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DAP SDG-F

Reinforced grade · default condition

ASTM D5948 Type SDG

SDG-F = short glass-fiber filled DAP molding compound

Default general-purpose grade: short glass fiber gives 55 MPa tensile and 180 °C service for military and aerospace connectors and relay parts balancing strength, heat and insulation.

High cost $$$$

Values for the SDG-F condition

Other DAP grades and fills

DAP is listed in 6 conditions; see the grade overview at DAP.

Compare all 6 grades and fillsHide
Grade · open for datasheetBest forYield MPaTensile MPaElong. %Hardness
Mineral (clay/silica) filled DAP
Choose the clay/silica mineral-filled compound for economical, dimensionally stable switches and terminal blocks with the best arc and tracking resistance; tensile strength drops to 40 MPa.—40——
Synthetic (acrylic/polyester) fiber filled DAP
Pick acrylic or polyester fiber filling for the lowest density (1.4 g/cm³) plus best toughness and arc resistance in weight-critical aerospace connectors and thin-wall radomes; 150 °C limit.—45——
Flame-retardant / UL 94 V-0 listed DAP
Specify when a UL Yellow Card V-0 listing with guaranteed CTI and glow-wire ratings is required for electrical parts; tensile strength settles near 50 MPa in exchange for the flame-retardant package.—500.5112 HRM
SDG-FDefaultThis page
Short glass-fiber filled DAP molding compound
Default general-purpose grade: short glass fiber gives 55 MPa tensile and 180 °C service for military and aerospace connectors and relay parts balancing strength, heat and insulation.—55——
Glass-filled diallyl isophthalate
Choose the isophthalate-based glass-filled compound for continuous service above 200 °C in high-temperature connectors and motor insulation, where the standard orthophthalate types fall short.—60——
Long glass-fiber (high-impact) DAP
Use long glass fiber for load-bearing or impact-loaded thick-wall insulators needing 70 MPa and 185 °C service, accepting poor flow that limits it to compression or transfer molding.—700.9108 HRM

What is DAP SDG-F?

DAP SDG-F is DAP in the SDG-F grade — default general-purpose grade: short glass fiber gives 55 MPa tensile and 180 °C service for military and aerospace connectors and relay parts balancing strength, heat and insulation. DAP SDG-F has a tensile strength of 55 MPa (7.98 ksi), stronger than 61% of polymer grades. Elongation at break is 0.6% and the elastic modulus is 10.5 GPa (1.52 Msi). DAP SDG-F has a density of 1.8 g/cm³ (0.065 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 160°C (320 °F).

Advantages

  • Conducts heat well — 0.5 W/m·K (0.289 BTU/hr·ft·°F), better than 98% of polymer grades
  • Stiff — 10.5 GPa (1.52 Msi), better than 95% of polymer grades
  • High service temperature — 180°C (356 °F), better than 85% of polymer grades
  • Low, predictable mold shrinkage — 0.4%, better than 82% of polymer grades
  • Good UV / weathering resistance — 55/100, better than 77% of polymer grades

Limitations

  • Limited formability — 0/100, worse than 100% of polymer grades
  • Limited ductility — 0.6%, worse than 99% of polymer grades
  • Difficult to weld — 0/100, worse than 98% of polymer grades
  • Heavy — 1.8 g/cm³ (0.065 lb/in³), worse than 95% of polymer grades
  • Difficult to machine — 40/100, worse than 82% of polymer grades

DAP SDG-F properties

Typical room-temperature values for DAP SDG-F; 11 are specific to this condition. Other listed values are DAP reference data and may not represent this condition. Bars are the position among polymer grades.

Physical4

DAP SDG-F has a density of 1.8 g/cm³ (0.065 lb/in³), heavier than 95% of polymer grades. Its glass-transition temperature is 160°C (320 °F).

Density1.8 g/cm³0.07 lb/in³
Glass Transition (Tg)160°C320 °F
Water Absorption (24 h)0.2%
Water Absorption (Saturation)0.6%

Mechanical9

DAP SDG-F has a tensile strength of 55 MPa (7.98 ksi), stronger than 61% of polymer grades. Elongation at break is 0.6% and the elastic modulus is 10.5 GPa (1.52 Msi).

Elastic (Young's) Modulus10.5 GPa1.5 Msi
Poisson's Ratio0.32
Tensile Strength (Ultimate)55 MPa8 ksi
Elongation at Break0.6%
Compressive Strength200 MPa29 ksi
Flexural Strength105 MPa15.2 ksi
Flexural Modulus11 GPa1.6 Msi
Izod Impact, Notched40 J/m0.75 ft·lbf/in
Hardness, Rockwell M110 HRM

Thermal10

DAP SDG-F is rated for continuous service to 180°C (356 °F). It conducts heat at 0.5 W/m·K (0.289 BTU/hr·ft·°F), better than 98% of polymer grades. Thermal expansion is 25 µm/m·K (13.9 µin/in·°F).

Thermal Conductivity0.5 W/m·K0.29 BTU/hr·ft·°F
Specific Heat Capacity1,050 J/kg·K0.25 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)25 µm/m·K13.9 µin/in·°F
Max Service Temperature (continuous)180°C356 °F
Min Service Temperature-60°C-76 °F
Heat Deflection Temp. @ 0.45 MPa285°C545 °F
Heat Deflection Temp. @ 1.8 MPa265°C509 °F
Flammability (UL 94)—
Limiting Oxygen Index32%
Max Service Temperature (short-term)230°C446 °F

Electrical7

DAP SDG-F is an electrical insulator with a dielectric strength of 16 kV/mm (406.4 V/mil) and a resistivity of 1×10¹³ Ω·m.

