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Copper Alloy C50100-H08

Supply condition

UNS C50100

H08 = spring hard

Spring-temper strip for contact springs needing high elastic limit and good conductivity.

High cost $$$$

Values for the H08 condition

Other C50100 tempers and conditions

C50100 is listed in 9 conditions; see the grade overview at C50100.

Compare all 9 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed
Choose for deep drawing, severe bending or maximum electrical conductivity before forming.952554555 HB52 % IACS
Quarter hard
Light cold work when moderate strength must be combined with substantial bending ductility.2403002585 HB51 % IACS
Half hard
General-purpose stamping temper balancing strength and formability for terminals and clips.29034515100 HB50 % IACS
H04Default
Full hard
Most commonly stocked strip temper for contacts, connectors and light spring parts.3503908115 HB50 % IACS
Stress-relieved / thermally stabilised hard strip
Low-temperature bake after cold rolling to raise elastic limit and cut stress relaxation in contact springs.3754008120 HB53 % IACS
Extra hard
Higher strength for flat springs where only gentle bends (large radii) are required.3854205125 HB49 % IACS
Hard drawn
Cold-drawn wire condition for conductor wire, pins and coiled springs.4104505135 HB49 % IACS
H08This page
Spring hard
Spring-temper strip for contact springs needing high elastic limit and good conductivity.4154504135 HB49 % IACS
Extra spring hard
Maximum cold-rolled strength for flat springs with essentially no forming after rolling.4404703142 HB48 % IACS

What is C50100-H08?

C50100-H08 is C50100 supplied in the H08 condition — spring-temper strip for contact springs needing high elastic limit and good conductivity. C50100-H08 has a yield strength of 415 MPa (60.2 ksi) and a tensile strength of 450 MPa (65.3 ksi) — stronger than 82% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 117 GPa (17 Msi). C50100-H08 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,050°C (1,922 °F). H04 is the default condition FabDigit quotes; H08 is available on request or by drawing note.

Advantages

  • High strength — 415 MPa (60.2 ksi), better than 82% of copper alloy grades
  • Conducts heat well — 208 W/m·K (120.2 BTU/hr·ft·°F), better than 79% of copper alloy grades
  • High electrical conductivity — 49 % IACS, better than 79% of copper alloy grades

Limitations

  • Limited ductility — 4%, worse than 96% of copper alloy grades
  • Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades

C50100-H08 properties

Typical room-temperature values for C50100-H08; 18 are specific to this condition. Other listed values are C50100 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C50100-H08 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,050°C (1,922 °F).

Density8.89 g/cm³0.32 lb/in³
Melting Point (Solidus)1,050°C1,922 °F
Liquidus Temperature1,075°C1,967 °F

Mechanical11

C50100-H08 has a yield strength of 415 MPa (60.2 ksi) and a tensile strength of 450 MPa (65.3 ksi) — stronger than 82% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus130 GPa18.9 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)450 MPa65.3 ksi
Yield Strength (0.2% offset)415 MPa60.2 ksi
Elongation at Break4%
Shear Strength265 MPa38.4 ksi
Fatigue Strength (Endurance Limit)180 MPa26.1 ksi
Hardness, Brinell135 HB
Hardness, Rockwell B85 HRB

Thermal6

C50100-H08 is rated for continuous service to 150°C (302 °F). It conducts heat at 208 W/m·K (120.2 BTU/hr·ft·°F), better than 79% of copper alloy grades. Thermal expansion is 17.8 µm/m·K (9.89 µin/in·°F).

Thermal Conductivity208 W/m·K120 BTU/hr·ft·°F
Specific Heat Capacity377 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.8 µm/m·K9.9 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)150°C302 °F
Min Service Temperature-200°C-328 °F

Electrical3

C50100-H08 conducts electricity at 49 % IACS, better than 79% of copper alloy grades.

Electrical Conductivity49 % IACS
Electrical Resistivity3.52×10⁻⁸ Ω·m1.39 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (66/100), better than 64% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.26 V
Corrosion ResistanceGood66/100
Chemical Resistance SummaryGood in fresh water, humid/industrial air, mild organic media and non-oxidizing acids; attacked by ammonia/amines (stress-corrosion risk), oxidizing acids, sulfides and strongly oxidizing salts.

