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Copper Alloy C50500-O60

Temper

UNS C50500 · ASTM B103

O60 = soft annealed

Choose for deep drawing, severe forming or when maximum ductility and conductivity are needed.

High cost $$$$

Values for the O60 condition

Other C50500 tempers and conditions

C50500 is listed in 8 conditions; see the grade overview at C50500.

Compare all 8 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
O60This page
Soft annealed
Choose for deep drawing, severe forming or when maximum ductility and conductivity are needed.972764860 HB50 % IACS
Quarter hard
Choose when moderate forming is still required but annealed strength is insufficient.2403102580 HB48 % IACS
Half hard
General-purpose stamping temper balancing bend formability and spring strength.2903451295 HB48 % IACS
Half hard, stress-relieved
Choose when improved bend performance and stress-relaxation resistance are needed at half-hard strength.31036014100 HB50 % IACS
H04Default
Full hard
Most commonly stocked strip temper for connectors, contacts and light springs.3453806110 HB48 % IACS
Extra hard
Choose for flat springs and contacts needing higher yield with minimal forming.3804154125 HB47 % IACS
Spring hard
Spring temper for flat springs, washers and contact fingers with good relaxation resistance.4154503135 HB47 % IACS
Extra spring hard
Maximum cold-worked strength for flat spring stock; almost no bendability across grain.4354703140 HB47 % IACS

What is C50500-O60?

C50500-O60 is C50500 in the O60 temper — choose for deep drawing, severe forming or when maximum ductility and conductivity are needed. C50500-O60 has a yield strength of 97 MPa (14.1 ksi) and a tensile strength of 276 MPa (40 ksi) — weaker than 87% of copper alloy grades. Elongation at break is 48% and the elastic modulus is 117 GPa (17 Msi). C50500-O60 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,035°C (1,895 °F). H04 is the default condition FabDigit quotes; O60 is available on request or by drawing note.

Advantages

  • Ductile — tolerates forming and impact — 48%, better than 97% of copper alloy grades
  • Forms and bends easily — 95/100, better than 94% of copper alloy grades
  • Conducts heat well — 215 W/m·K (124.2 BTU/hr·ft·°F), better than 80% of copper alloy grades
  • High electrical conductivity — 50 % IACS, better than 79% of copper alloy grades

Limitations

  • Low strength — 97 MPa (14.1 ksi), worse than 87% of copper alloy grades
  • Difficult to machine — 25/100, worse than 86% of copper alloy grades

C50500-O60 properties

Typical room-temperature values for C50500-O60; 13 are specific to this condition. Other listed values are C50500 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C50500-O60 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,035°C (1,895 °F).

Density8.89 g/cm³0.32 lb/in³
Melting Point (Solidus)1,035°C1,895 °F
Liquidus Temperature1,060°C1,940 °F

Mechanical12

C50500-O60 has a yield strength of 97 MPa (14.1 ksi) and a tensile strength of 276 MPa (40 ksi) — weaker than 87% of copper alloy grades. Elongation at break is 48% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus124 GPa18 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)276 MPa40 ksi
Yield Strength (0.2% offset)97 MPa14.1 ksi
Elongation at Break48%
Shear Strength195 MPa28.3 ksi
Fatigue Strength (Endurance Limit)125 MPa18.1 ksi
Hardness, Brinell60 HB
Hardness, Rockwell B28 HRB
Hardness, Vickers65 HV

Thermal6

C50500-O60 is rated for continuous service to 250°C (482 °F). It conducts heat at 215 W/m·K (124.2 BTU/hr·ft·°F), better than 80% of copper alloy grades. Thermal expansion is 17.8 µm/m·K (9.89 µin/in·°F).

Thermal Conductivity215 W/m·K124 BTU/hr·ft·°F
Specific Heat Capacity377 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.8 µm/m·K9.9 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)250°C482 °F
Min Service Temperature-200°C-328 °F

Electrical3

C50500-O60 conducts electricity at 50 % IACS, better than 79% of copper alloy grades.

