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PUR/PIR Board vs Rebond Foam

Polymer · grade comparison

PUR/PIR Board and Rebond Foam are both polymer grades. PUR/PIR Board is the stronger of the two: tensile strength 0.28 MPa (0.0406 ksi) against 0.15 MPa (0.0218 ksi) for Rebond Foam, about 87% more. In exchange, Rebond Foam is the more ductile: elongation 60% versus 8% for PUR/PIR Board. PUR/PIR Board is lighter (0.03 g/cm³ vs 0.08 g/cm³ for Rebond Foam) and PUR/PIR Board is stiffer (0.01 GPa vs 8×10⁻⁴ GPa). On the shop floor, PUR/PIR Board machines more easily (excellent vs very good), Rebond Foam welds better (poor vs not recommended), and Rebond Foam sits in a lower cost tier (standard, $$) than PUR/PIR Board (premium, $$$).

PUR/PIR BoardChoose it when strength drives the design, or when weight is the constraint.

Rebond FoamChoose it when the part is bent, formed or impact-loaded, or when it will be welded.

PUR/PIR Board vs Rebond Foam: properties

PUR/PIR BoardRebond Foam

Mechanical

Strength, stiffness, ductility and hardness at room temperature.

Elastic (Young's) Modulus

0.01 GPa7.25×10⁻⁴ Msi
8×10⁻⁴ GPa1.16×10⁻⁴ Msi

Shear Modulus

0 GPa3.63×10⁻⁴ Msi
—

Tensile Strength (Ultimate)

0.28 MPa0.04 ksi
0.15 MPa0.02 ksi

Elongation at Break

8%
60%

Compressive Strength

0.16 MPa0.02 ksi
0.03 MPa0 ksi

Compressive Modulus

0.01 GPa8.7×10⁻⁴ Msi
6×10⁻⁴ GPa8.7×10⁻⁵ Msi

Flexural Strength

0.33 MPa0.05 ksi
—

Flexural Modulus

0.01 GPa8.7×10⁻⁴ Msi
—

Shear Strength

0.16 MPa0.02 ksi
0.08 MPa0.01 ksi

Compression Set (22 h, 70 °C)

3%
10%

Yield Strength (0.2% offset)

—
0.02 MPa0 ksi

Hardness, Shore A

—
12 Shore A

Tear Strength

—
0.4 kN/m2.3 lbf/in

Same in both: Poisson's Ratio 0.3

Physical

Density and transition temperatures.

Density

0.03 g/cm³0 lb/in³
0.08 g/cm³0 lb/in³

Glass Transition (Tg)

110°C230 °F
-50°C-58 °F

Water Absorption (24 h)

2%
—

Water Absorption (Saturation)

5%
—

Thermal

How each material carries heat and how hot it can run.

Thermal Conductivity

0.02 W/m·K0.01 BTU/hr·ft·°F
0.05 W/m·K0.03 BTU/hr·ft·°F

Specific Heat Capacity

1,450 J/kg·K0.35 BTU/lb·°F
1,500 J/kg·K0.36 BTU/lb·°F

Thermal Expansion (CTE, 20–100 °C)

60 µm/m·K33.3 µin/in·°F
—

Max Service Temperature (continuous)

100°C212 °F
90°C194 °F

Min Service Temperature

-180°C-292 °F
-30°C-22 °F

Limiting Oxygen Index

22%
19%

Same in both: Max Service Temperature (short-term) 120°C248 °F

Electrical

Conductivity and insulation.

Electrical Resistivity

1×10¹¹ Ω·m3.94×10¹⁸ µΩ·in
1×10¹⁰ Ω·m3.94×10¹⁷ µΩ·in

Dielectric Constant (1 MHz)

1.08
—

Volume Resistivity

1×10¹³ Ω·cm
1×10¹² Ω·cm

Chemical & Environmental

Corrosion and environmental resistance (0–100 scores).

Corrosion Resistance

80 / 100
55 / 100

Same in both: UV / Weathering Resistance 20 / 100

Manufacturability

FabDigit workshop ratings (0–100 scores) — how each material behaves on the machine.

Machinability

95 / 100
80 / 100

Weldability

5 / 100
15 / 100

Formability (cold)

10 / 100
85 / 100

Sustainability

Primary-production footprint per kilogram.

Embodied Energy (primary production)

105 MJ/kg45,142 BTU/lb
20 MJ/kg8,598 BTU/lb

Embodied Carbon (primary production)

5 kg CO₂/kg
1.3 kg CO₂/kg

Embodied Water

200 L/kg24 gal/lb
—

Typical Recycled Content

5%
90%

Common Calculations

Ratios derived from the values above.

Specific Strength (UTS / density)

9 kN·m/kg
2 kN·m/kg

Specific Stiffness (E / density)

0.2 MN·m/kg
0 MN·m/kg

Thermal Diffusivity

0.5 mm²/s
0.4 mm²/s

Strength versus weight

Yield strength against density for every polymer grade in the FabDigit library; the compared grades are highlighted. Up and left is stronger for its weight.

0.1110100123Density (g/cm³)Yield strength (MPa) — log scaleRebond Foam

Manufacturing and finishing

CapabilityPUR/PIR BoardRebond Foam
Default condition——
Relative cost$$$ Premium$$ Standard
Min. machined wall——
Best machined surface——

PUR/PIR Board vs Rebond Foam — frequently asked

Is PUR/PIR Board stronger than Rebond Foam?

Yes. PUR/PIR Board has a typical tensile strength of 0.28 MPa (0.0406 ksi) against 0.15 MPa (0.0218 ksi) for Rebond Foam — about 87% more.

Which is cheaper, PUR/PIR Board or Rebond Foam?

Rebond Foam is the lower-cost material: it sits in the standard tier ($$) while PUR/PIR Board is premium ($$$). Part price depends far more on geometry, tolerance and quantity than on raw stock — upload a CAD file for a live quote.

Which is easier to machine, PUR/PIR Board or Rebond Foam?

PUR/PIR Board. Its machinability rates excellent (95/100) against very good (80/100) for Rebond Foam; for welding the order is Rebond Foam first (poor, 15/100) then PUR/PIR Board (not recommended, 5/100).

Ready to make it?

Upload a CAD file and FabDigit prices the part in PUR/PIR Board and Rebond Foam side by side — material, machining time, tolerance and finish in one quote. Certified material data ships with the order on request.

Typical handbook values for the conditions named above, normalised for comparison. Hardness on non-Brinell scales is converted approximately for charting only. Request certified data with your order for design-critical properties.