Sustainability4

Producing a kilogram of C50100-H08 takes about 57 MJ of energy and emits 3.6 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 40%.

Embodied Energy (primary production)57 MJ/kg24,506 BTU/lb
Embodied Carbon (primary production)3.6 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content40%

Manufacturability7

C50100-H08's machinability is poor (34/100, worse than 53% of copper alloy grades); weldability fair (50/100); formability fair (45/100).

MachinabilityPoor34/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityFair50/100
Formability (cold)Fair45/100
Brazeability / SolderabilityExcellent95/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper alloy; use tin, silver, nickel or gold plating instead of anodizing

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C50100-H08

Is C50100 easy to machine?

Gummy and low-rated (~20 % of AISI 1212): use sharp positive-rake tools, high speed, light feeds and good lubrication; not a free-machining alloy.

Can C50100 be welded?

Resistance and gas-shielded arc welding are acceptable with matched or CuSn filler; oxyfuel welding is poor — avoid overheating to prevent P loss and porosity.

Can C50100 be formed, bent or molded?

Excellent cold formability in O61/H01; work-hardens quickly, so interstage anneals near 480–650 °C are used for deep-drawn or severely bent parts.

What surface finishes work on C50100?

Solders and brazes very well; commonly tin-, nickel-, silver- or gold-plated for contacts; takes a bright mechanical polish but tarnishes without plating or lacquer.

C50100 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Snlow-tin phosphor bronze; some references quote up to ~1.25 % Sn for this family0.5 – 0.80.65
Pdeoxidiser / solid-solution strengthener0.01 – 0.050.03
Fe≤ 0.05—
Zn≤ 0.3—
Pb≤ 0.05—
Curemainder, Cu + named elements ≥ 99.5 %balance—

C50100-H08 — frequently asked

What is C50100-H08 used for?

C50100-H08 is typically used for electrical connectors, spring contacts and terminals. In short: highest-conductivity phosphor bronze; conductive spring contact strip; poor machinability.

What is the yield strength of C50100-H08?

C50100-H08 has a typical yield strength of 415 MPa (60.2 ksi) and a tensile strength of 450 MPa (65.3 ksi) — stronger than 82% of copper alloy grades. Strength varies by condition: see the 9 listed tempers.

Is C50100-H08 easy to machine?

Not especially — machinability is rated poor (34/100, worse than 53% of copper alloy grades). Gummy and low-rated (~20 % of AISI 1212): use sharp positive-rake tools, high speed, light feeds and good lubrication; not a free-machining alloy.

Can C50100-H08 be welded?

With care — weldability is rated fair (50/100). Resistance and gas-shielded arc welding are acceptable with matched or CuSn filler; oxyfuel welding is poor — avoid overheating to prevent P loss and porosity.

What surface finishes work on C50100-H08?

Solders and brazes very well; commonly tin-, nickel-, silver- or gold-plated for contacts; takes a bright mechanical polish but tarnishes without plating or lacquer.

Can C50100-H08 be formed, bent or molded?

Excellent cold formability in O61/H01; work-hardens quickly, so interstage anneals near 480–650 °C are used for deep-drawn or severely bent parts.

What is the maximum service temperature of C50100-H08?

C50100-H08 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C50100-H04 and C50100-O61?

H04 is the default condition — most commonly stocked strip temper for contacts, connectors and light spring parts. O61: choose for deep drawing, severe bending or maximum electrical conductivity before forming. Yield strength is 350 MPa in H04 versus 95 MPa in O61.

Sources

  1. CDA/UNS Alloy Data Sheet C50100 (phosphor bronze) — Copper Development Association (2023)
  2. ASTM B103/B103M — Phosphor Bronze Plate, Sheet, Strip and Rolled Bar — ASTM International (2019)
  3. ASTM B105 — Hard-Drawn Copper Alloy Wires for Electric Conductors — ASTM International (2018)
  4. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  5. GB/T 2059 / GB/T 2040 / (2017)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.