Solder & Low-Melting Alloy B560 Type I-F (As fabricated)
Temper · default condition
ASTM B560 Type I
Default condition for hollowware, tankards and figurines poured in sand or rubber/silicone moulds.
Values for the F condition
Other B560 Type I tempers and conditions
B560 Type I is listed in 3 conditions; see the grade overview at B560 Type I.
Compare all 3 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
FDefaultThis page As fabricated | Default condition for hollowware, tankards and figurines poured in sand or rubber/silicone moulds. | 32 | 55 | 30 | 25 HB | 10 % IACS |
Centrifugal (spin) cast | Used with vulcanised-rubber or silicone moulds for small figurines, badges and miniatures; best fill of thin sections. | 34 | 58 | 28 | 26 HB | 10 % IACS |
Chill / permanent-mould cast | Steel or bronze moulds give a finer SbSn dispersion, slightly higher hardness and better surface for production runs. | 36 | 62 | 25 | 28 HB | 10 % IACS |
What is B560 Type I-F?
B560 Type I-F is B560 Type I in the F temper — default condition for hollowware, tankards and figurines poured in sand or rubber/silicone moulds. B560 Type I-F has a yield strength of 32 MPa (4.64 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 73% of solder & low-melting alloy grades. Elongation at break is 30% and the elastic modulus is 45 GPa (6.53 Msi). B560 Type I-F has a density of 7.3 g/cm³ (0.264 lb/in³), lighter than 93% of solder & low-melting alloy grades. It melts at 244°C (471 °F).
Advantages
- Polishes to a fine finish — 90/100, better than 100% of solder & low-melting alloy grades
- Lightweight — 7.3 g/cm³ (0.264 lb/in³), better than 93% of solder & low-melting alloy grades
- Good corrosion resistance — 62/100, better than 93% of solder & low-melting alloy grades
- Easy to machine — 70/100, better than 79% of solder & low-melting alloy grades
Limitations
- Limited formability — 60/100, worse than 78% of solder & low-melting alloy grades
- High embodied carbon — 18 kg CO₂/kg, worse than 76% of solder & low-melting alloy grades
B560 Type I-F properties
Typical room-temperature values for B560 Type I-F; 20 are specific to this condition. Other listed values are B560 Type I reference data and may not represent this condition. Bars are the position among solder & low-melting alloy grades.
Physical3
B560 Type I-F has a density of 7.3 g/cm³ (0.264 lb/in³), lighter than 93% of solder & low-melting alloy grades. It melts at 244°C (471 °F).
Mechanical14
B560 Type I-F has a yield strength of 32 MPa (4.64 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 73% of solder & low-melting alloy grades. Elongation at break is 30% and the elastic modulus is 45 GPa (6.53 Msi).
Thermal6
B560 Type I-F is rated for continuous service to 100°C (212 °F). It conducts heat at 50 W/m·K (28.9 BTU/hr·ft·°F), better than 63% of solder & low-melting alloy grades. Thermal expansion is 23 µm/m·K (12.8 µin/in·°F).
Electrical3
B560 Type I-F conducts electricity at 10 % IACS, better than 54% of solder & low-melting alloy grades.
Chemical & Environmental3
Corrosion resistance is good (62/100), better than 93% of solder & low-melting alloy grades.
Sustainability4
Producing a kilogram of B560 Type I-F takes about 300 MJ of energy and emits 18 kg of CO₂ — more than 73% of solder & low-melting alloy grades. Typical recycled content is 40%.
Manufacturability8
B560 Type I-F's machinability is very good (70/100, better than 79% of solder & low-melting alloy grades); weldability poor (25/100); formability good (60/100).
Common Calculations5
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with B560 Type I-F
Is B560 Type I easy to machine?
Cuts with very low force but is gummy — use sharp, high-rake HSS tools, generous chip clearance, high speed and light feed with kerosene or soluble-oil lubricant.
Can B560 Type I be welded?
Not arc-weldable; join by torch fusion with matching filler or by soft-soldering with tin-based solder below the 244 °C solidus.
Can B560 Type I be formed, bent or molded?
Melt at 300–350 °C and pour into sand, steel, silicone or vulcanised-rubber moulds; excellent fluidity and small shrinkage allow thin, detailed sections, and gates/runners are directly remeltable.
What surface finishes work on B560 Type I?
Turns, spins and buffs easily to a bright silvery surface; also brushed, sandblasted or chemically antiqued — plating and lacquering are possible but anodizing is not applicable.
B560 Type I chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Sbforms hard SbSn phase, raises hardness and castability | 6 – 8 | 7 |
| CuCu6Sn5 needles strengthen and refine structure | 0.25 – 2 | 1 |
| Pbimpurity limit — modern pewter is lead-free for food contact | ≤ 0.05 | — |
| Snbalance tin | ≥ 90 (balance) | — |
B560 Type I-F — frequently asked
What is B560 Type I-F used for?
B560 Type I-F is typically used for cast tableware, decorative hollowware, figurines and trophy castings. In short: hardest common casting pewter; casts fine detail, low shrinkage; remeltable gates and runners.
What is the yield strength of B560 Type I-F?
B560 Type I-F has a typical yield strength of 32 MPa (4.64 ksi) and a tensile strength of 55 MPa (7.98 ksi) — stronger than 73% of solder & low-melting alloy grades. Strength varies by condition: see the 3 listed tempers.
Is B560 Type I-F easy to machine?
Yes — machinability is rated very good (70/100, better than 79% of solder & low-melting alloy grades). Cuts with very low force but is gummy — use sharp, high-rake HSS tools, generous chip clearance, high speed and light feed with kerosene or soluble-oil lubricant.
Can B560 Type I-F be welded?
Not readily — weldability is rated poor (25/100). Not arc-weldable; join by torch fusion with matching filler or by soft-soldering with tin-based solder below the 244 °C solidus.
What surface finishes work on B560 Type I-F?
Turns, spins and buffs easily to a bright silvery surface; also brushed, sandblasted or chemically antiqued — plating and lacquering are possible but anodizing is not applicable.
Can B560 Type I-F be formed, bent or molded?
Melt at 300–350 °C and pour into sand, steel, silicone or vulcanised-rubber moulds; excellent fluidity and small shrinkage allow thin, detailed sections, and gates/runners are directly remeltable.
What is the maximum service temperature of B560 Type I-F?
B560 Type I-F is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between B560 Type I-F and B560 Type I CHILL?
F is the default condition — default condition for hollowware, tankards and figurines poured in sand or rubber/silicone moulds. CHILL: steel or bronze moulds give a finer SbSn dispersion, slightly higher hardness and better surface for production runs. Yield strength is 32 MPa in F versus 36 MPa in CHILL.
Sources
- ASTM B560 Standard Specification for Modern Pewter Alloys — ASTM International (2019)
- ASM Handbook Vol. 2: Properties and Selection — Nonferrous Alloys and Special-Purpose Materials (tin and tin alloys) — ASM International (1990)
- ASM Handbook Vol. 15: Casting — ASM International (2008)
- International Tin Association tin alloy property data — ITA (formerly ITRI) (2020)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.