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Precious Metal PdCu-H02

Supply condition

H02 = half hard

Choose for contact springs and formed parts needing higher strength while retaining some bendability.

High cost $$$$

Values for the H02 condition

Other PdCu tempers and conditions

PdCu is listed in 6 conditions; see the grade overview at PdCu.

Compare all 6 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
AnnealedDefault
soft, fully recrystallized wire/sheet/strip
Default stock condition: pick for forming, deep drawing, wire drawing, membrane foil and further cold working.24050028130 HB5 % IACS
investment-cast dental restorations (ISO 22674 type 4/5)
Choose for cast crowns, bridges and frameworks; meets the ISO 22674 proof-stress and elongation classes for fixed restorations.35055015165 HB4.5 % IACS
H02This page
Half hard
Choose for contact springs and formed parts needing higher strength while retaining some bendability.550700893 HRB4.8 % IACS
Full hard
Choose for drawn contact wire, probe pins and slip-ring brush wire needing high strength and wear resistance.800900324 HRC4.8 % IACS
Ordered / age-hardened
Choose when both higher hardness and markedly lower electrical resistivity are wanted (hydrogen membranes, low-noise contacts).8501,000330 HRC9.6 % IACS
Spring hard
Choose for fine spring contacts and low-force wipers where maximum elastic limit is required.9501,050228 HRC4.7 % IACS

What is PdCu-H02?

PdCu-H02 is PdCu supplied in the H02 condition — choose for contact springs and formed parts needing higher strength while retaining some bendability. PdCu-H02 has a yield strength of 550 MPa (79.8 ksi) and a tensile strength of 700 MPa (102 ksi) — stronger than 97% of precious metal grades. Elongation at break is 8% and the elastic modulus is 130 GPa (18.9 Msi). PdCu-H02 has a density of 10.4 g/cm³ (0.376 lb/in³), heavier than 51% of precious metal grades. It melts at 1,000°C (1,832 °F). Annealed is the default condition FabDigit quotes; H02 is available on request or by drawing note.

Advantages

  • High strength — 550 MPa (79.8 ksi), better than 97% of precious metal grades
  • Stiff — 130 GPa (18.9 Msi), better than 83% of precious metal grades
  • High service temperature — 500°C (932 °F), better than 79% of precious metal grades

Limitations

  • Low electrical conductivity — 4.8 % IACS, worse than 98% of precious metal grades
  • Poor heat conductor — 25 W/m·K (14.4 BTU/hr·ft·°F), worse than 96% of precious metal grades
  • Limited ductility — 8%, worse than 92% of precious metal grades
  • Limited formability — 55/100, worse than 89% of precious metal grades

PdCu-H02 properties

Typical room-temperature values for PdCu-H02; 10 are specific to this condition. Other listed values are PdCu reference data and may not represent this condition. Bars are the position among precious metal grades.

Physical3

PdCu-H02 has a density of 10.4 g/cm³ (0.376 lb/in³), heavier than 51% of precious metal grades. It melts at 1,000°C (1,832 °F).

Density10.4 g/cm³0.38 lb/in³
Melting Point (Solidus)1,000°C1,832 °F
Liquidus Temperature1,020°C1,868 °F

Mechanical11

PdCu-H02 has a yield strength of 550 MPa (79.8 ksi) and a tensile strength of 700 MPa (102 ksi) — stronger than 97% of precious metal grades. Elongation at break is 8% and the elastic modulus is 130 GPa (18.9 Msi).

Elastic (Young's) Modulus130 GPa18.9 Msi
Shear Modulus48 GPa7 Msi
Bulk Modulus155 GPa22.5 Msi
Poisson's Ratio0.37
Tensile Strength (Ultimate)700 MPa102 ksi
Yield Strength (0.2% offset)550 MPa79.8 ksi
Elongation at Break8%
Shear Strength300 MPa43.5 ksi
Fatigue Strength (Endurance Limit)280 MPa40.6 ksi
Hardness, Brinell130 HB
Hardness, Vickers200 HV

Thermal6

PdCu-H02 is rated for continuous service to 500°C (932 °F). It conducts heat at 25 W/m·K (14.4 BTU/hr·ft·°F), worse than 96% of precious metal grades. Thermal expansion is 14 µm/m·K (7.78 µin/in·°F).

Thermal Conductivity25 W/m·K14.4 BTU/hr·ft·°F
Specific Heat Capacity300 J/kg·K0.07 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)14 µm/m·K7.8 µin/in·°F
Latent Heat of Fusion176 J/g75.7 BTU/lb
Max Service Temperature (continuous)500°C932 °F
Min Service Temperature-200°C-328 °F

Electrical3

PdCu-H02 conducts electricity at 4.8 % IACS, worse than 98% of precious metal grades.

Electrical Conductivity4.8 % IACS
Electrical Resistivity3.6×10⁻⁷ Ω·m14.2 µΩ·in
Magnetic Responsenon-magnetic (paramagnetic FCC/B2 solid solution)

Chemical & Environmental3

Corrosion resistance is excellent (85/100), better than 61% of precious metal grades.

