DAIP SDI-30
Reinforced grade
ASTM D5948 Type SDI, D5948 Type GDI-30 · also MIL-M-14 Type GDI
SDI-30 = synthetic (acrylic/polyester) fiber filled DAIP
Use the synthetic-fiber filled grade for thin-wall insulators and high-frequency or high-voltage tracking duty: 1.58 g/cm³ density, low dielectric loss and good precision machining at 42 MPa.
Values for the SDI-30 condition
Other DAIP grades and fills
DAIP is listed in 5 conditions; see the grade overview at DAIP.
Compare all 5 grades and fillsHide
| Grade · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness |
|---|---|---|---|---|---|
Short synthetic-fiber / low-filler DAIP, fine-detail molding | Select the low-filler, short synthetic-fiber grade for thin-wall fine-detail insulators and multi-cavity precision transfer molding, where flow matters more than the 38 MPa strength. | — | 38 | 1.4 | 100 HRM |
Mineral/silica filled DAIP compound | Choose the mineral/silica-filled compound for low-cost encapsulation and switch insulation needing low CTE and arc resistance; impact strength is the lowest of the family. | — | 38 | 0.4 | 112 HRM |
SDI-30This page Synthetic (acrylic/polyester) fiber filled DAIP | Use the synthetic-fiber filled grade for thin-wall insulators and high-frequency or high-voltage tracking duty: 1.58 g/cm³ density, low dielectric loss and good precision machining at 42 MPa. | — | 42 | 0.9 | — |
Flame-retardant 30% glass-filled DAIP | Choose the flame-retardant 30% glass-filled version when thin-wall V-0, low smoke or strict fire certification governs; strength drops to 50 MPa and service temperature to 200 °C. | — | 50 | 0.5 | 105 HRM |
GDI-30Default 30% glass-fiber reinforced DAIP molding compound | Pick the 30% glass-fiber molding compound for military and aerospace connector insulators: highest stiffness, heat-deflection and 205 °C service for pin-loaded structures, at the cost of machinability. | — | 55 | 0.6 | — |
What is DAIP SDI-30?
DAIP SDI-30 is DAIP in the SDI-30 grade — use the synthetic-fiber filled grade for thin-wall insulators and high-frequency or high-voltage tracking duty: 1.58 g/cm³ density, low dielectric loss and good precision machining at 42 MPa. DAIP SDI-30 has a tensile strength of 42 MPa (6.09 ksi), weaker than 55% of polymer grades. Elongation at break is 0.9% and the elastic modulus is 6.5 GPa (0.943 Msi). DAIP SDI-30 has a density of 1.58 g/cm³ (0.0571 lb/in³), heavier than 92% of polymer grades. Its glass-transition temperature is 190°C (374 °F). GDI-30 is the default condition FabDigit quotes; SDI-30 is available on request or by drawing note.
Advantages
- Conducts heat well — 0.42 W/m·K (0.243 BTU/hr·ft·°F), better than 95% of polymer grades
- Stiff — 6.5 GPa (0.943 Msi), better than 90% of polymer grades
- High service temperature — 200°C (392 °F), better than 87% of polymer grades
- Good UV / weathering resistance — 70/100, better than 83% of polymer grades
Limitations
- Limited formability — 3/100, worse than 99% of polymer grades
- Limited ductility — 0.9%, worse than 98% of polymer grades
- Difficult to weld — 3/100, worse than 95% of polymer grades
- Heavy — 1.58 g/cm³ (0.0571 lb/in³), worse than 92% of polymer grades
DAIP SDI-30 properties
Typical room-temperature values for DAIP SDI-30; 15 are specific to this condition. Other listed values are DAIP reference data and may not represent this condition. Bars are the position among polymer grades.
Physical4
DAIP SDI-30 has a density of 1.58 g/cm³ (0.0571 lb/in³), heavier than 92% of polymer grades. Its glass-transition temperature is 190°C (374 °F).
Mechanical9
DAIP SDI-30 has a tensile strength of 42 MPa (6.09 ksi), weaker than 55% of polymer grades. Elongation at break is 0.9% and the elastic modulus is 6.5 GPa (0.943 Msi).
Thermal10
DAIP SDI-30 is rated for continuous service to 200°C (392 °F). It conducts heat at 0.42 W/m·K (0.243 BTU/hr·ft·°F), better than 95% of polymer grades. Thermal expansion is 45 µm/m·K (25 µin/in·°F).
Electrical7
DAIP SDI-30 is an electrical insulator with a dielectric strength of 16 kV/mm (406.4 V/mil) and a resistivity of 1×10¹³ Ω·m.
