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EPN Tough

Grade

Tough = rubber-toughened (CTBN / core-shell modified) novolac epoxy

Choose when crack resistance, thermal-shock survival or structural adhesive peel strength matters more than peak Tg and modulus.

Premium cost $$$

Values for the Tough condition

Other EPN grades and fills

EPN is listed in 8 conditions; see the grade overview at EPN.

Compare all 8 grades and fillsHide
Grade · open for datasheetBest forYield MPaTensile MPaElong. %Hardness
ToughThis page
Rubber-toughened (CTBN / core-shell modified) novolac epoxy
Choose when crack resistance, thermal-shock survival or structural adhesive peel strength matters more than peak Tg and modulus.—60595 HRM
Flame-retardant grade (brominated novolac / phosphorus-modified), UL 94…
Choose where UL 94 V-0 and high LOI are required in electrical encapsulation, laminates or transformer castings.—681.789 Shore D
O-Cresol novolac epoxy
Pick the cresol-novolac chemistry for solid-state moulding powders and EMC binders — higher softening point, lower melt tack and slightly higher Tg than phenol-novolac EPN.—701.689 Shore D
NEATDefault
Unfilled / neat cast resin
Baseline cured novolac epoxy casting or coating film — choose for chemical linings, adhesives and general high-Tg castings where stiffness demand is modest.—722108 HRM
Fused-silica filled epoxy molding compound
Pick for IC/discrete encapsulation and transfer-molded electronics where low CTE, low ionic content and low moisture uptake are mandatory.—850.790 Shore D
Glass-fabric reinforced novolac epoxy laminate
Choose for high-Tg PCB substrates, electrical insulation parts and structural panels needing 180 °C service with good dielectric behaviour.—3301.8—
Carbon-fibre prepreg laminate, novolac-epoxy matrix
Choose for aerospace/motorsport structures needing 160–190 °C hot-wet capability beyond standard 120 °C-cure DGEBA prepregs.—1,9001.5—
Thermally conductive mineral filled
Choose for potting power electronics and LED modules where heat removal plus electrical isolation is required.————

What is EPN Tough?

EPN Tough is EPN in the Tough grade — choose when crack resistance, thermal-shock survival or structural adhesive peel strength matters more than peak Tg and modulus. EPN Tough has a tensile strength of 60 MPa (8.7 ksi), stronger than 68% of polymer grades. Elongation at break is 5% and the elastic modulus is 2.7 GPa (0.392 Msi). EPN Tough has a density of 1.18 g/cm³ (0.0426 lb/in³), heavier than 50% of polymer grades. Its glass-transition temperature is 160°C (320 °F). NEAT is the default condition FabDigit quotes; Tough is available on request or by drawing note.

Advantages

  • High service temperature — 155°C (311 °F), better than 81% of polymer grades
  • Polishes to a fine finish — 70/100, better than 77% of polymer grades

Limitations

  • Degrades in UV without stabilisers — 22/100, worse than 83% of polymer grades
  • High embodied carbon — 6.8 kg CO₂/kg, worse than 75% of polymer grades

EPN Tough properties

Typical room-temperature values for EPN Tough; 12 are specific to this condition. Other listed values are EPN reference data and may not represent this condition. Bars are the position among polymer grades.

Physical5

EPN Tough has a density of 1.18 g/cm³ (0.0426 lb/in³), heavier than 50% of polymer grades. Its glass-transition temperature is 160°C (320 °F).

Density1.18 g/cm³0.04 lb/in³
Glass Transition (Tg)160°C320 °F
Water Absorption (24 h)0.15%
Water Absorption (Saturation)1.6%
Refractive Index1.59

Mechanical15

EPN Tough has a tensile strength of 60 MPa (8.7 ksi), stronger than 68% of polymer grades. Elongation at break is 5% and the elastic modulus is 2.7 GPa (0.392 Msi).