Galvanic Potential (seawater, vs SCE)0.2 V
Corrosion ResistanceExcellent85/100
Chemical Resistance SummaryTarnish- and sulfide-resistant; resists dilute acids, alkalis, saliva and body fluids. Attacked by aqua regia, hot concentrated nitric/sulfuric acid, ferric chloride and molten alkali; the copper component can be selectively leached in strongly oxidizing acid or ammonia solutions.

Sustainability4

Producing a kilogram of PdCu-H02 takes about 70,000 MJ of energy and emits 2,500 kg of CO₂ — more than 64% of precious metal grades. Typical recycled content is 55%.

Embodied Energy (primary production)70,000 MJ/kg3.01×10⁷ BTU/lb
Embodied Carbon (primary production)2,500 kg CO₂/kg
Embodied Water60,000 L/kg7,190 gal/lb
Typical Recycled Content55%

Manufacturability8

PdCu-H02's machinability is fair (40/100, worse than 60% of precious metal grades); weldability good (65/100); formability good (55/100).

MachinabilityFair40/100
Machinability Rating (AISI 1212 = 100 %)30%
WeldabilityGood65/100
Formability (cold)Good55/100
CastabilityVery good70/100
Brazeability / SolderabilityExcellent85/100
PolishabilityExcellent90/100
Anodizing Responsen/a — noble alloy, not anodizable; finished by polishing or Au/Rh flash plating

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with PdCu-H02

Is PdCu easy to machine?

Machines like a gummy noble alloy — sharp carbide or HSS tools, positive rake, high speed, light feeds and flood coolant; collect all chips for refining.

Can PdCu be welded?

No filler fusion welding in practice; joined by laser, resistance/spot or microplasma welding, and by Au/Ag-base brazing at 700–900 °C.

Can PdCu be formed, bent or molded?

Excellent cold formability when annealed (drawn to <0.05 mm wire, rolled to membrane foil); intermediate anneals 700–850 °C in inert or reducing atmosphere, and avoid slow cooling through 350–450 °C if the soft disordered state is wanted.

What surface finishes work on PdCu?

Takes a bright mirror polish and stays tarnish-free; Au or Rh flash plating is used only for contact-resistance stability, anodizing is not applicable.

PdCu chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Cu≈53–55 at% Cu; ordered B2 CuPd forms below ~600 °C38 – 4240
Other, eachtrace Fe, Ni, Pb, O held low for ductility and biocompatibility≤ 0.1—
Pdbalance; dental Pd–Cu grades run much higher Pd (75–80 %) with Ga/Sn additions≥ 58 (balance)—

PdCu-H02 — frequently asked

What is PdCu-H02 used for?

PdCu-H02 is typically used for dental crowns/bridges, electrical contacts and brazing alloys. In short: order-hardenable palladium alloy; hard, tarnish-free Pd grade; dental and contact metal.

What is the yield strength of PdCu-H02?

PdCu-H02 has a typical yield strength of 550 MPa (79.8 ksi) and a tensile strength of 700 MPa (102 ksi) — stronger than 97% of precious metal grades. Strength varies by condition: see the 6 listed tempers.

Is PdCu-H02 easy to machine?

Not especially — machinability is rated fair (40/100, worse than 60% of precious metal grades). Machines like a gummy noble alloy — sharp carbide or HSS tools, positive rake, high speed, light feeds and flood coolant; collect all chips for refining.

Can PdCu-H02 be welded?

Yes — weldability is rated good (65/100). No filler fusion welding in practice; joined by laser, resistance/spot or microplasma welding, and by Au/Ag-base brazing at 700–900 °C.

What surface finishes work on PdCu-H02?

Takes a bright mirror polish and stays tarnish-free; Au or Rh flash plating is used only for contact-resistance stability, anodizing is not applicable.

Can PdCu-H02 be formed, bent or molded?

Excellent cold formability when annealed (drawn to <0.05 mm wire, rolled to membrane foil); intermediate anneals 700–850 °C in inert or reducing atmosphere, and avoid slow cooling through 350–450 °C if the soft disordered state is wanted.

What is the maximum service temperature of PdCu-H02?

PdCu-H02 is rated for continuous use to about 500°C (932 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between PdCu Annealed and PdCu Spring?

Annealed is the default condition — default stock condition: pick for forming, deep drawing, wire drawing, membrane foil and further cold working. Spring: choose for fine spring contacts and low-force wipers where maximum elastic limit is required. Yield strength is 240 MPa in Annealed versus 950 MPa in Spring.

Sources

  1. ISO 22674 — Dentistry: Metallic materials for fixed and removable restorations and appliances — ISO (2016)
  2. ASM Specialty Handbook / Precious Metals Science and Technology — ASM International / IPMI (1991)
  3. ASM Alloy Phase Diagrams — Cu–Pd system — ASM International (2016)
  4. Palladium alloy contact and wire materials — Deringer-Ney / Johnson Matthey (2023)
  5. Pd–Cu membrane and contact alloy property compilations — Metals research literature (H2 separation membranes) (2020)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.