Electrical Conductivity50 % IACS
Electrical Resistivity3.59×10⁻⁸ Ω·m1.41 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (65/100), better than 58% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.25 V
Corrosion ResistanceGood65/100
Chemical Resistance SummaryGood resistance to atmospheric corrosion, fresh and salt water, and non-oxidizing acids; attacked by ammonia/amines (stress-corrosion risk when cold worked), nitric acid, ferric and mercury salts, and sulphides.

Sustainability4

Producing a kilogram of C50500-O60 takes about 57 MJ of energy and emits 3.7 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 40%.

Embodied Energy (primary production)57 MJ/kg24,506 BTU/lb
Embodied Carbon (primary production)3.7 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content40%

Manufacturability8

C50500-O60's machinability is poor (25/100, worse than 86% of copper alloy grades); weldability good (55/100); formability excellent (95/100).

MachinabilityPoor25/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityGood55/100
Formability (cold)Excellent95/100
CastabilityPoor30/100
Brazeability / SolderabilityExcellent90/100
PolishabilityVery good75/100
Anodizing Responsen/a — copper alloy; use tin, nickel, silver or gold electroplating instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C50500-O60

Is C50500 easy to machine?

Gummy and low rated (~20% of free-cutting brass); use sharp positive-rake tools, high speed, light feed and generous coolant, or specify a leaded grade for screw-machine work.

Can C50500 be welded?

GTAW/GMAW with phosphor-bronze filler is workable; resistance welding is poor due to high conductivity, and soldering/brazing is the preferred joining route.

Can C50500 be formed, bent or molded?

Excellent cold formability in O60/H01; H04 and harder tempers need generous bend radii and preferably bending with the grain, with interstage annealing near 480–650 °C.

What surface finishes work on C50500?

Not anodizable; takes tin, nickel, silver and gold plating readily and polishes to a bright bronze finish — passivate or lacquer to limit tarnish.

C50500 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Sn1 – 1.71.3
Pdeoxidizer, adds strength0.03 – 0.350.2
Fe≤ 0.05—
Pb≤ 0.05—
Zn≤ 0.3—
CuCu + Ag, remainder≥ 98.7 (balance)—

C50500-O60 — frequently asked

What is C50500-O60 used for?

C50500-O60 is typically used for electrical connectors, springs, washers and cable shielding. In short: highest-conductivity phosphor bronze; 48 % IACS spring alloy; good cold formability.

What is the yield strength of C50500-O60?

C50500-O60 has a typical yield strength of 97 MPa (14.1 ksi) and a tensile strength of 276 MPa (40 ksi) — weaker than 87% of copper alloy grades. Strength varies by condition: see the 8 listed tempers.

Is C50500-O60 easy to machine?

Not especially — machinability is rated poor (25/100, worse than 86% of copper alloy grades). Gummy and low rated (~20% of free-cutting brass); use sharp positive-rake tools, high speed, light feed and generous coolant, or specify a leaded grade for screw-machine work.

Can C50500-O60 be welded?

Yes — weldability is rated good (55/100). GTAW/GMAW with phosphor-bronze filler is workable; resistance welding is poor due to high conductivity, and soldering/brazing is the preferred joining route.

What surface finishes work on C50500-O60?

Not anodizable; takes tin, nickel, silver and gold plating readily and polishes to a bright bronze finish — passivate or lacquer to limit tarnish.

Can C50500-O60 be formed, bent or molded?

Excellent cold formability in O60/H01; H04 and harder tempers need generous bend radii and preferably bending with the grain, with interstage annealing near 480–650 °C.

What is the maximum service temperature of C50500-O60?

C50500-O60 is rated for continuous use to about 250°C (482 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C50500-H04 and C50500-O60?

H04 is the default condition — most commonly stocked strip temper for connectors, contacts and light springs. O60: choose for deep drawing, severe forming or when maximum ductility and conductivity are needed. Yield strength is 345 MPa in H04 versus 97 MPa in O60.

Sources

  1. ASTM B103/B103M — Phosphor Bronze Plate, Sheet, Strip and Rolled Bar — ASTM International (2019)
  2. CDA Alloy Datasheet C50500 — Copper Development Association (2023)
  3. ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  4. GB/T 2059 / GB/T 2049 (QSn1.5-0.2) — SAC (2017)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.