Elastic (Young's) Modulus2.7 GPa0.39 Msi
Shear Modulus1.3 GPa0.18 Msi
Bulk Modulus4 GPa0.61 Msi
Poisson's Ratio0.36
Tensile Strength (Ultimate)60 MPa8.7 ksi
Elongation at Break5%
Compressive Strength155 MPa22.5 ksi
Compressive Modulus3.2 GPa0.46 Msi
Flexural Strength105 MPa15.2 ksi
Flexural Modulus2.8 GPa0.41 Msi
Shear Strength55 MPa8 ksi
Fracture Toughness (K_IC)1.4 MPa·√m1.3 ksi·√in
Izod Impact, Notched55 J/m1 ft·lbf/in
Hardness, Shore D88 Shore D
Hardness, Rockwell M95 HRM

Thermal10

EPN Tough is rated for continuous service to 155°C (311 °F). It conducts heat at 0.2 W/m·K (0.116 BTU/hr·ft·°F), worse than 56% of polymer grades. Thermal expansion is 60 µm/m·K (33.3 µin/in·°F).

Thermal Conductivity0.2 W/m·K0.12 BTU/hr·ft·°F
Specific Heat Capacity1,100 J/kg·K0.26 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)60 µm/m·K33.3 µin/in·°F
Max Service Temperature (continuous)155°C311 °F
Min Service Temperature-55°C-67 °F
Heat Deflection Temp. @ 0.45 MPa190°C374 °F
Heat Deflection Temp. @ 1.8 MPa150°C302 °F
Flammability (UL 94)HB
Limiting Oxygen Index23%
Max Service Temperature (short-term)220°C428 °F

Electrical7

EPN Tough is an electrical insulator with a dielectric strength of 19 kV/mm (482.6 V/mil) and a resistivity of 1×10¹³ Ω·m.

Electrical Resistivity1×10¹³ Ω·m3.94×10²⁰ µΩ·in
Dielectric Strength19 kV/mm483 V/mil
Dielectric Constant (1 MHz)3.8
Dissipation Factor (1 MHz)0.02
Volume Resistivity1×10¹⁵ Ω·cm
Surface Resistivity1×10¹⁵ Ω
Comparative Tracking Index (CTI)250 V

Chemical & Environmental3

Corrosion resistance is excellent (88/100), better than 74% of polymer grades. UV resistance is poor.

Corrosion ResistanceExcellent88/100
UV / Weathering ResistancePoor22/100
Chemical Resistance SummaryExcellent against dilute/concentrated mineral acids, salts, fuels, aromatic and chlorinated solvents, and hot water; superior to bisphenol-A epoxy at elevated temperature. Attacked by strong oxidizers (conc. HNO3, chromic acid), hot concentrated caustic over long exposure, and degraded by prolonged UV/outdoor exposure without a topcoat.

Sustainability4

Producing a kilogram of EPN Tough takes about 135 MJ of energy and emits 6.8 kg of CO₂ — more than 79% of polymer grades. Typical recycled content is 0%.

Embodied Energy (primary production)135 MJ/kg58,040 BTU/lb
Embodied Carbon (primary production)6.8 kg CO₂/kg
Embodied Water250 L/kg30 gal/lb
Typical Recycled Content0%

Manufacturability5

EPN Tough's machinability is good (55/100, worse than 64% of polymer grades).

MachinabilityGood55/100
PolishabilityVery good70/100
Mold Shrinkage1.2%
Processing Melt Temperature (typ.)100°C212 °F
Mold Temperature (typ.)165°C329 °F

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with EPN Tough

Is EPN easy to machine?

Machines like a hard brittle thermoset — sharp carbide or PCD tools, high speed, low feed, no coolant needed but strong dust extraction; chipping at exits and drill breakout must be controlled with backing.

Can EPN be welded?

Not weldable — thermoset; join by structural epoxy bonding, mechanical fasteners or co-cure of uncured plies.

