximum service temperature of Sn89Zn8Bi3?

Sn89Zn8Bi3 is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

How much does Sn89Zn8Bi3 cost?

Sn89Zn8Bi3 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.

Sources

  1. IEC 61190-1-3 Attachment materials for electronic assembly — requirements for electronic grade solder alloys — IEC (2007)
  2. J-STD-006 Requirements for Electronic Grade Solder Alloys — IPC (2013)
  3. GB/T 20422 — SAC (2018)
  4. ASM Handbook Vol. 6 — Soldering (solder alloy property tables) — ASM International (1993)
  5. NIST Lead-Free Solder Properties Database — NIST (2002)

Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.