Chemical & Environmental3
Corrosion resistance is excellent (85/100), better than 65% of polymer grades. UV resistance is very good.
Sustainability4
Producing a kilogram of DAIP SDI-30 takes about 105 MJ of energy and emits 5.5 kg of CO₂ — more than 54% of polymer grades. Typical recycled content is 0%.
Manufacturability7
DAIP SDI-30's machinability is good (60/100, better than 51% of polymer grades); weldability not recommended (3/100); formability not recommended (3/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with DAIP SDI-30
Is DAIP easy to machine?
Cured parts can be turned, milled and drilled, but they are brittle and abrasive: use diamond or carbide tooling at high speed and low feed, and place a backing plate on the exit side to prevent chipping. Extract glass dust at source.
Can DAIP be welded?
Thermoset — no melt welding is possible. Use epoxy or cyanoacrylate bonding, or mechanical fastening.
Can DAIP be formed, bent or molded?
Mainly compression and transfer moulding, with thermoset screw injection also possible: material temperature 85–120 °C, mould temperature 150–180 °C, cure 45–180 s. Thick-walled parts need tool venting and a post-cure at 150–200 °C for several hours to stabilise dimensions and electrical properties.
What surface finishes work on DAIP?
Deflash with cryogenic dry ice or media blasting. The surface can be painted or selectively metallised; plasma or chemical roughening is required before plating deep holes. Mirror polishing is neither needed nor practical.
DAIP chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| diallyl isophthalate prepolymer + monomediallyl isophthalate prepolymer/monomer matrix | 25 – 45 | 35 |
| glass fiberchopped glass fiber (GDI-30) | 25 – 35 | 30 |
| organic peroxide initiator (e.g. dicumylcure initiator | 0.3 – 2 | 1 |
| mold release / lubricant (metal stearate | 0.3 – 1.5 | 0.8 |
| pigment / colorantblue/black identification colors common in military parts | 0 – 2 | 1 |
| mineral filler (silica / clay / CaCO3)balance of filler; sets CTE and electrical properties | ≥ 20 (balance) | — |
DAIP SDI-30 — frequently asked
What is DAIP SDI-30 used for?
DAIP SDI-30 is typically used for mil-spec connectors, high-reliability electrical housings and aerospace terminal blocks. In short: 205 °C allyl thermoset; mil-spec connector material; higher-temperature DAP alternative.
What is the tensile strength of DAIP SDI-30?
DAIP SDI-30 has a typical tensile strength of 42 MPa (6.09 ksi) — weaker than 55% of polymer grades. Strength varies by condition: see the 5 listed tempers.
Is DAIP SDI-30 easy to machine?
Reasonably — machinability is rated good (60/100, better than 51% of polymer grades). Cured parts can be turned, milled and drilled, but they are brittle and abrasive: use diamond or carbide tooling at high speed and low feed, and place a backing plate on the exit side to prevent chipping. Extract glass dust at source.
Can DAIP SDI-30 be welded?
Not readily — weldability is rated not recommended (3/100). Thermoset — no melt welding is possible. Use epoxy or cyanoacrylate bonding, or mechanical fastening.
What surface finishes work on DAIP SDI-30?
Deflash with cryogenic dry ice or media blasting. The surface can be painted or selectively metallised; plasma or chemical roughening is required before plating deep holes. Mirror polishing is neither needed nor practical.
Can DAIP SDI-30 be formed, bent or molded?
Mainly compression and transfer moulding, with thermoset screw injection also possible: material temperature 85–120 °C, mould temperature 150–180 °C, cure 45–180 s. Thick-walled parts need tool venting and a post-cure at 150–200 °C for several hours to stabilise dimensions and electrical properties.
What is the maximum service temperature of DAIP SDI-30?
DAIP SDI-30 is rated for continuous use to about 200°C (392 °F), and briefly to 260°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
Sources
- ASTM D5948 — Standard Specification for Molding Compounds, Thermosetting — ASTM International (2019)
- MIL-M-14H — Molding Plastics and Molded Plastic Parts, Thermosetting — US DoD (1989)
- ASTM D638 / D790 / D256 / D648 / D150 / D257 / D570 test methods — ASTM International (2022)
- Engineered Materials Handbook Vol.2 — Engineering Plastics (allyl resins) — ASM International (1988)
- DAISO ISODAP / DAP resin technical data — Osaka Soda (2022)
- Diallyl phthalate & diallyl isophthalate molding compound datasheets — Cosmic Plastics / Glenro / DAP (2023)
- DAP/DAIP (2025)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.