Copper Alloy Cu-HCP-H01 vs Cu-HCP-H08
Copper Alloy · Cu-HCP temper comparison
Cu-HCP-H01 and Cu-HCP-H08 are two conditions of the same copper alloy grade, Cu-HCP: H01 (quarter hard) versus H08 (spring hard). The chemistry is identical, so every difference below comes from the condition. Cu-HCP-H08 is the stronger of the two: yield strength 350 MPa (50.8 ksi) against 195 MPa (28.3 ksi) for Cu-HCP-H01, about 79% more; tensile strength follows at 380 MPa (55.1 ksi) vs 260 MPa (37.7 ksi). In exchange, Cu-HCP-H01 is the more ductile: elongation 25% versus 4% for Cu-HCP-H08, and Cu-HCP-H08 is harder (100 HB vs 60 HB). Cu-HCP-H08 is stiffer (127 GPa vs 120 GPa) and Cu-HCP-H01 runs hotter in service (150°C vs 120°C continuous). On the shop floor, Cu-HCP-H01 welds better (very good vs good).
Cu-HCP-H01Choose it when the part is bent, formed or impact-loaded, or when the part sees heat.
Cu-HCP-H08Choose it when strength drives the design.
Cu-HCP-H01 vs Cu-HCP-H08: propertiesHow to read these bars
- One bar per material. A full bar is the highest value among all copper alloy grades in the FabDigit library; each bar is drawn as a share of that.
- The better value (by the usual engineering direction) is in bold. Rows with no direction — density, thermal conductivity — have no bold.
- Values are typical room-temperature figures for the condition named on each card.
- Confirm against the certified mill or resin datasheet before design release.
How to read these bars
- One bar per material. A full bar is the highest value among all copper alloy grades in the FabDigit library; each bar is drawn as a share of that.
- The better value (by the usual engineering direction) is in bold. Rows with no direction — density, thermal conductivity — have no bold.
- Values are typical room-temperature figures for the condition named on each card.
- Confirm against the certified mill or resin datasheet before design release.
Mechanical
Strength, stiffness, ductility and hardness at room temperature.
Elastic (Young's) Modulus
Tensile Strength (Ultimate)
Yield Strength (0.2% offset)
Elongation at Break
Shear Strength
Fatigue Strength (Endurance Limit)
Hardness, Brinell
Hardness, Vickers
Same in both: Shear Modulus 44 GPa6.4 Msi · Bulk Modulus 140 GPa20.3 Msi · Poisson's Ratio 0.34
Physical
Density and transition temperatures.
Same in both: Density 8.94 g/cm³0.32 lb/in³ · Melting Point (Solidus) 1,065°C1,949 °F · Liquidus Temperature 1,083°C1,981 °F
Thermal
How each material carries heat and how hot it can run.
Thermal Conductivity
Max Service Temperature (continuous)
Same in both: Specific Heat Capacity 385 J/kg·K0.09 BTU/lb·°F · Thermal Expansion (CTE, 20–100 °C) 17.6 µm/m·K9.8 µin/in·°F · Latent Heat of Fusion 205 J/g88.1 BTU/lb · Min Service Temperature -200°C-328 °F
Electrical
Conductivity and insulation.
Electrical Conductivity
Electrical Resistivity
Chemical & Environmental
Corrosion and environmental resistance (0–100 scores).
Same in both: Galvanic Potential (seawater, vs SCE) -0.2 V · Corrosion Resistance 65 / 100
Manufacturability
FabDigit workshop ratings (0–100 scores) — how each material behaves on the machine.
Machinability
Weldability
Formability (cold)
Same in both: Machinability Rating (AISI 1212 = 100 %) 20% · Castability 55 / 100 · Brazeability / Solderability 95 / 100 · Polishability 80 / 100
Sustainability
Primary-production footprint per kilogram.
Same in both: Embodied Energy (primary production) 55 MJ/kg23,646 BTU/lb · Embodied Carbon (primary production) 3.6 kg CO₂/kg · Embodied Water 300 L/kg35.9 gal/lb · Typical Recycled Content 30%
Strength versus weight
Yield strength against density for every copper alloy grade in the FabDigit library; the compared grades are highlighted. Up and left is stronger for its weight.
Cu-HCP-H01 vs Cu-HCP-H08 — frequently asked
Is Cu-HCP-H08 stronger than Cu-HCP-H01?
Yes. Cu-HCP-H08 has a typical yield strength of 350 MPa (50.8 ksi) against 195 MPa (28.3 ksi) for Cu-HCP-H01 — about 79% more. Tensile strength is 380 MPa (55.1 ksi) vs 260 MPa (37.7 ksi).
Which condition does FabDigit quote by default, H01 or H08?
O60 is the default Cu-HCP condition in the FabDigit quote flow (neither H01 nor H08). The other condition is available on request or by drawing note — specify it in the material field or the part notes and the quote is priced for it.
Which is easier to machine, Cu-HCP-H01 or Cu-HCP-H08?
Cu-HCP-H08, by a small margin. Both rate poor for machinability — 30/100 against 25/100 for Cu-HCP-H01; for welding the order is Cu-HCP-H01 first (very good, 72/100) then Cu-HCP-H08 (good, 60/100).
Ready to make it?
Upload a CAD file and FabDigit prices the part in Cu-HCP-H01 and Cu-HCP-H08 side by side — material, machining time, tolerance and finish in one quote. Certified material data ships with the order on request.
Typical handbook values for the conditions named above, normalised for comparison. Hardness on non-Brinell scales is converted approximately for charting only. Request certified data with your order for design-critical properties.
