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Copper Alloy C82200 vs Cu-ETP1

Copper Alloy · grade comparison

Copper Alloy C82200 and Cu-ETP1 are both copper alloy grades. C82200 is the stronger of the two: yield strength 415 MPa (60.2 ksi) against 70 MPa (10.2 ksi) for Cu-ETP1, about 5.9 times as much; tensile strength follows at 620 MPa (89.9 ksi) vs 220 MPa (31.9 ksi). In exchange, Cu-ETP1 is the more ductile: elongation 40% versus 5% for C82200, and C82200 is harder (195 HB vs 45 HB). C82200 is stiffer (130 GPa vs 117 GPa) and C82200 runs hotter in service (300°C vs 200°C continuous).

C82200Choose it when strength drives the design, or when the part sees heat.

Cu-ETP1Choose it when the part is bent, formed or impact-loaded.

C82200 vs Cu-ETP1: properties

C82200Cu-ETP1

Mechanical

Strength, stiffness, ductility and hardness at room temperature.

Elastic (Young's) Modulus

130 GPa18.9 Msi
117 GPa17 Msi

Shear Modulus

50 GPa7.3 Msi
44 GPa6.4 Msi

Bulk Modulus

115 GPa16.7 Msi
140 GPa20.3 Msi

Poisson's Ratio

0.3
0.34

Tensile Strength (Ultimate)

620 MPa89.9 ksi
220 MPa31.9 ksi

Yield Strength (0.2% offset)

415 MPa60.2 ksi
70 MPa10.2 ksi

Elongation at Break

5%
40%

Shear Strength

400 MPa58 ksi
150 MPa21.8 ksi

Fatigue Strength (Endurance Limit)

180 MPa26.1 ksi
75 MPa10.9 ksi

Charpy V-Notch Impact (RT)

14 J10.3 ft·lbf
60 J44.3 ft·lbf

Hardness, Brinell

195 HB
45 HB

Hardness, Rockwell B

93 HRB
—

Hardness, Vickers

205 HV
50 HV

Reduction in Area

—
70%

Physical

Density and transition temperatures.

Density

8.75 g/cm³0.32 lb/in³
8.93 g/cm³0.32 lb/in³

Melting Point (Solidus)

1,030°C1,886 °F
1,065°C1,949 °F

Liquidus Temperature

1,090°C1,994 °F
1,083°C1,981 °F

Thermal

How each material carries heat and how hot it can run.

Thermal Conductivity

190 W/m·K110 BTU/hr·ft·°F
394 W/m·K228 BTU/hr·ft·°F

Specific Heat Capacity

420 J/kg·K0.1 BTU/lb·°F
385 J/kg·K0.09 BTU/lb·°F

Thermal Expansion (CTE, 20–100 °C)

17.8 µm/m·K9.9 µin/in·°F
17 µm/m·K9.4 µin/in·°F

Max Service Temperature (continuous)

300°C572 °F
200°C392 °F

Min Service Temperature

-200°C-328 °F
-250°C-418 °F

Same in both: Latent Heat of Fusion 205 J/g88.1 BTU/lb

Electrical

Conductivity and insulation.

Electrical Conductivity

45 % IACS
101.5 % IACS

Electrical Resistivity

3.83×10⁻⁸ Ω·m1.51 µΩ·in
1.7×10⁻⁸ Ω·m0.669 µΩ·in

Chemical & Environmental

Corrosion and environmental resistance (0–100 scores).

Corrosion Resistance

62 / 100
65 / 100

Same in both: Galvanic Potential (seawater, vs SCE) -0.25 V

Manufacturability

FabDigit workshop ratings (0–100 scores) — how each material behaves on the machine.

Formability (cold)

15 / 100
95 / 100

Castability

78 / 100
45 / 100

Brazeability / Solderability

65 / 100
85 / 100

Polishability

70 / 100
80 / 100

Same in both: Machinability 30 / 100 · Machinability Rating (AISI 1212 = 100 %) 20% · Weldability 50 / 100

Sustainability

Primary-production footprint per kilogram.

Embodied Energy (primary production)

85 MJ/kg36,543 BTU/lb
53 MJ/kg22,786 BTU/lb

Embodied Carbon (primary production)

6 kg CO₂/kg
3.6 kg CO₂/kg

Typical Recycled Content

30%
10%

Same in both: Embodied Water 350 L/kg41.9 gal/lb

Common Calculations

Ratios derived from the values above.

Specific Strength (UTS / density)

71 kN·m/kg
25 kN·m/kg

Specific Stiffness (E / density)

14.9 MN·m/kg
13.1 MN·m/kg

Modulus of Resilience

662 kJ/m³
21 kJ/m³

Thermal Diffusivity

51.7 mm²/s
114.6 mm²/s

Thermal Shock Resistance Index

51
44

Strength versus weight

Yield strength against density for every copper alloy grade in the FabDigit library; the compared grades are highlighted. Up and left is stronger for its weight.

501002005001,0007.588.599.5Density (g/cm³)Yield strength (MPa) — log scaleCu-ETP1C82200

Manufacturing and finishing

CapabilityC82200Cu-ETP1
Default condition——
Relative cost$$$$ High$$$$ High
Min. machined wall——
Best machined surface——

Both take the same 4 finishes: Copper Plating, Electroless Nickel (EN), Gold Plating, Silver Plating.

C82200 vs Cu-ETP1 — frequently asked

Is C82200 stronger than Cu-ETP1?

Yes. C82200 has a typical yield strength of 415 MPa (60.2 ksi) against 70 MPa (10.2 ksi) for Cu-ETP1 — about 5.9 times as much. Tensile strength is 620 MPa (89.9 ksi) vs 220 MPa (31.9 ksi).

Which is cheaper, C82200 or Cu-ETP1?

Both sit in the same relative cost tier ($$$$, high); the part price will be decided by machining time, tolerance and quantity rather than by the material.

When should I choose C82200 over Cu-ETP1?

Pick C82200 when strength drives the design, or when the part sees heat. Pick Cu-ETP1 when the part is bent, formed or impact-loaded.

Ready to make it?

Upload a CAD file and FabDigit prices the part in C82200 and Cu-ETP1 side by side — material, machining time, tolerance and finish in one quote. Certified material data ships with the order on request.

Typical handbook values for the conditions named above, normalised for comparison. Hardness on non-Brinell scales is converted approximately for charting only. Request certified data with your order for design-critical properties.