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Copper Alloy C81500 vs Cu-ETP1

Copper Alloy · grade comparison

Copper Alloy C81500 and Cu-ETP1 are both copper alloy grades. C81500 is the stronger of the two: yield strength 275 MPa (39.9 ksi) against 70 MPa (10.2 ksi) for Cu-ETP1, about 3.9 times as much; tensile strength follows at 350 MPa (50.8 ksi) vs 220 MPa (31.9 ksi). In exchange, Cu-ETP1 is the more ductile: elongation 40% versus 17% for C81500, and C81500 is harder (105 HB vs 45 HB). C81500 runs hotter in service (350°C vs 200°C continuous) and Cu-ETP1 conducts heat better (394 W/m·K vs 315 W/m·K). On the shop floor, Cu-ETP1 welds better (50 vs 35 out of 100).

C81500Choose it when strength drives the design, or when the part sees heat.

Cu-ETP1Choose it when the part is bent, formed or impact-loaded, or when it will be welded.

C81500 vs Cu-ETP1: properties

C81500Cu-ETP1

Mechanical

Strength, stiffness, ductility and hardness at room temperature.

Bulk Modulus

138 GPa20 Msi
140 GPa20.3 Msi

Tensile Strength (Ultimate)

350 MPa50.8 ksi
220 MPa31.9 ksi

Yield Strength (0.2% offset)

275 MPa39.9 ksi
70 MPa10.2 ksi

Elongation at Break

17%
40%

Shear Strength

230 MPa33.4 ksi
150 MPa21.8 ksi

Fatigue Strength (Endurance Limit)

125 MPa18.1 ksi
75 MPa10.9 ksi

Hardness, Brinell

105 HB
45 HB

Hardness, Rockwell B

62 HRB
—

Reduction in Area

—
70%

Charpy V-Notch Impact (RT)

—
60 J44.3 ft·lbf

Hardness, Vickers

—
50 HV

Same in both: Elastic (Young's) Modulus 117 GPa17 Msi · Shear Modulus 44 GPa6.4 Msi · Poisson's Ratio 0.34

Physical

Density and transition temperatures.

Density

8.89 g/cm³0.32 lb/in³
8.93 g/cm³0.32 lb/in³

Melting Point (Solidus)

1,075°C1,967 °F
1,065°C1,949 °F

Liquidus Temperature

1,080°C1,976 °F
1,083°C1,981 °F

Thermal

How each material carries heat and how hot it can run.

Thermal Conductivity

315 W/m·K182 BTU/hr·ft·°F
394 W/m·K228 BTU/hr·ft·°F

Specific Heat Capacity

376 J/kg·K0.09 BTU/lb·°F
385 J/kg·K0.09 BTU/lb·°F

Thermal Expansion (CTE, 20–100 °C)

17.6 µm/m·K9.8 µin/in·°F
17 µm/m·K9.4 µin/in·°F

Max Service Temperature (continuous)

350°C662 °F
200°C392 °F

Min Service Temperature

-200°C-328 °F
-250°C-418 °F

Same in both: Latent Heat of Fusion 205 J/g88.1 BTU/lb

Electrical

Conductivity and insulation.

Electrical Conductivity

82 % IACS
101.5 % IACS

Electrical Resistivity

2.1×10⁻⁸ Ω·m0.827 µΩ·in
1.7×10⁻⁸ Ω·m0.669 µΩ·in

Chemical & Environmental

Corrosion and environmental resistance (0–100 scores).

Corrosion Resistance

60 / 100
65 / 100

Same in both: Galvanic Potential (seawater, vs SCE) -0.25 V

Manufacturability

FabDigit workshop ratings (0–100 scores) — how each material behaves on the machine.

Weldability

35 / 100
50 / 100

Formability (cold)

30 / 100
95 / 100

Castability

60 / 100
45 / 100

Brazeability / Solderability

60 / 100
85 / 100

Polishability

60 / 100
80 / 100

Same in both: Machinability 30 / 100 · Machinability Rating (AISI 1212 = 100 %) 20%

Sustainability

Primary-production footprint per kilogram.

Embodied Carbon (primary production)

3.4 kg CO₂/kg
3.6 kg CO₂/kg

Embodied Water

250 L/kg30 gal/lb
350 L/kg41.9 gal/lb

Typical Recycled Content

40%
10%

Same in both: Embodied Energy (primary production) 53 MJ/kg22,786 BTU/lb

Common Calculations

Ratios derived from the values above.

Specific Strength (UTS / density)

39 kN·m/kg
25 kN·m/kg

Specific Stiffness (E / density)

13.2 MN·m/kg
13.1 MN·m/kg

Modulus of Resilience

323 kJ/m³
21 kJ/m³

Thermal Diffusivity

94.2 mm²/s
114.6 mm²/s

Thermal Shock Resistance Index

54
44

Strength versus weight

Yield strength against density for every copper alloy grade in the FabDigit library; the compared grades are highlighted. Up and left is stronger for its weight.

501002005001,0007.588.599.5Density (g/cm³)Yield strength (MPa) — log scaleCu-ETP1C81500

Manufacturing and finishing

CapabilityC81500Cu-ETP1
Default condition——
Relative cost$$$$ High$$$$ High
Min. machined wall——
Best machined surface——

Both take the same 4 finishes: Copper Plating, Electroless Nickel (EN), Gold Plating, Silver Plating.

C81500 vs Cu-ETP1 — frequently asked

Is C81500 stronger than Cu-ETP1?

Yes. C81500 has a typical yield strength of 275 MPa (39.9 ksi) against 70 MPa (10.2 ksi) for Cu-ETP1 — about 3.9 times as much. Tensile strength is 350 MPa (50.8 ksi) vs 220 MPa (31.9 ksi).

Which is cheaper, C81500 or Cu-ETP1?

Both sit in the same relative cost tier ($$$$, high); the part price will be decided by machining time, tolerance and quantity rather than by the material.

Which welds better, C81500 or Cu-ETP1?

Cu-ETP1. Its weldability rates fair (50/100) against fair (35/100) for C81500.

Ready to make it?

Upload a CAD file and FabDigit prices the part in C81500 and Cu-ETP1 side by side — material, machining time, tolerance and finish in one quote. Certified material data ships with the order on request.

Typical handbook values for the conditions named above, normalised for comparison. Hardness on non-Brinell scales is converted approximately for charting only. Request certified data with your order for design-critical properties.