Can EPN be formed, bent or molded?

Processed hot (resin softens 60–100 °C): casting, RTM/infusion, prepreg autoclave cure (180 °C typical) or transfer moulding at 165–185 °C with 60–180 s gel; a 180–200 °C post-cure is needed to reach full Tg, and high exotherm plus ~1–2 % cure shrinkage require thin sections or filler loading.

What surface finishes work on EPN?

Surfaces sand and polish well and take epoxy or PU paint after light abrasion; pigmented or UV-blocking topcoat is recommended outdoors because the aromatic backbone chalks and yellows.

EPN chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
epoxy phenol-novolac resin (phenol–formaEEW ≈ 170–185 g/eq, functionality 2.2–6; ECN variant EEW ≈ 195–22055 – 10065
curing agent (phenolic novolac / anhydristoichiometric to epoxy equivalents; determines Tg0 – 4534
accelerator (imidazole, TPP, tertiary am0.1 – 20.5
hydrolysable chlorine≤300 ppm for semiconductor-grade resin≤ 0.050.02
fused silica / mineral filler0 for the neat default variant; 70–88 wt% in EMC0 – 880
glass or carbon fibrereinforced variants only0 – 650

EPN Tough — frequently asked

What is EPN Tough used for?

EPN Tough is typically used for semiconductor encapsulation, high-temperature composite matrices, corrosion-resistant coatings and printed circuit board resin. In short: higher Tg than bisphenol-A epoxy; standard chip encapsulation resin; brittle at 2 % elongation.

What is the tensile strength of EPN Tough?

EPN Tough has a typical tensile strength of 60 MPa (8.7 ksi) — stronger than 68% of polymer grades. Strength varies by condition: see the 8 listed tempers.

Is EPN Tough easy to machine?

Reasonably — machinability is rated good (55/100, worse than 64% of polymer grades). Machines like a hard brittle thermoset — sharp carbide or PCD tools, high speed, low feed, no coolant needed but strong dust extraction; chipping at exits and drill breakout must be controlled with backing.

Can EPN Tough be welded?

Not weldable — thermoset; join by structural epoxy bonding, mechanical fasteners or co-cure of uncured plies.

What surface finishes work on EPN Tough?

Surfaces sand and polish well and take epoxy or PU paint after light abrasion; pigmented or UV-blocking topcoat is recommended outdoors because the aromatic backbone chalks and yellows.

Can EPN Tough be formed, bent or molded?

Processed hot (resin softens 60–100 °C): casting, RTM/infusion, prepreg autoclave cure (180 °C typical) or transfer moulding at 165–185 °C with 60–180 s gel; a 180–200 °C post-cure is needed to reach full Tg, and high exotherm plus ~1–2 % cure shrinkage require thin sections or filler loading.

What is the maximum service temperature of EPN Tough?

EPN Tough is rated for continuous use to about 155°C (311 °F), and briefly to 220°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Sources

  1. Epoxy phenol novolac resin (EPN-type) technical data — Huntsman Advanced Materials (2020)
  2. Novolac epoxy resins EPICLON N-770 / N-680 series — DIC Corporation (2022)
  3. Phenol/cresol novolac epoxy KD-211 / F-51 series — Kukdo Chemical / (2023)
  4. Engineered Materials Handbook Vol.3: Adhesives and Sealants / Vol.1 Composites — ASM International (1990)
  5. Epoxy Resins: Chemistry and Technology, 2nd ed. — Marcel Dekker (1988)
  6. GB/T 13657 Solid epoxy resin / GB/T 2567 Test methods for cast resin properties — SAC (2021)
  7. ISO 527 / ISO 178 / ISO 75 / IEC 60243 / UL 94 — ISO, IEC, UL (2019)
  8. Semiconductor epoxy molding compound (EMC) property tables — Sumitomo Bakelite / Hysol (2021)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.