Electrical Resistivity1×10¹³ Ω·m3.94×10²⁰ µΩ·in
Dielectric Strength16 kV/mm406 V/mil
Dielectric Constant (1 MHz)4.3
Dissipation Factor (1 MHz)0.011
Volume Resistivity1×10¹⁵ Ω·cm
Surface Resistivity1×10¹⁴ Ω
Comparative Tracking Index (CTI)200 V

Chemical & Environmental3

Corrosion resistance is very good (80/100), worse than 52% of polymer grades. UV resistance is good.

Corrosion ResistanceVery good80/100
UV / Weathering ResistanceGood55/100
Chemical Resistance Summary—

Sustainability3

Producing a kilogram of DAP SDG-F takes about 105 MJ of energy and emits 5.5 kg of CO₂ — more than 54% of polymer grades. Typical recycled content is 0%.

Embodied Energy (primary production)105 MJ/kg45,142 BTU/lb
Embodied Carbon (primary production)5.5 kg CO₂/kg
Typical Recycled Content0%

Manufacturability6

DAP SDG-F's machinability is fair (40/100, worse than 82% of polymer grades); weldability not recommended (0/100); formability not recommended (0/100).

MachinabilityFair40/100
WeldabilityNot recommended0/100
Formability (cold)Not recommended0/100
PolishabilityFair45/100
Mold Shrinkage0.4%
Mold Temperature (typ.)160°C320 °F

Common Calculations4

Specific Strength (UTS / density)calculated31 kN·m/kg
Specific Stiffness (E / density)calculated5.8 MN·m/kg
Thermal Diffusivitycalculated0.3 mm²/s
Thermal Shock Resistance Indexcalculated0

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with DAP SDG-F

Is DAP easy to machine?

Turning, milling, drilling and tapping are all possible, but glass and mineral fillers are highly abrasive — use carbide or PCD tooling with low feed and dust extraction. The material is brittle, so back up drill exits to prevent breakout.

Can DAP be welded?

Cross-linked thermoset; it cannot be melt-welded. Join with epoxy or cyanoacrylate adhesive or mechanical fasteners — moulded-in metal inserts are the most common method.

Can DAP be formed, bent or molded?

Processed by compression, transfer or thermoset screw injection moulding: preheat the compound to 90–105 °C, run mould temperature 145–180 °C and cure about 30–60 s/mm. There is no post-shrinkage, so dimensions stay stable; pay attention to venting and flash control.

What surface finishes work on DAP?

Parts leave the tool with a matte or gloss surface and usually need no secondary work; deflash, bead blast, laser mark or print as required. Surface energy is low, so plasma treatment or a primer is needed before painting or plating.

DAP chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
diallyl phthalate prepolymer + monomer (diallyl phthalate prepolymer and monomer matrix25 – 4535
glass fiberchopped glass fiber (SDG-F)15 – 4025
mineral filler (clay / silica / CaCO3)primary filler in MDG grades20 – 4535
organic peroxide initiator (e.g. dicumyl0.5 – 21
mold release / lubricant (metallic stear0.3 – 1.50.8
pigment / stabilizer0.2 – 20.7

DAP SDG-F — frequently asked

What is DAP SDG-F used for?

DAP SDG-F is typically used for electrical connectors, terminal blocks, aerospace connector housings and precision insulators. In short: dimensionally stable thermoset; low moisture pickup; connector-grade insulation.

What is the tensile strength of DAP SDG-F?

DAP SDG-F has a typical tensile strength of 55 MPa (7.98 ksi) — stronger than 61% of polymer grades. Strength varies by condition: see the 6 listed tempers.

Is DAP SDG-F easy to machine?

Not especially — machinability is rated fair (40/100, worse than 82% of polymer grades). Turning, milling, drilling and tapping are all possible, but glass and mineral fillers are highly abrasive — use carbide or PCD tooling with low feed and dust extraction. The material is brittle, so back up drill exits to prevent breakout.

Can DAP SDG-F be welded?

Not readily — weldability is rated not recommended (0/100). Cross-linked thermoset; it cannot be melt-welded. Join with epoxy or cyanoacrylate adhesive or mechanical fasteners — moulded-in metal inserts are the most common method.

What surface finishes work on DAP SDG-F?

Parts leave the tool with a matte or gloss surface and usually need no secondary work; deflash, bead blast, laser mark or print as required. Surface energy is low, so plasma treatment or a primer is needed before painting or plating.

Can DAP SDG-F be formed, bent or molded?

Processed by compression, transfer or thermoset screw injection moulding: preheat the compound to 90–105 °C, run mould temperature 145–180 °C and cure about 30–60 s/mm. There is no post-shrinkage, so dimensions stay stable; pay attention to venting and flash control.

What is the maximum service temperature of DAP SDG-F?

DAP SDG-F is rated for continuous use to about 180°C (356 °F), and briefly to 230°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Sources

  1. ASTM D5948 Standard Specification for Molding Compounds, Thermosetting — ASTM International (2019)
  2. MIL-M-14H Molding Plastics and Molded Plastic Parts, Thermosetting — US DoD (1989)
  3. Engineered Materials Handbook Vol.2: Engineering Plastics — ASM International (1988)
  4. DAP/DAIP molding compound datasheets (allyl compounders) — Cosmic Plastics / Daiso / Polymics (2023)
  5. UL Yellow Card / IEC 60112, 60695 electrical ratings for allyl compounds — UL Solutions (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.